AI Adoption Weekly Briefing

Data as of 2026-09-06 · weekly record run 2026-09-06 (point-in-time database) · 106 current indicators across 7 signal classes
How to read this briefing — the one-minute versionwhat the method is and why it matters (not this week's news)

What this is. A weekly dashboard of about 85 indicators that follow AI demand from the end user back to the silicon wafer: who is using and paying for AI (Penetration), how tight supply is (Supply-Demand), how much hardware is shipping (Downstream: chips and servers, power and optics, data centers), what upstream capacity is being built (Semicon Upstream Supply) and how it is being paid for (Funding). Each indicator aggregates company, customs, price and survey series recorded weekly in an append-only database.

Why it matters. AI capex is the largest investment cycle in technology today, and single data points (one earnings print, one customs month) are noisy and often contradictory. Reading many links of the chain together shows where the cycle is accelerating or stalling, whether a move is confirmed by related links, and which bottleneck (power, memory, packaging, funding) binds next — months before it shows in consolidated earnings.

How to read it in one minute.

  1. Takeaways first — each one compares indicators across classes and names the next data point that would confirm or refute it.
  2. Bubble charts (one per class): X = latest change, Y = the indicator's own average change over the past year. Blue zone (right of the dashed diagonal) = accelerating vs its own norm; orange zone (left) = decelerating. Bubble size = share of the global total covered; colour = Grade (how much to trust it). Orange dashed rings = deep-dives. Grey dashed bubbles = one-off or basis change with no comparable figure — shown, but ignored.
  3. Grade (1–5) = importance, signal-to-noise and source reliability combined. Grade 1–2 is context only.
  4. Changes are like-for-like. Every change is checked for definition, member and unit changes; lumpy or event-driven series are compared as rolling windows (e.g. last 3 months vs the 3 before), widened automatically when a series keeps swinging.
  5. Market view: CIQ consensus shows where the street expects capex and supplier revenue to go and how that path is being revised; the stock heatmap shows how the market is pricing each link of the chain.
  6. Click anything — a bubble, a table cell, a name — for the indicator card: (A) definition and formula, (B) grading, (C) charts and numbers.
Methodology and definitionsaggregation, rolling windows, basis and direction checks, Grade / SNR / Scope

The briefing reads 106 aggregated indicators of AI adoption and its supply chain. Each indicator is built bottom-up from raw company, customs, price and survey series recorded weekly in an append-only database (no values are ever overwritten). Indicators are grouped into seven signal classes: Penetration (is AI being used and paid for), Supply-Demand (tightness and pricing), three Downstream-hardware classes (Semi & ODM; Peripherals — power and optics; Data Center), Semicon Upstream Supply (equipment, parts and fab capex — the capacity that arrives 2–4 quarters out) and Funding (capex, cash flow, debt, private funding).

TagMeaningScale
GradeOverall trust in the indicator as an AI signal: 0.4 × importance + 0.3 × SNR + 0.3 × reliability (Penetration and Funding: 0.5 × SNR + 0.5 × reliability), −0.5 if scope < 10%, capped at the weaker of SNR / reliability + 1. Thresholds: ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2.1–5; 1–2 shown grey and not discussed in the main text
ImportanceHow directly the series reads AI demand or supply (5 = the AI spend or AI product itself).1–5
SNRSignal-to-noise: how much of a typical move reflects AI demand/supply rather than seasonality, FX, one-off deals, disclosure timing or non-AI business in the same line item.1 (mostly noise) – 5 (clean)
ReliabilitySource quality: audited filings and official statistics score high; media-reported or estimated figures score low.1–5
ScopeShare of the global total of that link in the chain that the indicator covers. Drives bubble size.% of global

Data as of 2026-09-06. Database and indicator definitions: AI_Adoption_Tracking/ai-adoption-db-refresh (readings_log.csv, registry/); page: AI_Adoption_Tracking/ai-adoption-weekly-output. Bubble charts use a symmetric-log axis so that +150% and +5% moves are both readable; exact values are in the hover and click panels.

One-minute takeaways

Compared with the database as it stood on 2026-08-30: XXX indicators with a new or revised reading (XXX Grade 3–5).

ΔWhat changed in the database since 2026-08-30XXX indicators · then vs now

XXX of 106 current indicators have a new or revised latest reading since the database on 2026-08-30 (XXX Grade 3–5). Change = latest change of the indicator (vs its own prior period / window) as the database showed it then and now; click a row for its card.

IndicatorDatabase on 2026-08-30Database on 2026-09-06
AI-Server Rails + BMCSemi & ODM · G5 · Revised+37.7%Jul-26 · $125mn+36.7%Jul-26 · $125mn
DRAM Contract GuidanceSupply-Demand · G4 · New reading−32.0ppMar-26 · 60.5%+0.0ppJun-26 · 60.5%
N. America DC Under Constr.Data Center · G4 · New reading−5.6%2025 · 5,994+24.8%2026 · 7,481
N. America DC VacancySupply-Demand · G4 · New reading−26.3%2025 · 1.40%+0.0%2026 · 1.40%
Global Equipment BillingsSemicon Upstream · G4 · New reading+0.8%1Q26 · $36.5bn+10.9%2Q26 · $40.5bn
US Transformer ImportsPeripherals · G4 · New reading+3.0%Jun-26 · $2.1bn+11.5%Jul-26 · $2.3bn
Neocloud Equity BasketFunding · G4 · New reading+6.9%23 Aug · 161+11.4%30 Aug · 162
US Server ImportsSemi & ODM · G4 · New reading+15.0%Jun-26 · $75.8bn+18.4%Jul-26 · $84.1bn
US DC ConstructionData Center · G4 · New reading+7.7%Jun-26 · $70.8bn+6.2%Jul-26 · $75.2bn
AI Hyperscaler Bond IssuanceFunding · G3 · New reading+68.6%Jul-26 · $139bn−6.5%Aug-26 · $119bn
AI-Infra Debt IssuanceFunding · G3 · New reading−59.7%23 Aug · $41.9bn−18.9%30 Aug · $46.3bn
LLM SDK npm downloadsPenetration · G3 · New reading+2.9%23 Aug · 68,420,507 downloads/wk+14.6%30 Aug · 78,428,275 downloads/wk
BBB credit spreadFunding · G3 · New reading+4.3%Jul-26 · 97.00 bp+1.0%Aug-26 · 98.00 bp
US fab constructionSemicon Upstream · G3 · New reading−4.3%Jun-26 · $52.4bn−2.1%Jul-26 · $51.3bn
High-yield spreadFunding · G3 · New reading+0.4%Jul-26 · 274 bp−1.5%Aug-26 · 270 bp
CCC spreadFunding · G3 · New reading+3.3%Jul-26 · 983 bp+4.4%Aug-26 · 1,026 bp
Copper PriceSemicon Upstream · G3 · New reading+0.3%Jun-26 · $13,552.04−0.1%Jul-26 · $13,542.82
AI framework npm downloadsPenetration · G3 · New reading+5.4%23 Aug · 25,287,117 downloads/wk+5.5%30 Aug · 26,686,463 downloads/wk
2 Grade 1–2 indicatorslow signal
IndicatorDatabase on 2026-08-30Database on 2026-09-06
OpenRouter TokensPenetration · G2 · New reading+23.9%23 Aug · 93T+21.0%30 Aug · 113T
US hosting jobs (BLS)Data Center · G2 · New reading+0.2%Jul-26 · 461 thousands−1.7%Aug-26 · 453 thousands
→Next prints (21 days, Grade 3–5)when the picture can change next
Next printIndicator
Thu 10 SepChina CACChina GenAI FilingsPenetration · G5
Thu 10 SepTSMC, TSMC HPC Platform RevenueTSMC HPC RevenueSemi & ODM · G5
Thu 10 SepASPEED, King SlideAI-Server Rails + BMCSemi & ODM · G5
Thu 10 SepAcctonAccton Switch RevenuePeripherals · G4
Thu 10 SepAsia Vital Components, AurasTW Power & Cooling Rev.Peripherals · G4
Thu 10 SepAll Ring Tech, C SunTW Packaging Tool RevenueSemicon Upstream · G4
Thu 10 SepFoxsemicon, Gudeng PrecisionTW Tool Parts RevenueSemicon Upstream · G4
Thu 10 SepITEQTW CCL Makers RevenueSemicon Upstream · G4
Thu 10 Sep~10 Sep 26TW ABF Substrate RevenueSemicon Upstream · G4
Thu 10 SepAlchip, Global UnichipTW ASIC Design RevenueSemi & ODM · G3
Indicator summaryTables 1–2 and bubble charts, weekly / monthly view

20 indicators in the weekly view. Each cell = share of that signal class (count). Click a cell to list its indicators.

Table 1 — Size of the latest change, by signal class

PenetrationSupply-DemandSemi & ODMPeripheralsData CenterSemicon UpstreamFundingAll
≤ −10%······17% (1)5% (1)
−10% to −3%······17% (1)5% (1)
Flat (±3%)·100% (2)··33% (1)67% (2)33% (2)35% (7)
+3% to +20%67% (2)·50% (1)100% (1)33% (1)33% (1)33% (2)40% (8)
≥ +20%33% (1)·50% (1)·33% (1)··15% (3)
Indicators (#)322133620

Table 2 — Momentum, by signal class

PenetrationSupply-DemandSemi & ODMPeripheralsData CenterSemicon UpstreamFundingAll
Accelerating67% (2)·100% (2)100% (1)·33% (1)17% (1)35% (7)
Rising (slower)33% (1)···33% (1)··10% (2)
Turned up····33% (1)·17% (1)10% (2)
Flat·100% (2)··33% (1)67% (2)33% (2)35% (7)
Turned down······17% (1)5% (1)
Falling (narrowing)······17% (1)5% (1)
Falling faster········
Indicators (#)322133620

Figure 3 — Latest change vs its own 1-yr average, one chart per signal class

Grade 1–2Grade 3Grade 4Grade 5Bubble size = scope (share of global total)Deep-diveOne-off / basis change (not comparable)Accelerating zoneDecelerating zoneClick a bubble for its card

Penetration

ACCELERATING →← DECELERATING-5%-5%0%0%+5%+5%+10%+10%+20%+20%+30%+30%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: w/w) — symmetric log scaleAverage change per period, past yearOpenRouter TokensLLM SDK npm downloadsAI framework npm downloads
  • Builders move faster than firms. LLM SDK downloads (+15%) grow several times faster than firm-level adoption (Ramp +1.4%), so usage per adopter is the growth engine.
  • Enterprise money is visible. Cloud AI revenue was revised up to +17%, and Microsoft's first Azure disclosure ($101.9bn, +40%) adds a hard datapoint for the next print.
  • Token data lag reality. The US token aggregate slowed to +19% only because OpenAI's leg had no update; Google's own run-rate grew 37%.

Supply-Demand

ACCELERATING →← DECELERATING-5%-5%0%0%+5%+5%+10%+10%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: w/w) — symmetric log scaleAverage change per period, past yearDRAM Contract Guidance (pp)
  • Memory tightness is inventory-led, not just price-led. SK hynix inventory days fell to 123 while revenue rose 55%: makers are selling from stock.
  • Capacity is spoken for. 1.4% North American vacancy and a $1.24tn compute backlog mean new MW are sold before completion.
  • Power costs creep, not spike. Grid-equipment PPI +2.8% and electricity prices flat (−0.5%): pricing pressure sits in hardware, not in power bills yet.

Downstream HW: Semi & ODM

ACCELERATING →← DECELERATING-5%-5%0%0%+5%+5%+10%+10%+20%+20%+30%+30%+50%+50%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: w/w) — symmetric log scaleAverage change per period, past yearAI-Server Rails + BMCUS Server Imports
  • Custom silicon is the fastest-growing chip leg. Taiwan ASIC design revenue (+83%) outgrows TSMC HPC (+25%), and Broadcom's $115bn 2027 guide says the trend extends.
  • Assembly is the bottleneck in the data, not demand. ODM revenue slowed to +12% while chip and rail/BMC inputs accelerated; Dell and Foxconn point to a pickup in the August-September prints.

Downstream HW: Peripherals (power, optics)

ACCELERATING →← DECELERATING-5%-5%0%0%+5%+5%+10%+10%+20%+20%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: w/w) — symmetric log scaleAverage change per period, past yearUS Transformer Imports
  • Networking outruns compute. Accton switches (+41%) and DC networking (+32%) grow faster than ODM assembly (+12%): scale-out spending rises per rack.
  • Power gear is capacity-limited. Power-generation equipment +14% and transformer imports +12%, but turbine backlog of 116 GW against 20 GW a year of output caps how fast it can grow.

Downstream HW: Data Center

ACCELERATING →← DECELERATING-5%-5%0%0%+5%+5%+10%+10%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: w/w) — symmetric log scaleAverage change per period, past yearUS DC ConstructionUS hosting jobs (BLS)
  • Building and leasing diverge. Construction rises (+25% MW, +6% spending) while colocation bookings fell 4% QoQ: hyperscalers and labs build or contract directly.
  • Big contracts now come from labs. Anthropic's $35bn, 350 MW Lambda deal is the kind of commitment the capacity trackers will only register when the site is energised.

Semicon Upstream Supply

ACCELERATING →← DECELERATING-10%-10%-5%-5%0%0%+5%+5%+10%+10%+20%+20%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: w/w) — symmetric log scaleAverage change per period, past yearGlobal Equipment BillingsUS fab constructionCopper Price
  • Board materials are the tightest upstream link. CCL revenue +42% with inventory days down 7%, and TSMC itself named ABF substrate as the binding constraint.
  • Fab spending runs ahead of tool shipments. Fab capex +38% versus tool exports −6.5%: clean rooms are ready first, so tool deliveries should catch up in coming prints.
  • New fabs are not the driver. US fab construction is still falling (−2%), so upstream growth comes from equipping existing shells for 2nm, CoWoS and HBM.

Funding

ACCELERATING →← DECELERATING-20%-20%-10%-10%-5%-5%0%0%+5%+5%+10%+10%+20%+20%+30%+30%+50%+50%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: w/w) — symmetric log scaleAverage change per period, past yearAI-Infra Debt IssuanceNeocloud Equity BasketAI Hyperscaler Bond IssuanceBBB credit spreadHigh-yield spreadCCC spread
  • Free cash flow is now negative. Group FCF of −$7.3bn, led by Alphabet and Meta, means each extra capex dollar needs outside funding.
  • Equity and vendor money replace bonds at the margin. Bond issuance fell 6.5% while NVIDIA stakes (+18%) and neocloud equity grew; Nvidia's SB Energy and MediaTek stakes extend supplier financing of demand.
  • Credit is open at the top but fraying at the bottom. Banks eased business and construction-loan standards in Q2 and BBB and high-yield spreads are flat, but the CCC spread widened 4.4% in August, where stress shows first.

106 indicators in the monthly view. Each cell = share of that signal class (count). Click a cell to list its indicators.

Table 1 — Size of the latest change, by signal class

PenetrationSupply-DemandSemi & ODMPeripheralsData CenterSemicon UpstreamFundingAll
≤ −10%6% (1)···8% (1)·12% (2)4% (4)
−10% to −3%·6% (1)··8% (1)15% (3)18% (3)8% (8)
Flat (±3%)6% (1)44% (7)14% (2)9% (1)17% (2)20% (4)12% (2)18% (19)
+3% to +20%50% (8)25% (4)36% (5)45% (5)42% (5)40% (8)35% (6)39% (41)
≥ +20%38% (6)25% (4)50% (7)45% (5)25% (3)25% (5)24% (4)32% (34)
Indicators (#)16161411122017106

Table 2 — Momentum, by signal class

PenetrationSupply-DemandSemi & ODMPeripheralsData CenterSemicon UpstreamFundingAll
Accelerating44% (7)6% (1)50% (7)64% (7)17% (2)50% (10)18% (3)35% (37)
Rising (slower)44% (7)38% (6)29% (4)9% (1)42% (5)·35% (6)27% (29)
Turned up·6% (1)7% (1)18% (2)8% (1)15% (3)6% (1)8% (9)
Flat6% (1)44% (7)14% (2)9% (1)17% (2)20% (4)12% (2)18% (19)
Turned down6% (1)6% (1)··17% (2)5% (1)12% (2)7% (7)
Falling (narrowing)······6% (1)1% (1)
Falling faster·····10% (2)12% (2)4% (4)
Indicators (#)16161411122017106

Figure 3 — Latest change vs its own 1-yr average, one chart per signal class

Grade 1–2Grade 3Grade 4Grade 5Bubble size = scope (share of global total)Deep-diveOne-off / basis change (not comparable)Accelerating zoneDecelerating zoneClick a bubble for its card

Penetration

ACCELERATING →← DECELERATING-20%-20%-10%-10%-5%-5%0%0%+5%+5%+10%+10%+20%+20%+50%+50%+100%+100%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: last 4 wks vs prior 4 wks) — symmetric log scaleAverage change per period, past yearOpenRouter TokensUS Disclosed TokensUS Firm AI Use (BTOS)US Worker GenAI UseChina GenAI FilingsCloud AI RevenueMETR time horizonClaude co-authored commitsUS firms paying for AI (Ramp)UK firms using AI (ONS)Palantir commercial revLLM SDK npm downloadsAI framework npm downloads
  • Builders move faster than firms. LLM SDK downloads (+15%) grow several times faster than firm-level adoption (Ramp +1.4%), so usage per adopter is the growth engine.
  • Enterprise money is visible. Cloud AI revenue was revised up to +17%, and Microsoft's first Azure disclosure ($101.9bn, +40%) adds a hard datapoint for the next print.
  • Token data lag reality. The US token aggregate slowed to +19% only because OpenAI's leg had no update; Google's own run-rate grew 37%.

Supply-Demand

ACCELERATING →← DECELERATING-10%-10%-5%-5%0%0%+5%+5%+10%+10%+20%+20%+30%+30%+50%+50%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: last 4 wks vs prior 4 wks) — symmetric log scaleAverage change per period, past yearAI Compute BacklogDRAM Contract Guidance (pp)Grid Equipment PPIStorage Device PPITW Memory Module RevenueNVIDIA Supply CommitmentsSK hynix Inventory DaysMicron Inventory DaysSamsung Inventory DaysUS PPI hostingCooling backlog (TT+JCI)US PPI semiconductorsUS electricity price
  • Memory tightness is inventory-led, not just price-led. SK hynix inventory days fell to 123 while revenue rose 55%: makers are selling from stock.
  • Capacity is spoken for. 1.4% North American vacancy and a $1.24tn compute backlog mean new MW are sold before completion.
  • Power costs creep, not spike. Grid-equipment PPI +2.8% and electricity prices flat (−0.5%): pricing pressure sits in hardware, not in power bills yet.

Downstream HW: Semi & ODM

ACCELERATING →← DECELERATING-5%-5%0%0%+5%+5%+10%+10%+20%+20%+50%+50%+100%+100%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: last 4 wks vs prior 4 wks) — symmetric log scaleAverage change per period, past yearGPU/XPU Vendor RevenueTSMC HPC RevenueTW ASIC Design RevenueTW Electronics OrdersAI Chip ShipmentsT-Glass Cloth RevenueMemory Maker RevenueKorea Chip Exports (10-day)TW AI-Server ODM RevenueAI-Server Rails + BMCTW ICT Export OrdersUS Server ImportsTW memory maker revUS semi output (IP)
  • Custom silicon is the fastest-growing chip leg. Taiwan ASIC design revenue (+83%) outgrows TSMC HPC (+25%), and Broadcom's $115bn 2027 guide says the trend extends.
  • Assembly is the bottleneck in the data, not demand. ODM revenue slowed to +12% while chip and rail/BMC inputs accelerated; Dell and Foxconn point to a pickup in the August-September prints.

Downstream HW: Peripherals (power, optics)

ACCELERATING →← DECELERATING-5%-5%0%0%+5%+5%+10%+10%+20%+20%+30%+30%+50%+50%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: last 4 wks vs prior 4 wks) — symmetric log scaleAverage change per period, past yearOptical Module RevenueDC Networking RevenueAccton Switch RevenueTW Power & Cooling Rev.US Transformer ImportsPower-Gen Equipment Rev.AI connectivity revenueTW optical parts revTW cable & connector revTW chassis & rack revTW server-interface chip rev
  • Networking outruns compute. Accton switches (+41%) and DC networking (+32%) grow faster than ODM assembly (+12%): scale-out spending rises per rack.
  • Power gear is capacity-limited. Power-generation equipment +14% and transformer imports +12%, but turbine backlog of 116 GW against 20 GW a year of output caps how fast it can grow.

Downstream HW: Data Center

ACCELERATING →← DECELERATING-80%-80%-50%-50%-20%-20%-10%-10%0%0%+5%+5%+10%+10%+20%+20%+50%+50%+100%+100%+200%+200%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: last 4 wks vs prior 4 wks) — symmetric log scaleAverage change per period, past yearUS DC ConstructionUtility Contracted DC LoadERCOT Large-Load ApprovalsMicrosoft New DC LeasesVirginia Commercial Power (YoY)Colo Bookings (DLR+EQIX)Colo MW Leased (IRM+APLD)VNET committed MWUS DC projects blockedUS hosting jobs (BLS)Frontier DC Capacity · one-offGDS China Area Committed · one-off
  • Building and leasing diverge. Construction rises (+25% MW, +6% spending) while colocation bookings fell 4% QoQ: hyperscalers and labs build or contract directly.
  • Big contracts now come from labs. Anthropic's $35bn, 350 MW Lambda deal is the kind of commitment the capacity trackers will only register when the site is energised.

Semicon Upstream Supply

ACCELERATING →← DECELERATING-10%-10%-5%-5%0%0%+5%+5%+10%+10%+20%+20%+30%+30%+50%+50%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: last 4 wks vs prior 4 wks) — symmetric log scaleAverage change per period, past yearFront-End WFE RevenueJapan Equipment BillingsGlobal Equipment BillingsTW Packaging Tool RevenuePackaging & Test Tool Rev.Tool Sub-Supplier RevenueTW Tool Parts RevenueTool Exports (NL+JP+US)Tool Shipments → TaiwanFoundry & Memory CapexSi wafer area (MSI)US fab constructionTW CCL Makers RevenueTW ABF Substrate RevenueTW MLCC Makers RevenueAI PCB & Inputs RevenueMLCC Inventory DaysCCL & Substrate Inv. DaysCopper PriceUS PPI Bare PCBs
  • Board materials are the tightest upstream link. CCL revenue +42% with inventory days down 7%, and TSMC itself named ABF substrate as the binding constraint.
  • Fab spending runs ahead of tool shipments. Fab capex +38% versus tool exports −6.5%: clean rooms are ready first, so tool deliveries should catch up in coming prints.
  • New fabs are not the driver. US fab construction is still falling (−2%), so upstream growth comes from equipping existing shells for 2nm, CoWoS and HBM.

Funding

ACCELERATING →← DECELERATING-50%-50%-30%-30%-20%-20%-10%-10%0%0%+5%+5%+10%+10%+20%+20%+50%+50%+100%+100%+200%+200%Dashed diagonal: latest change = 1-yr average · right of it = moving faster than usualLatest change vs prior period (weekly series: last 4 wks vs prior 4 wks) — symmetric log scaleAverage change per period, past yearHyperscaler CapexHyperscaler Free Cash FlowHyperscaler Total DebtSigned Leases Not StartedAI-Infra Debt IssuanceNeocloud Equity BasketAI Hyperscaler Bond IssuanceAI Venture FundingCapex ÷ operating cashNVIDIA strategic stakesNeocloud equity raisedBBB credit spreadHigh-yield spreadUS IT equipment investmentBank C&I lending standards (pp)Bank construction-loan standards (pp)CCC spread
  • Free cash flow is now negative. Group FCF of −$7.3bn, led by Alphabet and Meta, means each extra capex dollar needs outside funding.
  • Equity and vendor money replace bonds at the margin. Bond issuance fell 6.5% while NVIDIA stakes (+18%) and neocloud equity grew; Nvidia's SB Energy and MediaTek stakes extend supplier financing of demand.
  • Credit is open at the top but fraying at the bottom. Banks eased business and construction-loan standards in Q2 and BBB and high-yield spreads are flat, but the CCC spread widened 4.4% in August, where stress shows first.
AI major news this week
2026-09-06▲ AcceleratingBusinessAnthropic compute commitments reach $517B, 14.8GW
What happened
  • The Information estimates Anthropic has signed compute agreements totalling up to $517 billion and at least 14.8 gigawatts since October, on top of 1-2 GW secured earlier.
  • Deals with SpaceX, Google and neoclouds were made to meet unexpected Claude Code and Cowork demand, pulling forward chip, power and data-centre orders ahead of a possible record IPO.
Position in the value chain
Models & AI apps (Demand) + Data centres & colo (Infrastructure)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 4importance · scope · reliability
Importance5 / 5Frontier lab pre-commits record capacity, pulling forward upstream orders
Scope4 / 514.8GW is a large share of announced AI capacity
Reliability3 / 5The Information estimate from public statements and one source
Calculation4.1 → Grade 40.4 × 5 + 0.3 × 4 + 0.3 × 3; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • AI Compute Backlog: before the event +13.9% (2Q26) → no print since (next 27 Oct 26). Larger signed lab commitments lift cloud/neocloud backlog; direction up, shows in next quarterly backlog prints.
  • Signed Leases Not Started: before the event +34.2% (2Q26) → no print since (next 28 Oct 26). Multi-GW commitments imply more leases signed but not started; direction up, next quarterly filings.
  • Frontier DC Capacity: before the event +3.9% (Jul-26) → no print since (next 24 Sep 26). Capacity pledges convert to frontier DC MW additions; direction up over coming months.
2026-09-01▲ AcceleratingBusinessSB Energy files US IPO for 10GW Ohio AI campus
What happened
  • SoftBank's SB Energy filed for a Nasdaq IPO seeking $5-7 billion to fund a 10-gigawatt Ohio data-centre project that OpenAI has leased.
  • Nvidia commits $3 billion, OpenAI invested $500 million and received warrants valued near $5.5 billion, showing suppliers financing demand to lock in capacity.
Position in the value chain
Data centres & colo (Infrastructure) + Capital & funding (Cross-cutting)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 4importance · scope · reliability
Importance4 / 5Largest announced campus funded via public equity and vendor financing
Scope4 / 510GW is comparable to multiple hyperscaler regions
Reliability4 / 5WSJ with filing details, corroborated by Yahoo and Quartz
Calculation4.0 → Grade 40.4 × 4 + 0.3 × 4 + 0.3 × 4; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • Frontier DC Capacity: before the event +3.9% (Jul-26) → no print since (next 24 Sep 26). A 10GW pipeline adds frontier DC capacity; direction up, visible in monthly capacity trackers over 2027.
  • NVIDIA strategic stakes: before the event +18.0% (2Q26) → no print since (next 19 Nov 26). Nvidia's $3B stake adds to strategic investments; direction up, next NVIDIA 10-Q.
  • Utility Contracted DC Load: before the event +6.2% (2Q26) → no print since (next 29 Oct 26). Ohio load contracts rise if the campus proceeds; direction up, utility filings next quarter.

Not yet captured by an indicator: Vendor-financed lease guarantees and warrants for AI capacity are not tracked by any indicator.

2026-08-31▲ AcceleratingBusinessNvidia invests $3.5B in MediaTek via convertible bonds
What happened
  • Nvidia will invest $3.5 billion in MediaTek, reported as convertible bonds, while MediaTek priced $3.9 billion of CBs at a TWD 4,513.75 conversion price.
  • The deal deepens NVLink collaboration on custom AI chips and PC silicon, widening Nvidia's reach into the ASIC supply chain and funding MediaTek's capacity push.
Position in the value chain
AI chips & ASIC (Silicon) + Capital & funding (Cross-cutting)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 4importance · scope · reliability
Importance4 / 5Nvidia financing a rival custom-chip designer's expansion
Scope3 / 5MediaTek is a top ASIC and SoC designer in Taiwan
Reliability4 / 5Reuters plus company announcement and pricing reports
Calculation3.7 → Grade 40.4 × 4 + 0.3 × 3 + 0.3 × 4; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • NVIDIA strategic stakes: before the event +18.0% (2Q26) → no print since (next 19 Nov 26). Adds a $3.5B strategic stake; direction up, next NVIDIA quarterly filing.
  • TW ASIC Design Revenue: before the event +82.6% (Jul-26) → no print since (next 10 Sep 26). Funding and NVLink access should lift MediaTek ASIC revenue; direction up, Taiwan monthly revenue later.
2026-09-03▲ AcceleratingBusinessNscale contracted revenue doubles to $103B on Anthropic deal
What happened
  • Nscale told IPO investors its contracted revenue reached about $103 billion after a $45 billion Anthropic computing deal, versus $51 billion before.
  • Contracts average 5.7 years, implying roughly $18 billion a year versus CoreWeave's 2026 guide above $12 billion; Q2 revenue topped $100 million from $37 million.
Position in the value chain
Cloud & neoclouds (Infrastructure) + Capital & funding (Cross-cutting)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 3importance · scope · reliability
Importance4 / 5Major neocloud doubles backlog and prepares IPO within weeks
Scope3 / 5One neocloud, but backlog equals multiples of CoreWeave revenue
Reliability3 / 5Investor documents seen by The Information, described as illustrative
Calculation3.4 → Grade 30.4 × 4 + 0.3 × 3 + 0.3 × 3; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • AI Compute Backlog: before the event +13.9% (2Q26) → no print since (next 27 Oct 26). Neocloud backlog doubling lifts aggregate AI compute backlog; direction up, next quarterly prints.
  • Neocloud equity raised: before the event +346.6% (2Q26) → no print since (next 19 Nov 26). A September IPO would add neocloud equity raised; direction up, shows in Q3 data.
2026-08-31▲ AcceleratingCostSLB buys cooling maker Kelvion for $4.1B
What happened
  • SLB agreed to acquire data-centre cooling company Kelvion for $4.1 billion, moving an oilfield-services major into thermal infrastructure for AI facilities.
  • The price signals expected multi-year cooling demand growth as rack densities rise, and consolidation of thermal suppliers serving hyperscalers.
Position in the value chain
Power, grid & cooling (Systems) + Data centres & colo (Infrastructure)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 3importance · scope · reliability
Importance3 / 5Large cross-industry acquisition, but no capacity or order change
Scope2 / 5Cooling is a sub-segment of DC capex
Reliability5 / 5Company release confirmed by WSJ and Reuters
Calculation3.3 → Grade 30.4 × 3 + 0.3 × 2 + 0.3 × 5; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • Cooling backlog (TT+JCI): before the event +8.8% (2Q26) → no print since (next 29 Oct 26). Strong strategic demand for cooling supports backlog growth at TT and JCI; direction up, next quarterly prints.
  • TW Power & Cooling Rev.: before the event +1.8% (Jul-26) → no print since (next 10 Sep 26). Thermal demand lifts Taiwan cooling revenue; direction up, monthly sales.
2026-09-03▲ AcceleratingApplicationNvidia agrees to buy Hugging Face for $12.9B
What happened
  • Nvidia announced it will acquire Hugging Face, with the New York Times reporting a $12.9 billion price, extending its run of large strategic investments.
  • Owning the main open-model hub ties developers' model distribution to Nvidia's software stack, a defensive move to protect demand for its accelerators.
Position in the value chain
Models & AI apps (Demand) + Enterprise & consumer use (Demand)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 3importance · scope · reliability
Importance3 / 5Strategic M&A by top chip vendor, limited direct demand signal
Scope3 / 5Hugging Face is the dominant open-model platform
Reliability4 / 5Nvidia blog announcement plus NYT and CNBC
Calculation3.3 → Grade 30.4 × 3 + 0.3 × 3 + 0.3 × 4; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • NVIDIA strategic stakes: before the event +18.0% (2Q26) → no print since (next 19 Nov 26). Adds to Nvidia's strategic deployment of cash; direction up, next quarterly filing.

Not yet captured by an indicator: Open-model hub usage and developer platform control are not tracked.

2026-08-31▲ AcceleratingBusinessCXMT starts small-volume HBM3E production
What happened
  • CXMT began producing HBM3E in small quantities, one generation behind Samsung, SK hynix and Micron, with significant volume expansion planned for 2027.
  • It also claimed LPDDR6 mass production; domestic HBM eases China's AI chip constraint and adds a new supplier to a memory market tight through 2027.
Position in the value chain
Memory & storage (Silicon) + AI chips & ASIC (Silicon)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 3importance · scope · reliability
Importance3 / 5New HBM supplier, but volumes small and a generation behind
Scope3 / 5CXMT is a large Chinese DRAM maker, small share of global HBM
Reliability3 / 5The Information via Reuters; company claims on LPDDR6
Calculation3.0 → Grade 30.4 × 3 + 0.3 × 3 + 0.3 × 3; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • DRAM Contract Guidance: before the event +0.0pp (Jun-26) → no print since (next 30 Sep 26). Added Chinese supply could soften DRAM pricing at the margin from 2027; direction slightly down, monthly contract data.
  • Memory Maker Revenue: before the event +55.4% (2Q26) → no print since (next 30 Sep 26). China memory output lifts CXMT revenue while incumbents' HBM share may erode; quarterly.
2026-08-31▲ AcceleratingCostSpaceX casts turbine blades in-house for DC power
What happened
  • Musk confirmed SpaceX is casting gas-turbine vanes and blades itself, claiming up to 18 months faster turbine delivery for AI data-centre power.
  • Turbine component shortages are a binding constraint for gas-fired campuses; vertical integration by a large AI builder may ease supply but is an unverified claim.
Position in the value chain
Power, grid & cooling (Systems) + Data centres & colo (Infrastructure)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 2importance · scope · reliability
Importance3 / 5Targets the power-equipment bottleneck, claim unverified
Scope3 / 5One builder, but turbine lead times are an industry limit
Reliability2 / 5CEO claim relayed by media, no independent check
Calculation2.7 → Grade 20.4 × 3 + 0.3 × 3 + 0.3 × 2; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • Power-Gen Equipment Rev.: before the event +14.2% (2Q26) → no print since (next 21 Oct 26). Turbine demand remains strong while OEMs face a new competitor; ambiguous direction, next quarterly GE Vernova prints.
  • Power Equip. Backlog: before the event +24.9% (4Q25) → no print since (next 21 Oct 26). Backlog stays elevated until in-house output scales; direction flat to up, quarterly.
2026-09-01◆ MixedBusinessSpaceX replaces data-centre leaders after reliability lapses
What happened
  • Musk replaced several SpaceX data-centre leaders with rocket and satellite-internet executives after Tennessee and Mississippi sites ran months without backup cooling and power.
  • SpaceXAI reported $2.6 billion Q2 AI revenue from compute rentals, so demand is strong while the aggressive build-out is straining execution quality.
Position in the value chain
Data centres & colo (Infrastructure)
MaterialsEquipmentFoundryMemoryAI chipsNetworkServersPowerDCsCloudModelsAdoptionCapital
Assessment
Grade 2importance · scope · reliability
Importance3 / 5Execution risk at a fast-scaling compute provider
Scope2 / 5One private operator with $2.6B quarterly AI revenue
Reliability3 / 5The Information report, echoed by secondary outlets
Calculation2.7 → Grade 20.4 × 3 + 0.3 × 2 + 0.3 × 3; ≥4.4 → 5, ≥3.7 → 4, ≥3.0 → 3, ≥2.3 → 2; capped at min(Scope, Reliability) + 1
Related indicator recent changes
  • Frontier DC Capacity: before the event +3.9% (Jul-26) → no print since (next 24 Sep 26). Reliability fixes could delay SpaceX MW energisation; direction slightly down, monthly capacity tracker.

Not yet captured by an indicator: Operational delays and outage risk at new AI campuses are not captured by any indicator.

AI stock-price heatmaphow the market prices each link of the chain — vs last week, month, quarter and YTD

Equal-weighted average price change (local currency, adjusted close) of the listed companies in each link, from semiconductor equipment (left) to AI software (right); latest close 2026-09-04 (each stock's own last close on or before 2026-09-06). Blue = up, orange = down; colour intensity is scaled to the horizon. Click a cell for its stocks.

AI value chain: upstream → downstream (equal-weighted basket, local-currency price change)Benchmarks
Semi equipment
7 stocks
Foundry & packaging
4 stocks
Memory
4 stocks
AI chips
5 stocks
Networking & optics
9 stocks
Servers & ODM
7 stocks
Power & cooling
7 stocks
Data centers & neoclouds
7 stocks
Hyperscalers
5 stocks
AI software & apps
7 stocks
S&P 500SOX (semis)Nasdaq
vs last week−0.7%−0.2%+6.3%+3.9%−3.6%+7.0%+1.0%+6.4%+0.8%−3.2%+0.1%+2.3%+0.4%
vs last month−5.1%+0.1%+11.3%+1.2%−8.5%+9.9%−2.2%−1.0%+1.1%+3.7%−0.1%−2.3%+0.5%
vs last quarter−1.6%−5.6%−3.4%−0.8%−8.4%+8.0%−9.9%−10.1%−0.8%+12.9%+4.5%−4.0%+3.1%
YTD (vs 31-Dec)+63.6%+52.6%+289.2%+106.1%+57.3%+74.2%+43.1%+46.4%+0.0%+3.2%+12.8%+65.7%+14.0%

Read: Equities partly caught up with fundamentals this week (servers +7%, data centres +6%, memory +6%), but networking (−3.6% week, −8.5% month) and equipment (−5% month) fell even though switch revenue (+41%) and equipment billings (+11%) are among the strongest prints; over the quarter only AI software (+13%) and servers (+8%) rose.

Low-signal moves and basis changesgrey indicators, held-back readings, definition changes

Grade 1–2 indicators (grey bubbles) are not discussed in the main text. Below: what moved, the likely reason, and why the move is probably noise; then higher-grade readings held back, and the definition (basis) changes found in the pre-publication check.

IndicatorGradeWhat movedLikely reasonWhy it is probably noise
OpenRouter Tokens2+21% to 113tn tokens a week (30 Aug); 1-yr average +8%.Promotional and free-model traffic swings on a single aggregator.One routing platform's mix, not paid enterprise demand; weekly series is volatile.
Tool Shipments → Taiwan2Tool shipments to Taiwan +38% to $2.86bn (Jun).A few high-value lithography tools landing in the same months.Lumpy single-tool deliveries drive the move; equipment vendor revenue is the cleaner read.
Samsung Inventory Days2Samsung inventory days +22% QoQ to 125 (2Q26).Group inventory includes phones, displays and foundry, which can build stock while memory runs lean.Samsung does not split memory inventory, so the series mixes non-AI businesses.
Colo MW Leased (IRM+APLD)2Iron Mountain + Applied Digital MW leased +56% to 635 MW (2Q26).One or two large campus leases land in a single quarter.Two operators with lumpy deals; a small slice of global leasing.
GDS China Area Committed2GDS China net area committed 114,696 sqm (2Q26); % change not meaningful.Net figures follow ABS (1Q25) and C-REIT (3Q25) deconsolidations, leaving a near-zero prior base.Percentage change on a near-zero, deconsolidation-distorted base; gross commitments are not disclosed.
NEXTDC Contracted MW2NEXTDC contracted MW +78% to 740 MW (1H26).Half-yearly stock series that steps up with single large hyperscale contracts.Irregular disclosure from one Australian operator, a small share of global capacity.
VNET committed MW2VNET committed wholesale MW +12% QoQ to 970 MW (2Q26).Large single wholesale orders from domestic cloud and AI tenants.One China operator; committed MW is a company-defined, not standard, metric.
US DC projects blocked2US DC projects blocked or delayed $68bn in 2Q26, −48% QoQ.Fewer multi-billion campuses hit local zoning or water disputes this quarter.A handful of mega-projects dominate each quarter; tracker coverage is partial.
US hosting jobs (BLS)2US hosting and data-processing jobs −1.7% m/m to 453k (Aug).Payrolls in hosting drift as operations automate; monthly BLS sampling noise.Data centres are capital-, not labour-intensive; the series mostly tracks non-AI staff.
Claude co-authored commits1Claude co-authored public commits +6% to 2.78mn a week (16 Aug).Continued coding-agent use on public repositories.Third-party dashboard with bot spikes and a stale latest point; public repos only.
TW chassis & rack rev2Taiwan chassis and rack revenue +36% to NT$11.3bn (Jul).Rack shipments for new AI server programmes bunch into a few months.Small, mixed-use company set; enclosures also serve non-AI servers, so timing dominates.
Frontier DC Capacity4Frontier DC capacity 12,535 MW (Jul); change not computed.The source flagged a definition change and retroactive edits to the dataset.Vintages are not comparable, so the latest change mixes revisions with real additions.

Basis changes found before publishing

IndicatorWhat changedHow it is handled
T-Glass Cloth Revenue2Q26 was first recorded as External revenue (JPY 14,589mn) while earlier quarters are segment revenue incl. intersegment; replaced by the same-definition figure (JPY 18,082mn) on 2026-09-30, so the change is like-for-likeNoted; change comparable
Frontier DC Capacityepoch_frontier_dc_mw: source flags a definition change.Change suppressed (not comparable); indicator left out of tables and charts
AI-Infra Debt IssuanceWeeks before 2026-08-30 are rebuilt from a deal list (estimated completeness: hyperscaler bonds ~90%, neocloud HY ~65%, DC ABS/CMBS ~25%, private credit ~45%); from 2026-08-30 weekly record scans. The rolling window straddles the switch until 2026-11-22, so a rise may partly reflect better coverageNoted; change comparable
Colo Bookings (DLR+EQIX)One-off: Digital Realty's ~200 MW Charlotte hyperscale lease (1Q26; est. ~$418mn annualized rent at 100% share, not disclosed) inflates every 2-quarter window that contains 1Q26. Like-for-like on the retail + interconnection basis the window is −3.9% (1Q26+2Q26 $1,008mn vs 3Q25+4Q25 $1,049mn); excluding the estimated Charlotte rent from the reported total gives −4.8%.Like-for-like change used (+23.6% reported → −3.9%)
GDS China Area CommittedThe prior two-quarter window is close to zero because GDS reports net area committed after the ABS (1Q25) and C-REIT (3Q25) deconsolidations; a percentage change on a near-zero base is not meaningful and GDS does not disclose gross new commitments.Change suppressed (not comparable); indicator left out of tables and charts

Deep-dives

Every card is collapsed; click to open. Hover the charts for values and the dated event behind each marked point.

Penetration

US Disclosed Tokens +19.4% 2026Q2 · Google API rate re-based; OpenAI print unchanged
AWhy it is importantModels & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps — US-disclosed tokens (Google, OpenAI API)
Why it mattersToken volume at the largest US providers sets inference load; growth here drives GPU, memory and power orders upstream.
How representativeGoogle ~1,300T plus OpenAI API ~260T is ~36% of est. global tokens per month; mainly Google consumer and cloud surfaces plus OpenAI developer traffic.
TimingLeading — Inference load precedes capacity orders
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly tokens processed by Google and OpenAI's API, based on figures the companies disclose at earnings and events.
Higher = more AI inference running on the two largest US token platforms.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Google Monthly Tokens Processedtokens T/month100%83%
V2OpenAI API Tokens per Minutetokens T/month100%17%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 3 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
Unittokens T/month; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-28
ScopeUS company-disclosed · Google all-surface tokens (weight 0.83) and OpenAI API tokens (0.17); Microsoft and Fireworks dropped in v8 because they no longer disclose.
Share of global total: 36% — 36% of est. global tokens: Google ~1,300T + OpenAI API ~260T = ~1,560T/month vs ~4,300T/month.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise2.8 / 5SNR 2.8: Google's definition switched several times and includes AI Overviews and reasoning tokens; OpenAI prints come only at events.
Reliability3.8 / 5Reliability 3.8: company statements, not audited filings; OpenAI figures are promotional and 6-12 months apart.
Scope36%Covers 36% of global tokens, so it is the largest disclosed block but still not the whole market.
Grade3 / 50.5 × SNR 2.8 + 0.5 × reliability 3.8 = 3.30 → 3
DLine charts and numbers
0.005001,0001,500Level (tokens T/month)Change vs prior period (%)1-yr avg +81%+129%+94%+19%2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q26= major change point(hover a period)
Components — past 3 years (tokens T/month)
0.005001,0001,5002,000302 T302 T432 T259 T691 T691 T648 T1,339 T950 T648 T1,598 T2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q26
Google Monthly Tokens ProcessedOpenAI API Tokens per Minute
Latest2026Q2: 1,598 T
Compared with2026Q1: 1,339 T
Change+19.4%
1-yr avg change+80.6% per quarter (3 obs)
MomentumRising (slower)
DriverGoogle +259T (691T to 950T); OpenAI flat at 648T, so the blended gain fell to 19% from 94%.
EWhy it moved

What changed. 2026Q2: 1,598 T, +19.4% vs 2026Q1 (1-yr average +80.6% per quarter).

  • All of the 2026Q2 gain came from Google, whose Gemini API run-rate rose about 37% QoQ (691T to 950T tokens/month); OpenAI's leg was carried flat at 648T because no newer figure was disclosed.
  • On its 22 Jul 2026 Q2 call Alphabet said developers were pushing more than 22B tokens per minute through Gemini APIs, up from 16B in Q1 and 10B at end-2025, with Cloud revenue up 82% on inference demand.
  • Blended growth slowed from +94% to +19% mainly because OpenAI's last API disclosure (15B tokens per minute in April 2026, from 6B in October 2025) was already in the Q1 base, so half the aggregate had no update.
  • The next OpenAI API disclosure is the swing factor: if it keeps its October-to-April pace (about 2.5x in five months), the blended growth rate would re-accelerate well above Q2's 19%.
  • So what: Google's own leg (+37% QoQ) kept pace with Cloud revenue (+82% YoY), so inference demand is still compounding; the blended slowdown reflects a missing OpenAI update, not weaker usage.
FRecent news
  • 2026-07-22Google said its model APIs now process about 22 billion tokens per minute on the Q2 2026 earnings call, with nearly 500 Cloud customers each above 1 trillion tokens in a year. link ↗ Indicator then: 2Q26 +19.4%
METR time horizon +45.3% 2026Q2 ·
AWhy it is importantModels & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps — Frontier model task length
Why it mattersLonger task horizons make models able to do delegated work, raising the value and compute demand of AI use.
How representativeFrontier models from all major labs on one benchmark, about 90% coverage; software tasks only, running maximum of best model.
TimingLeading — Capability gains precede adoption and usage
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionLength of software task (in human-expert minutes) that the best model released to date completes with 50% success, per METR's time-horizon benchmark.
Higher = agents can handle longer tasks unattended: the capability behind agentic adoption.
Formula
Readingt = Vt
where V = the member's reported value in minutes:
TermMember (reported series)Native unitAI shareWeight
VMETR benchmark_results_1_1.yamlminutes—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Unitminutes; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-04-14
ScopeGlobal (frontier labs) · Frontier models measured by METR (Time Horizon v1.1); level held until a new frontier measurement.
Share of global total: 90% — All major frontier labs.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: task length is what turns chat into delegated work.
Signal / noise3 / 5SNR 3: few measurements a year; each model release is a step.
Reliability4 / 5Reliability 4: independent evaluator, published methodology; v1.1 re-estimated history.
Scope90%Frontier capability, not usage.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.70 → 4, capped at the weaker of SNR / reliability + 1 = 3
DLine charts and numbers
0.005001,000Level (minutes)Change vs prior period (%)1-yr avg +73%+0%+0%+1%+0%+182%+78%+91%+56%+98%+70%+74%+104%+45%2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q261234= major change point(hover a period)
Latest2026Q2: 1,045 minutes
Compared with2026Q1: 719 minutes
Change+45.3%
1-yr avg change+73.1% per quarter (4 obs)
MomentumRising (slower)
DriverMETR benchmark_results_1_1.yaml: 326 minutes (100% of the change)
EWhy it moved

What changed. 2026Q2: 1,045 minutes, +45.3% vs 2026Q1 (1-yr average +73.1% per quarter).

  • The running record moved from Claude Opus 4.6 (about 12 hours, February 2026) to an early Claude Mythos Preview checkpoint at about 17.4 hours (1,045 minutes), a single-model step of +45%.
  • Anthropic released Mythos Preview on 7 Apr 2026 to a limited set of cybersecurity partners, and METR's evaluation put its 50% horizon at 16+ hours on long autonomous software tasks, above any earlier model.
  • The step was smaller than Q1's +104% because Opus 4.6 had already doubled the record in February, and only 5 of METR's 228 tasks run 16+ hours, capping what the suite can register.
  • Records have still landed in most quarters since 2024, roughly doubling every 4-5 months; next readings depend on METR adding longer tasks and scoring newer releases such as GPT-5.6 and Claude Opus 5.5.
  • So what: Frontier task length (+45% QoQ) grew faster than Google's Gemini API run-rate (+37% QoQ); longer autonomous tasks consume more tokens per job, pushing inference demand ahead of user growth.
FRecent news
  • 2026-07-09OpenAI released GPT-5.6, a new frontier model that could lift the best-to-date METR time horizon. link ↗ Indicator then: 2Q26 +45.3%

Supply-Demand

Downstream HW: Semi & ODM

TW ASIC Design Revenue +82.6% 2026-07 · Alchip 3nm AI chip mass production ramp
AWhy it is importantAI chips & ASIC · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionAI chips & ASIC — Custom-ASIC design services (Taiwan)
Why it mattersDesign houses turn hyperscaler chip specs into silicon; their revenue shows custom-ASIC programs ramping beyond NVIDIA.
How representativeGUC plus Alchip ~25% of custom-ASIC design-service revenue (Broadcom ~60%, Marvell ~13%); a read on the non-NVIDIA accelerator programs.
TimingLeading — Design and tape-out revenue precedes volume shipments
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCombined monthly revenue of Global Unichip and Alchip, Taiwan's custom AI chip design-service houses.
Higher = more hyperscaler custom ASIC programs taping out or shipping.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = (1/3) × Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Global UnichipTWD k60%40%
V2AlchipTWD k90%60%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn, trailing 3-month average; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · GUC (AI/HPC ~60%) and Alchip (AI ~90%) monthly revenue; Broadcom and Marvell design services excluded.
Share of global total: 25% — 25% of custom AI-ASIC design-service revenue; Broadcom ~60% and Marvell ~13% make up the rest.
Comparison windowAuto-widened: compared as single months the reading swung by ±18% per month and kept reversing direction (noise cap 12%); trailing 3 months vs the 3 before cut that to ±6%
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: direct read of custom ASIC programs, but only two Taiwan firms in a market led by Broadcom.
Signal / noise2 / 5SNR 2.0: turnkey wafer pass-through and one-off NRE alternate, so months are lumpy; gaps at Trainium2 to 3.
Reliability5 / 5Reliability 5.0: statutory monthly filings from the Taiwan exchange, rarely revised.
Scope25%Covers ~25% of design-service revenue, so it is a partial sample of the ASIC market.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 2 + 0.3 × reliability 5 = 3.70 → 4, capped at the weaker of SNR / reliability + 1 = 3
DLine charts and numbers
$100mn$150mn$200mn$250mnLevel (USD mn, trailing 3-month average)Change vs the prior 3-month window (%)1-yr avg +20%+10%−1%+8%+8%+6%+18%+33%+6%−13%−6%−11%−12%−12%−6%−4%+6%−9%+23%+83%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-2612345= major change point(hover a period)
Components — past 3 years (USD mn, trailing 3-month average)
$0.00$50mn$100mn$150mn$200mn$250mn$115mn$115mn$123mn$130mn$136mn$156mn$172mn$188mn$183mn$167mn$162mn$151mn$141mn$126mn$124mn$118mn$123mn$113mn$119mn$138mn$160mn$218mnJul-23Sep-23Nov-23Jan-24Mar-24May-24Jul-24Sep-24Nov-24Jan-25Mar-25May-25Jul-25Sep-25Nov-25Jan-26Mar-26May-26Jul-26
AlchipGlobal Unichip
Latest2026-07: $218mn
Compared with2026-04: $119mn
Change+82.6%
1-yr avg change+19.7% per window (4 obs)
MomentumTurned up
DriverAlchip: $49mn (85% of the change)
EWhy it moved

What changed. 2026-07: $218mn, +82.6% vs 2026-04 (1-yr average +19.7% per window).

  • Alchip drove the move: the 3-month average rose from 119.2 to 217.7, and Alchip's 46.4 to 121.2 is about three quarters of the 98.5 gain, while GUC added about 24; this is concentrated in one program.
  • Alchip's July revenue doubled to over NT$7.4bn on 10 Aug as its customer's 3nm AI accelerator entered mass production, a new monthly record, with wafer and packaging pass-through lifting sales.
  • GUC's July sales rose 158% year on year to an all-time high (reported 17 Aug) and its turnkey share passed 80% of revenue, so GUC's contribution is steadier but smaller.
  • Alchip guided Q3 to another record on 14 Aug despite gross-margin pressure, so the 3-month figure should keep rising through August data; the turning point is when the 3nm ramp plateaus.
  • So what: ASIC design-service revenue has doubled on one 3nm ramp; the supply signal is real, but a single-customer program concentrates the risk.
FRecent news
  • 2026-08-10Alchip July revenue doubled to over NT$7.4 billion as 3nm AI chip mass production set a new monthly record. link ↗ Indicator then: Jul-26 +82.6%
  • 2026-08-14Alchip's Q2 revenue rose 82.6% as the N3 AI accelerator ramped, and it guided a record Q3. link ↗ Indicator then: Jul-26 +82.6%
  • 2026-08-17Global Unichip hit an all-time high as July sales surged 158% year on year. link ↗ Indicator then: Jul-26 +82.6%

Downstream HW: Peripherals (power, optics)

Accton Switch Revenue +40.6% 2026-07 · Accton AI switch demand and 1.6T ramp
AWhy it is importantNetworking & optics · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionNetworking & optics — White-box 800G switch maker
Why it mattersAccton supplies white-box Ethernet switches to hyperscalers; monthly sales show Ethernet AI fabric build-out speed.
How representativeAccton ~50% of white-box switches; white-box ~30% of AI Ethernet switching, so ~15% of the link. A single-company read, but monthly and early.
TimingCoincident — Monthly sales follow switch shipments closely
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Accton, Taiwan's main white-box data center switch maker.
Higher = more 800G Ethernet switches shipped into AI and cloud data centers.
Formula
Xt = Vt
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VAcctonTWD k—100%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Accton monthly revenue only; Arista, Cisco and other white-box makers excluded. AI share set at 100%.
Share of global total: 15% — 15% of AI Ethernet switching: Accton ~50% of white-box switches, white-box ~30% of AI Ethernet switching.
Comparison windowProject-based switch shipments (std 14%, flips 43%)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: 800G switches are a direct AI networking read, from a single company.
Signal / noise4 / 5SNR 4.0: high DC-networking purity and steady trend (reversal share 24%); project-based shipments add some noise.
Reliability5 / 5Reliability 5.0: statutory monthly filing.
Scope15%Covers ~15% of AI Ethernet switching, so it is a small sample.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 5 = 4.30 → 4
DLine charts and numbers
$0.00$1.0bn$2.0bn$3.0bn$4.0bnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +14%+8%+11%−3%−6%−14%+22%+31%+15%+25%+34%+10%+30%+37%+20%−4%−4%−3%+14%+41%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-261234567= major change point(hover a period)
Latest2026-07: $3.4bn
Compared with2026-04: $2.4bn
Change+40.6%
1-yr avg change+14.0% per window (4 obs)
MomentumAccelerating
DriverAccton: $355mn (100% of the change)
EWhy it moved

What changed. 2026-07: $3.4bn, +40.6% vs 2026-04 (1-yr average +14.0% per window).

  • Accton is the only member: its rolling 3-month revenue reached 3,378 versus 2,403 in April (+40.6%), and monthly revenue has been stepping up since April after a flat 2,200-2,250 range in late 2025 to March.
  • Accton set a third straight monthly revenue record in June (reported 7 Jul) on AI infrastructure demand, so the July total built on an already high base.
  • The 8 Aug report on July revenue tied the jump to AI switch demand and expanding 1.6T port shipments, the higher-speed generation that carries more value per switch.
  • Switch orders follow cloud accelerator deployments, so the same hyperscaler build-out lifting ASIC revenue supports this move; a plateau in monthly records would be the turning signal.
  • So what: Switch revenue is up 41% on 1.6T shipments and cloud AI cluster build-outs; it corroborates ASIC demand, but depends on a few hyperscaler customers.
FRecent news
  • 2026-07-07Accton set a third straight monthly revenue record on AI infrastructure demand. link ↗ Indicator then: Jun-26 +36.2%
  • 2026-08-08Accton revenue jumped on AI switch demand as 1.6T shipments expanded. link ↗ Indicator then: Jul-26 +40.6%
Power-Gen Equipment Rev. +14.2% 2026Q2 ·
AWhy it is importantPower, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling — On-site and grid generation equipment
Why it mattersGas turbines, gensets and fuel cells power sites the grid cannot serve; sales show how hard firms work around grid delays.
How representativeAbout 50% of data-centre-linked generation equipment: GE Vernova ~35% of heavy-duty gas turbines, Caterpillar ~40% and Cummins ~20% of large gensets; Bloom leads fuel cells.
TimingLeading — Equipment is ordered well before sites need power
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of on-site and grid power-generation equipment makers serving data centers: GE Vernova Power, Caterpillar, Cummins, Bloom.
Higher = more turbines, gensets and fuel cells delivered to power new AI data centers.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1GE Vernova Power Segment RevenueUSD mn30%45%
V2Caterpillar Energy & TransportationUSD mn45%30%
V3Cummins Power Systems Segment SalesUSD mn35%17%
V4Bloom Energy RevenueUSD mn60%8%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-05
ScopeGlobal (US-led) · GE Vernova Power segment, Caterpillar power generation sales, Cummins Power Systems and Bloom Energy; other turbine and genset makers are left out.
Share of global total: 50% — About 50% of DC-linked generation equipment: GE Vernova ~35% of heavy-duty gas turbines, Caterpillar ~40% and Cummins ~20% of large DC gensets.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: direct read on power supply for data centers, but only 30-60% of each maker's revenue is DC-linked (AI shares 0.3-0.6).
Signal / noise3.4 / 5Score 3.4: order and acceptance timing is lumpy (Bloom SNR 2), and turbine revenue also serves utilities and industry.
Reliability4.2 / 5Score 4.2: filed segment revenue from audited reports; CIQ has no orders line for GE Vernova, so revenue is a delivery series.
Scope50%Covers about 50% of DC-linked generation equipment, so it is a solid partial read.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3.4 + 0.3 × reliability 4.2 = 3.88 → 4
DLine charts and numbers
$2.0bn$3.0bn$4.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +8%+29%−1%+25%−23%+15%−1%+25%−19%+15%+7%+20%−11%+14%2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q26= major change point(hover a period)
Components — past 3 years (USD mn)
$0.00$1.0bn$2.0bn$3.0bn$4.0bn$5.0bn$1.2bn$740mn$2.4bn$1.2bn$719mn$2.4bn$1.7bn$826mn$3.0bn$1.2bn$728mn$2.3bn$1.3bn$848mn$2.7bn$1.2bn$905mn$2.7bn$1.6bn$1.0bn$3.3bn$1.3bn$898mn$2.7bn$1.4bn$1.1bn$3.1bn$1.5bn$1.2bn$3.3bn$1.7bn$1.5bn$4.0bn$1.5bn$1.3bn$3.6bn$1.6bn$1.4bn$639mn$4.1bn2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q26
GE Vernova Power Segment RevenueCaterpillar Energy & TransportationBloom Energy RevenueCummins Power Systems Segment Sales
Latest2026Q2: $4.1bn
Compared with2026Q1: $3.6bn
Change+14.2%
1-yr avg change+7.8% per quarter (4 obs)
MomentumTurned up
DriverBloom Energy Revenue: $189mn (37% of the change)
EWhy it moved

What changed. 2026Q2: $4.1bn, +14.2% vs 2026Q1 (1-yr average +7.8% per quarter).

  • The 14% q/q rise was broad-based: Bloom contributed about 37% of the gain, GE Vernova Power 30%, Caterpillar power generation 25% and Cummins about 8%, all citing data-center demand for on-site and backup power.
  • Bloom's Q2 product revenue reached $935mn (+215% y/y) as AI data-center fuel-cell installations were accepted, taking total revenue past $1bn for the first time; on 28 July it raised 2026 guidance to $3.9-4.2bn.
  • Caterpillar's power generation sales rose to $3.1bn (+29% y/y) on large reciprocating gensets and turbines for data centers, and GE Vernova Power revenue rose to $5.5bn (+14% y/y) led by aeroderivative turbine volume and price.
  • The Q1 dip followed the usual post-Q4 delivery drop; capacity, not demand, is the limit, with GE Vernova's gas backlog plus reservations at 116 GW against 20 GW/year of output and Cummins short of large-genset capacity.
  • So what: Power gear grew 14% q/q versus Accton switches' 47%; with 116 GW of turbine backlog against 20 GW/year output, power delivery will pace AI capacity additions.
FRecent news
  • 2026-08-04Caterpillar lifted its 2026 sales growth target on strong data center demand for power generation equipment. link ↗ Indicator then: 2Q26 +14.2%
  • 2026-08-04Cummins raised its full-year 2026 outlook on data center power demand after strong second-quarter results. link ↗ Indicator then: 2Q26 +14.2%
  • 2026-07-28Bloom Energy reported record second-quarter 2026 revenue and raised full-year guidance. link ↗ Indicator then: 2Q26 +14.2%
  • 2026-07-23GE Vernova's gas turbine backlog rose to 116 GW in the second quarter, pointing to sustained power equipment revenue. link ↗ Indicator then: 2Q26 +14.2%

Downstream HW: Data Center

Semicon Upstream Supply

Foundry & Memory Capex +38.4% 2026Q2 · TSMC 2nm/CoWoS and HBM fab builds lift capex together
AWhy it is importantFoundry & packaging + Memory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionFoundry & packaging + Memory & storage — Leading foundry and memory capex
Why it mattersTSMC and the memory makers decide how much AI chip and HBM capacity exists; their capex shows expected AI demand.
How representativeTSMC, SK hynix, Samsung and Micron are ~65% of global semiconductor capex in 2026; it funds wafers and HBM for NVIDIA and custom ASICs.
TimingLeading — Capex is committed before capacity and revenue
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly capital spending of the four largest advanced chipmakers: TSMC, SK hynix, Samsung Electronics semiconductors and Micron.
Higher = chipmakers are funding more fab capacity, which will translate into equipment orders.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1TSMC Capex ($M/qtr, TTM)TWD mn60%28%
V2SK hynix Capex ($M/qtr, TTM)USD mn70%29%
V3Samsung Electronics Semiconductor Facility InvestmentKRW tn40%22%
V4Micron Cash Capital ExpenditureUSD mn60%21%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Non-USD members are converted at the quarter-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-31
ScopeGlobal · TSMC, SK hynix, Samsung semiconductor facility investment and Micron cash capex; Intel, SMIC and others are left out.
Share of global total: 65% — About 65% of global semiconductor capex in 2026.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: capex by the largest foundry and memory buyers is the direct source of tool demand for AI logic and HBM.
Signal / noise3.2 / 5Score 3.2: quarterly timing is noisy, and Samsung's split between memory and foundry is opaque.
Reliability4.8 / 5Score 4.8: filed capex from listed companies; reported values rarely revised.
Scope65%Covers about 65% of global capex, so it is a majority view.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 3.2 + 0.3 × reliability 4.8 = 4.40 → 5, capped at the weaker of SNR / reliability + 1 = 4
DLine charts and numbers
$5.0bn$10.0bn$15.0bn$20.0bn$25.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +22%+7%−11%+18%+60%−12%−17%+10%+58%−20%+38%2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q2612= major change point(hover a period)
Components — past 3 years (USD mn)
$0.00$10.0bn$20.0bn$30.0bn$3.2bn$4.3bn$9.5bn$3.4bn$4.3bn$10.2bn$3.9bn$2.9bn$9.1bn$3.9bn$3.1bn$10.7bn$6.9bn$4.6bn$17.1bn$6.3bn$15.1bn$5.6bn$2.8bn$12.4bn$5.5bn$3.4bn$13.7bn$6.8bn$6.0bn$5.5bn$21.5bn$6.7bn$3.9bn$3.8bn$17.3bn$9.4bn$5.4bn$24.0bn2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q26
TSMC Capex ($M/qtr, TTM)SK hynix Capex ($M/qtr, TTM)Micron Cash Capital ExpenditureSamsung Electronics Semiconductor Facility Investment
Latest2026Q2: $24.0bn
Compared with2026Q1: $17.3bn
Change+38.4%
1-yr avg change+21.6% per quarter (4 obs)
MomentumTurned up
DriverTSMC added the most, rising to $9.4bn from $6.6bn; SK hynix ($5.4bn), Micron ($4.7bn) and Samsung ($4.4bn) also rose, with Samsung and SK hynix rebounding from Q1.
EWhy it moved

What changed. 2026Q2: $24.0bn, +38.4% vs 2026Q1 (1-yr average +21.6% per quarter).

  • The 38% Q2 rise was broad-based, with all four spenders higher, but TSMC drove about 41% of the increase and SK hynix and Samsung about 23% each, leaving Micron at 13%.
  • TSMC spent about $15.6bn in Q2, 42% more than in Q1, and on 16 July lifted its 2026 capex guide to $60-64bn from $52-56bn in January, citing long-term customer commitments for advanced nodes and packaging.
  • Memory makers turned record HBM and DRAM profits into capacity: Samsung's first-half facility investment topped $19bn alongside a record 2,450tn-won domestic plan, and SK hynix raised 2026 investment to a record ~$31bn on 29 July.
  • Micron's fiscal Q3 (March-May) net capex reached $7.1bn as it lifted fiscal 2026 spending to about $27bn, mostly for Taiwan and US clean rooms; Q2 broke the usual Q1 dip and Q4 spike, already topping Q4 2025.
  • So what: Fab capex rose 38% in Q2 while Dutch, Japanese and US tool exports rose only 8.7%, so clean rooms ran ahead of tool deliveries; tool shipments should catch up.
FRecent news
  • 2026-09-03TSMC fab equipment demand has nearly doubled in six months, pushing 2026 capex toward $64B amid tool shortages. link ↗ Indicator then: 2Q26 +38.4%
  • 2026-08-07SK hynix will invest $38 billion in new memory chip plants. link ↗ Indicator then: 2Q26 +38.4%
  • 2026-08-03SK hynix raised its annual chip investment to a record $31B. link ↗ Indicator then: 2Q26 +38.4%
  • 2026-07-27TSMC raised its 2026 capex budget to capture long-term AI and HPC demand. link ↗ Indicator then: 2Q26 +38.4%

Funding

Hyperscaler Free Cash Flow $1.4bn → −$7.3bn 2026Q2 · Capex now exceeds cash generation
AWhy it is importantCloud & neoclouds + Capital & funding · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCloud & neoclouds + Capital & funding — Cash left after capex
Why it mattersFree cash flow shows whether buyers can fund AI spend from operations or must borrow, which limits how long spending lasts.
How representativeSame ~85% of global AI data-centre capex (US big 5 ~70%, six neoclouds ~15%); mainly a read on hyperscaler funding capacity.
TimingLagging — Cash flow reflects past earnings and spending
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly free cash flow (operating cash flow minus capex) of the five largest US cloud companies and six listed neoclouds.
Higher = more internal cash to fund AI spending; lower or negative = growing reliance on debt or equity.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Amazon Free Cash FlowUSD bn100%22%
V2Alphabet Free Cash FlowUSD bn100%19%
V3Microsoft Free Cash FlowUSD bn100%23%
V4Meta Free Cash Flow ($B/qtr, TTM)USD bn100%15%
V5Oracle Free Cash FlowUSD bn100%7%
V6CoreWeave Free Cash FlowUSD bn100%6%
V7Nebius Free Cash FlowUSD bn100%5%
V8IREN Free Cash Flow ($B/qtr, TTM)USD bn100%2%
V9Applied Digital Free Cash FlowUSD bn100%1%
V10TeraWulf Free Cash Flow ($B/qtr)USD bn100%1%
V11Cipher Mining Free Cash FlowUSD bn100%0%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 3 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-20
ScopeUS (big 5 + neoclouds) · Amazon, Alphabet, Microsoft, Meta, Oracle, CoreWeave, Nebius, IREN, Applied Digital, TeraWulf and Cipher; whole-company FCF, not AI-only.
Share of global total: 85% — About 85% of global AI DC capex, so weights follow capex: big 5 ≈ 70%, six neoclouds ≈ 15%.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only).
Signal / noise2.9 / 5Score 2.9: capex dominates moves but tax timing adds noise, and it is whole-company FCF; neocloud FCF is lumpy with GPU deliveries.
Reliability5 / 5Score 5.0: cash-flow figures from audited filings; statutory and rarely revised.
Scope85%Covers about 85% of the global AI capex base, close to the whole market.
Grade4 / 50.5 × SNR 2.9 + 0.5 × reliability 5 = 3.95 → 4
DLine charts and numbers
−$25.0bn$0.00$25.0bn$50.0bn$75.0bnLevel (USD bn)Change vs prior period (%)1-yr avg −15%+78%+16%−22%+5%−4%+7%−8%−29%−16%+78%−25%−97%2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q2612345= major change point(hover a period)
Components — past 3 years (USD bn)
−$50.0bn−$25.0bn$0.00$25.0bn$50.0bn$75.0bn$19.8bn$21.8bn$61.4bn$20.7bn$22.6bn$71.5bn$27.9bn$55.6bn$21.0bn$16.8bn$58.5bn$23.3bn$13.5bn$56.2bn$19.3bn$17.6bn$15.7bn$60.3bn$17.8bn$24.8bn$55.6bn$20.3bn$19.0bn$39.5bn$25.6bn$33.1bn$25.7bn$24.5bn$58.8bn$24.6bn$44.3bn$15.8bn−$18.2bn$1.4bn$19.6bn−$7.3bn2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q26
Microsoft Free Cash FlowAmazon Free Cash FlowAlphabet Free Cash FlowCoreWeave Free Cash FlowNebius Free Cash FlowOracle Free Cash FlowOther members · black bar = net total
Latest2026Q2: −$7.3bn
Compared with2026Q1: $1.4bn
Changesign flip −$8.7bn
1-yr avg change−14.7% per quarter (3 obs)
MomentumFalling faster
DriverAmazon -8.82B, Alphabet -5.86B, CoreWeave -5.74B, Nebius -3.41B offset by Microsoft +19.64B; group -7.32B versus +1.36B in Q1 and +44.3B in 2025Q4.
EWhy it moved

What changed. 2026Q2: −$7.3bn, sign change (1-yr average −14.7% per quarter).

  • Alphabet (-$16.0bn) and Meta (-$11.5bn) made up about 84% of the $32.6bn gross decline, partly offset by $23.8bn of gains at Oracle, Amazon and Microsoft; the common driver was AI capex outrunning operating cash.
  • Alphabet spent $44.9bn on capex in Apr-Jun and on 22 Jul raised 2026 guidance to as much as $205bn, turning its quarterly free cash flow negative for the first time.
  • Meta's capex reached $31.1bn against $31.9bn of operating cash, leaving $784m of reported free cash flow, and on 29 Jul it lifted the floor of its 2026 capex range again while legal charges also weighed.
  • The offsets were timing, not restraint: Amazon recovered from its seasonal Q1 payables outflow despite raising 2026 capex to $220bn on 30 Jul, and Oracle's fiscal Q4 collections narrowed its burn before Jun-Aug fell back to -$5.4bn.
  • So what: Group cash burn widened while the compute backlog rose $152bn; contracted demand is now funded by debt, making bond-market access the binding constraint.
FRecent news
  • 2026-07-31Meta fell about 10% after burning through nearly all its cash in a single quarter on AI spending. link ↗ Indicator then: 1Q26 −96.9%
  • 2026-07-31Microsoft said cash will keep flowing from AI spending, and its shares rose. link ↗ Indicator then: 1Q26 −96.9%
NVIDIA strategic stakes +18.0% 2026Q2 · Equity stakes in OpenAI, Anthropic, CoreWeave
AWhy it is importantCapital & funding + AI chips & ASIC · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + AI chips & ASIC — NVIDIA equity stakes in customers
Why it mattersNVIDIA funding its own customers (labs, neoclouds) supports GPU demand but adds circular-financing risk.
How representativeAbout 15% of AI-infra equity funding: one vendor's stakes in OpenAI, xAI, Anthropic, CoreWeave, Nebius and others; includes fair-value marks.
TimingLeading — Investments precede the customers' GPU purchases
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionNVIDIA's balance-sheet long-term investments (equity stakes in labs, neoclouds and ecosystem companies) at fiscal quarter end, in USD billions.
Higher = NVIDIA is financing more of its own customers' demand; rapid growth signals rising circular funding risk.
Formula
Readingt = Vt
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VS&P Capital IQ long_term_investments; NVDA fiscal quarterUSD bn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-20
ScopeGlobal · NVIDIA only; includes stakes such as OpenAI, xAI, Anthropic, CoreWeave, Nebius; carrying value includes fair-value marks.
Share of global total: 15% — About 15%: one vendor's stakes versus total private and public AI-infra equity funding.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: vendor financing of demand is a key fragility in the AI funding chain.
Signal / noise3 / 5SNR 3: fair-value marks and one-off large deals move the balance beyond new cash commitments.
Reliability5 / 5Reliability 5: audited 10-Q/10-K balance sheet via S&P Capital IQ.
Scope15%Covers about 15%, so a narrow but high-signal slice.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
$0.00$20.0bn$40.0bn$60.0bnLevel (USD bn)Change vs prior period (%)1-yr avg +100%+57%+46%+13%+33%+4%+23%+51%−4%+17%+116%+172%+95%+18%2Q233Q234Q231Q242Q243Q244Q241Q252Q253Q254Q251Q262Q261234= major change point(hover a period)
Latest2026Q2: $51.2bn
Compared with2026Q1: $43.4bn
Change+18.0%
1-yr avg change+100.0% per quarter (4 obs)
MomentumRising (slower)
DriverSingle series: long-term investments $51.16B in 2026Q2, up from $43.36B in Q1 and $3.80B in 2025Q2.
EWhy it moved

What changed. 2026Q2: $51.2bn, +18.0% vs 2026Q1 (1-yr average +100.0% per quarter).

  • Growth slowed to 18% because the quarter netted a large outflow: inside the non-marketable book (up $5.6bn to $47.9bn), $4.9bn came from upward revaluations, so new cheques only slightly exceeded the stake that left the line.
  • SpaceX, which had absorbed xAI, listed on 12 Jun 2026, moving Nvidia's former xAI stake to marketable holdings; that position was worth about $21bn at end-June, and marketable equity rose $12.5bn to $42.8bn.
  • May-Jul money went to smaller ecosystem bets, not lab-sized rounds: leading Firmus's raise with roughly $500m-plus (Jul 2026) and backing switch-silicon startup Upscale's $190m round (Jun 2026), after about $17bn net added in Feb-Apr.
  • Watch the reported plan to buy up to $10bn of Anthropic's IPO and further lab IPOs: they would land in marketable securities and drain this line, while private-round repricing keeps adding mark-ups.
  • So what: Private plus listed stakes reached about $91bn versus $35bn in January, so Nvidia's customer-funding keeps rising even as this private-only line slows on IPO reclassification.
FRecent news
  • 2026-08-15Nvidia disclosed equity stakes of about $50 billion in SpaceX and Intel, both exclusive chip buyers. link ↗ Indicator then: 2Q26 +18.0%
  • 2026-08-12Nvidia's roughly $70 billion of stakes in OpenAI, Anthropic and other AI firms form the core of its growing long-term investments. link ↗ Indicator then: 2Q26 +18.0%
Neocloud Equity Basket +11.4% 2026-08-30 · Neocloud rebound on CoreWeave, Nvidia, financings
AWhy it is importantCapital & funding + Cloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemiequipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory &storageGPUs, custom ASICs, design servicesAI chips &ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers &ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres& colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AIappsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Cloud & neoclouds — Neocloud equity funding access
Why it mattersShare prices set whether neoclouds can raise equity for GPU purchases; a drop tightens funding for capacity build-out downstream.
How representativeFive names (CoreWeave, Nebius, Oracle, IREN, Applied Digital), about 30% proxy of AI-infra financing need; mainly tracks debt-funded GPU rental builders.
TimingLeading — Prices react before raises and capex plans
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionEqual-weight index of weekly closing prices of CoreWeave, Nebius, Oracle, IREN and Applied Digital, rebased to 100 on 2025-08-31.
Higher = equity window open and cheaper equity funding for AI build-out; sharp drops = window shutting.
Formula
Xt = Vt
Readingt = (1/4) × Σj=0…3 Xt−j trailing 4 weeks, recomputed every week
where V = the member's reported value in index:
TermMember (reported series)Native unitAI shareWeight
VWeekly closes via S&P Capital IQ; equal weightindex—100%
Changet = Readingt ÷ Readingt−4 − 1 this 4-week window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 13 observations
Unitindex, trailing 4-week average; change in %
FrequencyWeekly · latest period 2026-08-30 · recorded 2026-09-01
ScopeUS-listed · Five equities with heavy AI-capex financing needs: CRWV, NBIS, ORCL, IREN, APLD; price index only, market caps are not summed.
Share of global total: 30% — About 30% (proxy): five names with heavy AI-capex financing needs, not a share of the global total.
Comparison windowAuto-widened: compared as single weeks the reading swung by ±10% per week and kept reversing direction (noise cap 10%); trailing 4 weeks vs the 4 before cut that to ±4%
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: equity prices show directly whether AI-infra borrowers can raise capital, though they also reflect sentiment.
Signal / noise3 / 5SNR 3: high beta and sentiment swings move prices beyond funding conditions.
Reliability5 / 5Reliability 5: weekly closes from S&P Capital IQ; market prices are not revised.
Scope30%Covers about 30% (proxy), so a partial read of AI-infra financing conditions.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
0.00100200Level (index, trailing 4-week average)Change vs the prior 4-week window (%)1-yr avg +6%−16%−9%+34%−21%−5%+1%+40%−23%+23%+16%−8%−5%−17%+60%−3%+21%+12%−5%+2%−2%+29%−9%+11%24 Sep26 Nov28 Jan31 Mar02 Jun04 Aug06 Oct08 Dec09 Feb13 Apr15 Jun17 Aug19 Oct21 Dec22 Feb26 Apr28 Jun30 Aug= major change point(hover a period)
Latest2026-08-30: 162
Compared with2026-08-02: 146
Change+11.4%
1-yr avg change+5.8% per window (13 obs)
MomentumTurned up
DriverWeekly closes via S&P Capital IQ; equal weight: 1.5 (100% of the change)
EWhy it moved

What changed. 2026-08-30: 162, +11.4% vs 2026-08-02 (1-yr average +5.8% per window).

  • The basket closed the 30 Aug week at 162.49, up 11.4% from four weeks earlier but still about 20% below the late-June 203; this is a rebound led by high-beta neoclouds (CRWV, NBIS, IREN), not a broad re-rating.
  • CoreWeave's 11 Aug Q2 report, with revenue doubling year on year and a higher 2026 spending plan, lifted the stock about 14% and began the recovery from the 9 Aug trough of 143.19.
  • Nebius raised $5.75bn of convertibles on 25 Aug above its target, and Nvidia's 26 Aug Q2 results pushed CRWV, NBIS and IREN higher, showing funding markets are open again.
  • The rebound is fragile: IREN fell about 6% on 26 Aug before results and a warning of a coming neocloud price crash circulated, so the test is whether further financings price on similar terms.
  • So what: Equity funding capacity has recovered from July, but on sentiment; repeat issuance at tight terms is needed to confirm it.
FRecent news
  • 2026-08-11CoreWeave jumped about 14% after Q2 revenue doubled year on year and it raised its 2026 spending plan. link ↗ Indicator then: 09 Aug −22.6%
  • 2026-08-25Nebius raised $5.75bn of convertible debt, above its initial target, and the stock rose about 4% to end a six-session slide. link ↗ Indicator then: 23 Aug +6.9%
  • 2026-08-26Nvidia's Q2 results lifted CRWV, NBIS and IREN overnight. link ↗ Indicator then: 23 Aug +6.9%
  • 2026-08-27IREN reported a Q4 loss but beat revenue estimates after falling about 6% the day before. link ↗ Indicator then: 23 Aug +6.9%
  • 2026-07-16Nebius sank 13% as the neocloud trade unwound, setting up the July-August drawdown from the late-June peak. link ↗ Indicator then: 12 Jul −9.2%
All indicators — directory114 indicators by class: chain link, last update, latest reading and next update; click a row for its card
IndicatorChain linkGradeFreq.Last updatedLatest readingLast situationStatusNext update
Penetration
China GenAI FilingsModels & AI apps + Enterprise & consumer useG5M2026-08-142026-06: 988+13.8% vs 2026-04 · 1-yr avg +13% · AcceleratingCurrent10 Sep 26
Cloud AI RevenueCloud & neocloudsG5Q2026-08-262026Q2: $26.8bn+17.4% vs 2026Q1 · 1-yr avg +11% · AcceleratingCurrent27 Oct 26
EU Firm AI UseEnterprise & consumer useG5Y2026-01-102025: 19.9%+48.0% vs 2024 · 1-yr avg +48% · Rising (slower)Current10 Dec 26
China AI Lab RevenueModels & AI appsG4H2026-04-022025H2: $128mn+117.6% vs 2025H1 · 1-yr avg +118% · Rising (slower)Current20 Mar 27
China Daily TokensModels & AI appsG4Y2026-04-072026: 140 T+40.0% vs 2025 · 1-yr avg +40% · Rising (slower)CurrentEvent-driven
UK firms using AI (ONS)Enterprise & consumer useG4Q2026-07-172026Q2: 28.9%+11.6% vs 2026Q1 · 1-yr avg +9% · AcceleratingCurrent16 Oct 26
US Firm AI Use (BTOS)Enterprise & consumer useG4W2026-08-302026-08-23: 22.4%+2.8% vs 2026-08-09 · 1-yr avg +4% · AcceleratingCurrent17 Sep 26
US firms paying for AI (Ramp)Enterprise & consumer useG4M2026-08-152026-07: 55.7%+1.4% vs 2026-06 · 1-yr avg +2% · FlatCurrent15 Sep 26
AI framework npm downloadsModels & AI apps + Enterprise & consumer useG3W2026-09-012026-08-30: 26,686,463 downloads/wk+5.5% vs 2026-08-23 · 1-yr avg +5% · Rising (slower)Current~13 Sep 26
LLM SDK npm downloadsModels & AI apps + Enterprise & consumer useG3W2026-09-012026-08-30: 78,428,275 downloads/wk+14.6% vs 2026-08-23 · 1-yr avg +5% · AcceleratingCurrent~13 Sep 26
METR time horizonModels & AI appsG3Q2026-04-142026Q2: 1,045 minutes+45.3% vs 2026Q1 · 1-yr avg +73% · Rising (slower)Deep-diveEvent-driven
Palantir commercial revEnterprise & consumer use + Models & AI appsG3Q2026-08-032026Q2: $945mn+22.1% vs 2026Q1 · 1-yr avg +20% · AcceleratingCurrent02 Nov 26
US Disclosed TokensModels & AI appsG3Q2026-07-282026Q2: 1,598 T+19.4% vs 2026Q1 · 1-yr avg +81% · Rising (slower)Deep-dive27 Oct 26
US Worker GenAI UseEnterprise & consumer useG3Q2026-08-212026Q2: 45.2%+4.1% vs 2026Q1 · 1-yr avg +7% · Rising (slower)Current20 Nov 26
OpenRouter TokensModels & AI appsG2W2026-09-012026-08-30: 113T+21.0% vs 2026-08-23 · 1-yr avg +8% · AcceleratingCurrentWeekly
US AI Lab Run-RateModels & AI appsG2M2026-03-072026-02: $39.0bn+34.5% vs 2025-12 · 1-yr avg +79% · Rising (slower)StaleEvent-driven
Claude co-authored commitsEnterprise & consumer use + Models & AI appsG1W2026-08-232026-08-16: 2,781,154+6.2% vs 2026-08-09 · 1-yr avg +5% · Turned downCurrentEvent-driven
Supply-Demand
Grid Equipment PPIPower, grid & coolingG5M2026-08-142026-07: 444+2.8% vs 2026-06 · 1-yr avg +1% · FlatCurrent14 Sep 26
NVIDIA Supply CommitmentsAI chips & ASIC + Foundry & packagingG5Q2026-06-102026Q2: $119bn+25.0% vs 2026Q1 · 1-yr avg +32% · Rising (slower)Current~07 Oct 26
Power Equip. BacklogPower, grid & coolingG5Q2026-02-132025Q4: $38.7bn+24.9% vs 2025Q3 · 1-yr avg +18% · AcceleratingStale21 Oct 26
AI Compute BacklogCloud & neocloudsG4Q2026-08-112026Q2: $1.24tn+13.9% vs 2026Q1 · 1-yr avg +34% · Rising (slower)Current27 Oct 26
DRAM Contract GuidanceMemory & storageG4M2026-08-312026-06: 60.5%+0.0pp vs 2026-03 · 1-yr avg +8pp · FlatCurrent30 Sep 26
Micron Inventory DaysMemory & storageG4Q2026-07-122026Q2: 122 days−1.1% vs 2026Q1 · 1-yr avg −3% · FlatCurrent~12 Oct 26
N. America DC VacancyData centres & coloG4Y2026-08-312026: 1.40%+0.0% vs 2025 · 1-yr avg −13% · FlatCurrent01 Mar 27
SK hynix Inventory DaysMemory & storageG4Q2026-08-142026Q2: 123 days−7.9% vs 2026Q1 · 1-yr avg +1% · Turned downCurrent~14 Nov 26
US Capacity Auction PricePower, grid & cooling + Data centres & coloG4Y2025-12-272025: $433.36+118.9% vs 2024 · 1-yr avg +119% · Rising (slower)Current17 Dec 26
Cooling backlog (TT+JCI)Power, grid & coolingG3Q2026-08-072026Q2: $6.2bn+8.8% vs 2026Q1 · 1-yr avg +12% · Rising (slower)Current29 Oct 26
ERCOT Reserve MarginPower, grid & cooling + Data centres & coloG3H2026-03-102026H1: 18.3%+6.4% vs 2025H2 · 1-yr avg −1% · Turned upCurrent04 Dec 26
MLCC Unit PriceMaterials & passivesG3M2026-02-282025-10: 0.81 JPY/unit+9.1% vs 2025-09 · 1-yr avg +15% · Rising (slower)Stale30 Sep 26
NAND Contract PriceMemory & storageG3M2026-07-312026-03: 72.5%+15.0pp vs 2026-02 · 1-yr avg +16pp · Rising (slower)Stale30 Sep 26
Storage Device PPIMemory & storageG3M2026-08-142026-07: 117+13.8% vs 2026-06 · 1-yr avg +6% · Rising (slower)Current~14 Sep 26
TW Memory Module RevenueMemory & storageG3M×32026-08-102026-07: $654mn+39.1% vs 2026-04 (3-month window) · 1-yr avg +40% · Rising (slower)Current~10 Sep 26
US PPI hostingCloud & neocloudsG3M2026-08-152026-07: 125+1.1% vs 2026-06 · 1-yr avg +0% · FlatCurrent15 Sep 26
US PPI semiconductorsFoundry & packaging + AI chips & ASICG3M2026-08-142026-07: 29.1−2.7% vs 2026-06 · 1-yr avg −0% · FlatCurrent~14 Sep 26
US electricity pricePower, grid & coolingG3M2026-08-252026-07: $0.20−0.5% vs 2026-06 · 1-yr avg +0% · FlatCurrent~25 Sep 26
Samsung Inventory DaysMemory & storageG2Q2026-08-142026Q2: 124 days+21.9% vs 2026Q1 · 1-yr avg +8% · AcceleratingCurrent~14 Nov 26
Downstream HW: Semi & ODM
AI-Server Rails + BMCServers & ODMG5M2026-08-102026-07: $125mn+36.7% vs 2026-06 · 1-yr avg +14% · AcceleratingCurrent10 Sep 26
GPU/XPU Vendor RevenueAI chips & ASICG5Q2026-05-042026Q1: $63.8bn+19.7% vs 2025Q4 · 1-yr avg +16% · Rising (slower)Current03 Nov 26
TSMC HPC RevenueFoundry & packagingG5M×32026-08-102026-07: $26.8bn+25.0% vs 2026-04 (3-month window) · 1-yr avg +12% · AcceleratingCurrent10 Sep 26
AI Chip ShipmentsAI chips & ASICG4Q2026-07-072026Q2: 4.54 H100e mn+1.6% vs 2026Q1 · 1-yr avg +12% · FlatCurrentEvent-driven
Korea Memory → TaiwanMemory & storage + Foundry & packagingG4M×62026-04-152025-12: $2.7bn+55.2% vs 2025-06 (6-month window) · 1-yr avg +55% · Rising (slower)Stale15 Sep 26
Memory Maker RevenueMemory & storageG4Q2026-07-312026Q2: $96.2bn+55.4% vs 2026Q1 · 1-yr avg +41% · Rising (slower)Current30 Sep 26
T-Glass Cloth RevenueMaterials & passivesG4Q2026-08-072026Q2: $113mn+11.6% vs 2026Q1 · 1-yr avg +6% · AcceleratingCurrent06 Nov 26
TW Electronics OrdersFoundry & packaging + Servers & ODMG4M×32026-08-202026-07: $119bn+20.4% vs 2026-04 (3-month window) · 1-yr avg +16% · AcceleratingCurrent20 Sep 26
TW ICT Export OrdersServers & ODMG4M×32026-08-202026-07: $99.8bn+12.8% vs 2026-04 (3-month window) · 1-yr avg +11% · AcceleratingCurrent20 Sep 26
US Server ImportsServers & ODM + Data centres & coloG4M×32026-09-062026-07: $84.1bn+18.4% vs 2026-04 (3-month window) · 1-yr avg +18% · AcceleratingCurrent06 Oct 26
Korea Chip Exports (10-day)Memory & storageG3W2026-08-222026-08-23: $26.0bn+17.7% vs 2026-07-26 · 1-yr avg +15% · Rising (slower)Current11 Sep 26
TW AI-Server ODM RevenueServers & ODMG3M×32026-08-102026-07: $80.6bn+12.3% vs 2026-04 (3-month window) · 1-yr avg +12% · Rising (slower)Current10 Sep 26
TW ASIC Design RevenueAI chips & ASICG3M×32026-08-102026-07: $218mn+82.6% vs 2026-04 (3-month window) · 1-yr avg +20% · Turned upDeep-dive10 Sep 26
TW memory maker revMemory & storageG3M2026-08-102026-07: 78,366 NT$ mn+37.6% vs 2026-06 · 1-yr avg +16% · AcceleratingCurrent~10 Sep 26
US semi output (IP)Foundry & packagingG3M2026-08-172026-07: 190+1.5% vs 2026-06 · 1-yr avg +1% · FlatCurrent~17 Sep 26
Downstream HW: Peripherals (power, optics)
AI connectivity revenueNetworking & opticsG4Q2026-08-052026Q2: $4.9bn+15.4% vs 2026Q1 · 1-yr avg +14% · AcceleratingCurrent27 Oct 26
Accton Switch RevenueNetworking & opticsG4M×32026-08-102026-07: $3.4bn+40.6% vs 2026-04 (3-month window) · 1-yr avg +14% · AcceleratingDeep-dive10 Sep 26
DC Networking RevenueNetworking & opticsG4Q2026-08-042026Q2: $16.2bn+32.3% vs 2026Q1 · 1-yr avg +29% · AcceleratingCurrent03 Nov 26
Optical Module RevenueNetworking & opticsG4Q2026-08-122026Q2: $7.9bn+22.0% vs 2026Q1 · 1-yr avg +20% · Rising (slower)Current30 Oct 26
Power-Gen Equipment Rev.Power, grid & coolingG4Q2026-08-052026Q2: $4.1bn+14.2% vs 2026Q1 · 1-yr avg +8% · Turned upDeep-dive21 Oct 26
TW Power & Cooling Rev.Power, grid & coolingG4M2026-08-102026-07: $1.3bn+1.8% vs 2026-06 · 1-yr avg +3% · FlatCurrent10 Sep 26
US Transformer ImportsPower, grid & cooling + Data centres & coloG4M×62026-09-062026-07: $2.3bn+11.5% vs 2026-01 (6-month window) · 1-yr avg +7% · AcceleratingCurrent06 Oct 26
TW cable & connector revNetworking & optics + Servers & ODMG3M2026-08-102026-07: 17,068 NT$ mn+9.7% vs 2026-06 · 1-yr avg +4% · AcceleratingCurrent~10 Sep 26
TW optical parts revNetworking & opticsG3M2026-08-102026-07: 1,572 NT$ mn+21.3% vs 2026-06 · 1-yr avg +4% · AcceleratingCurrent~10 Sep 26
TW server-interface chip revServers & ODM + Networking & opticsG3M×32026-08-102026-07: 10,997 NT$ mn+3.8% vs 2026-04 (3-month window) · 1-yr avg +2% · AcceleratingCurrent~10 Sep 26
China Optics ExportsNetworking & opticsG2M×32025-04-202024-12: $3.6bn+4.7% vs 2024-09 (3-month window) · 1-yr avg n/a · Rising (slower)Stale20 Sep 26
TW chassis & rack revServers & ODMG2M×32026-08-102026-07: 11,266 NT$ mn+35.5% vs 2026-04 (3-month window) · 1-yr avg +14% · Turned upCurrent~10 Sep 26
Downstream HW: Data Center
Colo Bookings (DLR+EQIX)Data centres & coloG4Q×22026-08-092026Q2: $1.8bn−3.9% vs 2025Q4 (2-quarter window) · 1-yr avg +28% · Turned downCurrent · like-for-like~09 Nov 26
Frontier DC CapacityData centres & coloG4M2026-08-242026-07: 12,535+3.9% reported, not comparableGreyed: one-off / basis24 Sep 26
Microsoft New DC LeasesData centres & colo + Cloud & neocloudsG4Q×42026-07-302026Q2: $24.6bn+20.0% vs 2025Q2 (4-quarter window) · 1-yr avg +20% · Rising (slower)Current~30 Oct 26
N. America DC Under Constr.Data centres & coloG4Y2026-08-312026: 7,481+24.8% vs 2025 · 1-yr avg +10% · Turned upCurrent01 Mar 27
US DC ConstructionData centres & coloG4M2026-09-012026-07: $75.2bn+6.2% vs 2026-06 · 1-yr avg +4% · Rising (slower)Current01 Oct 26
Utility Contracted DC LoadData centres & colo + Power, grid & coolingG4Q2026-08-062026Q2: 90.2+6.2% vs 2026Q1 · 1-yr avg +20% · Rising (slower)Current29 Oct 26
ERCOT Large-Load ApprovalsData centres & colo + Power, grid & coolingG3M2026-08-202026-05: 9.1+0.6% vs 2026-04 · 1-yr avg +2% · FlatCurrent20 Sep 26
Virginia Commercial Power (YoY)Data centres & colo + Power, grid & coolingG3M2026-08-102026-06: 7,771 GWh+4.8% vs 2025-06 · 1-yr avg +6% · Rising (slower)Current~10 Sep 26
Colo MW Leased (IRM+APLD)Data centres & coloG2Q×22026-08-092026Q2: 635+56.1% vs 2025Q4 (2-quarter window) · 1-yr avg +56% · Rising (slower)Current~09 Nov 26
GDS China Area CommittedData centres & coloG2Q×22026-08-092026Q2: 114,696 sqm+1766.2% reported, not comparableGreyed: one-off / basis~09 Nov 26
NEXTDC Contracted MWData centres & coloG2H2026-08-092026H1: 740+77.7% vs 2025H2 · 1-yr avg +74% · AcceleratingCurrent~09 Feb 27
US DC projects blockedData centres & colo + Power, grid & coolingG2Q2026-07-292026Q2: $68.0bn−47.7% vs 2026Q1 · 1-yr avg −8% · Turned downCurrent28 Oct 26
US hosting jobs (BLS)Data centres & coloG2M2026-09-032026-08: 453 thousands−1.7% vs 2026-07 · 1-yr avg −0% · FlatCurrent03 Oct 26
VNET committed MWData centres & coloG2Q2026-08-202026Q2: 970+11.6% vs 2026Q1 · 1-yr avg +10% · AcceleratingCurrent19 Nov 26
Semicon Upstream Supply
Front-End WFE RevenueSemi equipment & partsG5Q2026-08-102026Q2: $16.4bn+9.8% vs 2026Q1 · 1-yr avg +5% · AcceleratingCurrent14 Oct 26
Packaging & Test Tool Rev.Semi equipment & parts + Foundry & packagingG5Q2026-08-062026Q2: $2.8bn+19.3% vs 2026Q1 · 1-yr avg +11% · AcceleratingCurrent09 Oct 26
CCL & Substrate Inv. DaysMaterials & passivesG4Q2026-08-112026Q2: 74.67 days−6.8% vs 2026Q1 · 1-yr avg +3% · Falling fasterCurrent29 Oct 26
Foundry & Memory CapexFoundry & packaging + Memory & storageG4Q2026-07-312026Q2: $24.0bn+38.4% vs 2026Q1 · 1-yr avg +22% · Turned upDeep-dive30 Sep 26
Global Equipment BillingsSemi equipment & partsG4Q2026-09-032026Q2: $40.5bn+10.9% vs 2026Q1 · 1-yr avg +5% · AcceleratingCurrent03 Dec 26
Japan Equipment BillingsSemi equipment & partsG4M2026-08-252026-07: $3.4bn+7.3% vs 2026-06 · 1-yr avg +3% · AcceleratingCurrent25 Sep 26
MLCC Inventory DaysMaterials & passivesG4Q2026-08-132026Q2: 143 days−1.4% vs 2026Q1 · 1-yr avg +1% · FlatCurrent12 Nov 26
TW ABF Substrate RevenueMaterials & passivesG4M×32026-08-102026-07: $756mn+16.8% vs 2026-04 (3-month window) · 1-yr avg +8% · AcceleratingCurrent~10 Sep 26
TW CCL Makers RevenueMaterials & passivesG4M×32026-08-102026-07: $1.3bn+42.4% vs 2026-04 (3-month window) · 1-yr avg +21% · AcceleratingCurrent10 Sep 26
TW Packaging Tool RevenueSemi equipment & parts + Foundry & packagingG4M2026-08-102026-07: $191mn+18.5% vs 2026-06 · 1-yr avg +6% · AcceleratingCurrent10 Sep 26
TW Tool Parts RevenueSemi equipment & partsG4M2026-08-102026-07: $49mn−5.2% vs 2026-06 · 1-yr avg +3% · Turned downCurrent10 Sep 26
Tool Exports (NL+JP+US)Semi equipment & partsG4M×32026-08-152026-05: $7.2bn−6.5% vs 2026-02 (3-month window) · 1-yr avg −2% · Falling fasterCurrent15 Sep 26
Tool Sub-Supplier RevenueSemi equipment & partsG4Q2026-08-072026Q2: $1.3bn+21.0% vs 2026Q1 · 1-yr avg +6% · AcceleratingCurrent15 Oct 26
AI PCB & Inputs RevenueMaterials & passivesG3M×32026-08-102026-07: $583mn+27.2% vs 2026-04 (3-month window) · 1-yr avg +16% · AcceleratingCurrent10 Sep 26
Copper PriceMaterials & passivesG3M2026-09-052026-07: $13,542.82−0.1% vs 2026-06 · 1-yr avg +3% · FlatCurrent05 Oct 26
Si wafer area (MSI)Materials & passivesG3Q2026-08-052026Q2: 3,573 MSI+9.1% vs 2026Q1 · 1-yr avg +2% · Turned upCurrent04 Nov 26
TW MLCC Makers RevenueMaterials & passivesG3M×32026-08-102026-07: $257mn+18.6% vs 2026-04 (3-month window) · 1-yr avg +9% · AcceleratingCurrent10 Sep 26
US PPI Bare PCBsMaterials & passivesG3M2026-08-152026-07: 194+1.4% vs 2026-06 · 1-yr avg +4% · FlatCurrent15 Sep 26
US fab constructionSemi equipment & parts + Foundry & packagingG3M2026-09-012026-07: $51.3bn−2.1% vs 2026-06 · 1-yr avg −5% · FlatCurrent01 Oct 26
Tool Shipments → TaiwanSemi equipment & parts + Foundry & packagingG2M×32026-08-272026-06: $2.9bn+37.8% vs 2026-03 (3-month window) · 1-yr avg +3% · Turned upCurrent15 Sep 26
Funding
Capex ÷ operating cashCapital & funding + Cloud & neocloudsG5Q2026-07-302026Q2: 97.4%+3.6% vs 2026Q1 · 1-yr avg +9% · Rising (slower)Current29 Oct 26
Hyperscaler CapexCloud & neocloudsG5Q2026-08-202026Q2: $172bn+22.1% vs 2026Q1 · 1-yr avg +19% · AcceleratingCurrent09 Oct 26
Hyperscaler Total DebtCapital & funding + Cloud & neocloudsG5Q2026-08-202026Q2: $867bn+12.9% vs 2026Q1 · 1-yr avg +15% · Rising (slower)Current09 Oct 26
Hyperscaler Free Cash FlowCloud & neoclouds + Capital & fundingG4Q2026-08-202026Q2: −$7.3bnsign flip vs 2026Q1 · 1-yr avg −15% · Falling fasterDeep-dive09 Oct 26
NVIDIA strategic stakesCapital & funding + AI chips & ASICG4Q2026-08-202026Q2: $51.2bn+18.0% vs 2026Q1 · 1-yr avg +100% · Rising (slower)Deep-dive19 Nov 26
Neocloud Equity BasketCapital & funding + Cloud & neocloudsG4W×42026-09-012026-08-30: 162+11.4% vs 2026-08-02 (4-week window) · 1-yr avg +6% · Turned upDeep-dive~13 Sep 26
Signed Leases Not StartedData centres & colo + Capital & fundingG4Q2026-07-292026Q2: $778bn+34.2% vs 2026Q1 · 1-yr avg +49% · Rising (slower)Current28 Oct 26
US IT equipment investmentCapital & funding + Cloud & neocloudsG4Q2026-07-302026Q2: $1.92tn+4.7% vs 2026Q1 · 1-yr avg +4% · Rising (slower)Current~30 Oct 26
AI Hyperscaler Bond IssuanceCapital & funding + Cloud & neocloudsG3M×62026-09-022026-08: $119bn−6.5% vs 2026-02 (6-month window) · 1-yr avg −6% · Turned downCurrent~07 Oct 26
AI Venture FundingCapital & funding + Models & AI appsG3Q×22026-07-102026Q2: $386bn+247.7% vs 2025Q4 (2-quarter window) · 1-yr avg +130% · AcceleratingCurrent~10 Oct 26
AI-Infra Debt IssuanceCapital & fundingG3W×122026-09-012026-08-30: $46.3bn−18.9% vs 2026-06-07 (12-week window) · 1-yr avg +34% · Falling (narrowing)CurrentWeekly
BBB credit spreadCapital & fundingG3M2026-09-012026-08: 98.00 bp+1.0% vs 2026-07 · 1-yr avg +0% · FlatCurrent01 Oct 26
Bank C&I lending standardsCapital & fundingG3Q2026-08-102026Q2: 0.00 net % tightening−8.1pp vs 2026Q1 · 1-yr avg −2pp · Falling fasterCurrent09 Nov 26
Bank construction-loan standardsCapital & funding + Data centres & coloG3Q2026-08-102026Q2: -3.70 net % tightening−8.6pp vs 2026Q1 · 1-yr avg −3pp · Turned downCurrent09 Nov 26
CCC spreadCapital & fundingG3M2026-09-012026-08: 1,026 bp+4.4% vs 2026-07 · 1-yr avg +2% · AcceleratingCurrent01 Oct 26
High-yield spreadCapital & fundingG3M2026-09-012026-08: 270 bp−1.5% vs 2026-07 · 1-yr avg −0% · FlatCurrent01 Oct 26
Neocloud equity raisedCapital & funding + Cloud & neocloudsG3Q×42026-08-202026Q2: $13.6bn+346.6% vs 2025Q2 (4-quarter window) · 1-yr avg +347% · Rising (slower)Current19 Nov 26

Tracked, not yet charted

Series recorded in the database but with too few comparable data points for a chart or a change; each becomes a charted indicator once the history supports it.

SeriesLatestAs ofWhy not charted yetNext update
Fireworks AI tokens processed
Penetration
>40T tokens/day2026-07-15Only three dated company disclosures (10T Oct-25, 15T Apr-26, 40T Jul-26), all 'more than' lower boundsEvent-driven (funding / company posts)
Vercel AI Gateway tokens
Penetration
>1T tokens/day~2026-07-15One interview figure; Vercel's leaderboards publish shares only, no absolute totalsEvent-driven
Entergy signed ESAs (all customers)
Data Center
8 GW cumulative since Jan-242025-06-30No data-center-only cumulative series; later calls give flows (≈3.5 GW in 2025, >1 GW in 1Q26 ex-Meta)Entergy Q3 call (late Oct)
Entergy data-center pipeline
Data Center
7–12 GW (unchanged since 3Q25)2026-06-30Stated as a range that moves only every few quartersEntergy Q3 call (late Oct)
Artificial Analysis Intelligence Index (top model)
Penetration
57.6 (v4.3.2, Claude Opus 5.5); best open-weights 46.32026-09-30Index versions rescale scores (v4.1 → v4.3.2) and the site exposes no history, so points are not comparable yetWeekly snapshot from now on
Heatmap News: data-center projects cancelled / contested
Data Center
$85bn cancelled over 3 years; ~100 new local fights in 1Q262026-05-06Mixed units across articles (counts, $, cumulative vs period)Event-driven
Amphenol IT datacom sales
Peripherals
$3.77bn (43% of sales)2026-06-30Quarterly market split found for two quarters only (derived from % of sales)Amphenol Q3 (late Oct)
Modine Data Center segment revenue
Peripherals
$349mn2026-06-30Recast segment basis; other quarters published only as YoY %Modine FQ2 (late Oct)
VNET new wholesale orders
Data Center
345 MW in 2Q262026-06-30CEO-quoted, not a standard KPI; three quarters missingVNET Q3 (Nov)
Upcoming prints and indicatorsprints due next month and indicators to add next; KEY / HIGH highlighted, the rest greyed

Release calendar of every member (earnings dates CIQ-confirmed where available). Click an indicator for its card.

1 · Regular updates — indicators that already print weekly or monthly

Due in the next month. KEY = the 7 most important by Grade, named watch item and this week's deep-dives; the rest are greyed and folded.

First printIndicatorWhat prints (members)What to watch
KEY10 Sep
Next week
TSMC HPC Revenue
Semi & ODM · G5
TSMC10 Sep: TSMC August revenue; does HPC growth hold above +25%?
KEY10 Sep
Next week
Accton Switch Revenue
Peripherals · G4
Accton10 Sep: Accton August revenue; does switch growth stay above +40%?
KEY10 Sep
Next week
TW Power & Cooling Rev.
Peripherals · G4
Asia Vital Components, Auras, Delta Electronics, Lite-On10 Sep: AVC and Auras August revenue; does power and cooling leave its +2% plateau?
KEY10 Sep
Next week
TW ASIC Design Revenue
Semi & ODM · G3
Alchip, Global Unichip10 Sep: Alchip and GUC August revenue; can the +83% pace hold after Broadcom's guide?
KEY14 Sep
Next month
Grid Equipment PPI
Supply-Demand · G5
US PPI14 Sep: August grid-equipment PPI; does the +2.8% rise extend?
KEY15 Sep – 06 Oct
Next month
Tool Exports (NL+JP+US)
Semicon Upstream · G4
Netherlands HS 8486, Japan HS 8486 Exports, US HS 8486 Exports15 Sep: NL and JP tool exports; do shipments start catching up with +38% fab capex?
KEY25 Sep
Next month
Japan Equipment Billings
Semicon Upstream · G4
SEAJ Japan-Made25 Sep: SEAJ August billings; does Japan's +7% turn extend after TSMC's 1.9x procurement remark?
29 lower-priority printsgreyed: lower Grade or no watch item this week
First printIndicatorWhat prints (members)What to watch
10 Sep
Next week
China GenAI Filings
Penetration · G5
China CAC
10 Sep
Next week
AI-Server Rails + BMC
Semi & ODM · G5
ASPEED, King Slide
10 Sep
Next week
TW Packaging Tool Revenue
Semicon Upstream · G4
All Ring Tech, C Sun, Chroma ATE, Chunghwa Precision Test, Gallant Micro, Gallant Precision …
10 Sep
Next week
TW Tool Parts Revenue
Semicon Upstream · G4
Foxsemicon, Gudeng Precision
10 Sep
Next week
TW CCL Makers Revenue
Semicon Upstream · G4
ITEQ
10 Sep
Next week
TW AI-Server ODM Revenue
Semi & ODM · G3
Gigabyte, Hon Hai, Inventec, Quanta, Wistron
10 Sep
Next week
TW MLCC Makers Revenue
Semicon Upstream · G3
Walsin Technology, Yageo
10 Sep
Next week
AI PCB & Inputs Revenue
Semicon Upstream · G3
Fulltech
11 Sep – 01 Oct
Next week
Korea Chip Exports (10-day)
Semi & ODM · G3
Korea Customs 1-10 / 1-20
15 Sep
Next month
Korea Memory → Taiwan
Semi & ODM · G4
Korea HS 8542.32 Memory
15 Sep
Next month
US firms paying for AI (Ramp)
Penetration · G4
Ramp AI Index
15 Sep
Next month
US PPI hosting
Supply-Demand · G3
BLS PPI hosting and data
15 Sep
Next month
US PPI Bare PCBs
Semicon Upstream · G3
BLS PPI series via FRED
15 Sep – 27 Sep
Next month
Tool Shipments → Taiwan
Semicon Upstream · G2
Netherlands HS 8486, Japan HS 8486 Exports
17 Sep – 01 Oct
Next month
US Firm AI Use (BTOS)
Penetration · G4
US Census BTOS
20 Sep
Next month
TW Electronics Orders
Semi & ODM · G4
Taiwan Export Orders
20 Sep
Next month
TW ICT Export Orders
Semi & ODM · G4
Taiwan Export Orders
20 Sep
Next month
ERCOT Large-Load Approvals
Data Center · G3
ERCOT Large Loads
24 Sep
Next month
Frontier DC Capacity
Data Center · G4
Epoch AI Frontier Data
30 Sep
Next month
DRAM Contract Guidance
Supply-Demand · G4
TrendForce DDR5 Server/PC
01 Oct
Next month
US DC Construction
Data Center · G4
US Census C30
01 Oct
Next month
US fab construction
Semicon Upstream · G3
Census C30 construction
01 Oct
Next month
BBB credit spread
Funding · G3
FRED BAMLC0A4CBBB,
01 Oct
Next month
High-yield spread
Funding · G3
FRED BAMLH0A0HYM2,
01 Oct
Next month
CCC spread
Funding · G3
FRED BAMLH0A3HYC, monthly
03 Oct
Next month
US hosting jobs (BLS)
Data Center · G2
BLS CES employment, NAICS
05 Oct
Next month
Copper Price
Semicon Upstream · G3
FRED PCOPPUSDM
06 Oct
Next month
US Server Imports
Semi & ODM · G4
US Imports HS 8471.50
06 Oct
Next month
US Transformer Imports
Peripherals · G4
US Imports HS 8504.23

2 · Less frequent releases due next — quarterly, half-yearly, annual

Earnings seasons and periodic reports landing in the next month; these reset the quarterly indicators and the consensus paths.

First printIndicatorWhat prints (members)What to watch
KEY30 Sep
Next month
Foundry & Memory Capex
Semicon Upstream · G4
Micron Cash CapitalSK hynix and TSMC capex versus their latest full-year guidance.
1 lower-priority printsgreyed: lower Grade or no watch item this week
First printIndicatorWhat prints (members)What to watch
30 Sep
Next month
Memory Maker Revenue
Semi & ODM · G4
Micron Quarterly Revenue

3 · Upcoming indicators — candidates to add next

From the AI sourcing deck (Box) and Notion supply-chain notes. HIGH = free, monthly and on a named bottleneck; the rest are greyed.

Upcoming indicatorChain linkWhy it mattersSource · frequencyStatus
HIGHCCL export unit price (HS 7410.21, TW/JP/KR)Materials & passivesCCL is named bottleneck; unit value captures M8/M9 mix upgrade and price hikes before company guidanceTaiwan MOF customs (portal.sw.nat.gov.tw) + Japan e-Stat trade; monthly, ~T+10-30dcandidate
HIGHCopper foil export unit price (HS 7410.11, JP->TW/CN)Materials & passivesHVLP4 foil faces 3.5-4k t/month 2027 gap; rising unit value = shortage premiumJapan MoF trade stats via e-Stat; monthly (~T+30d)candidate
HIGHGlass-fibre fabric export unit price (HS 7019.5x/7019.40, JP->TW/CN)Materials & passivesPrice-level complement to T-glass revenue; Nittobo 90-95% T-glass share, +20% hike, 3x expansion 27/28Japan MoF trade via e-Stat; monthlycandidate
HIGHTaiwan CCL & PCB production / sales / inventory (MOEA)Materials & passivesOnly free direct inventory read on CCL/PCB; inventory draw + price up = true tightnessMOEA Dept of Statistics industrial production-sales-inventory survey; monthly ~T+25dcandidate
HIGHTantalum capacitor unit price & inventory (METI + HS 8532.21)Power, grid & coolingExpert: GB300 ~5,000 tantalum caps; KEMET +10%, AVX followed, further +20-30%; tightest passiveMETI 生産動態統計 (e-Stat) monthly; US Census trade API monthlycandidate
HIGHUS PPI - capacitors, resistors, inductorsPower, grid & coolingCross-checks MLCC/tantalum price hikes with an official, low-noise seriesBLS PPI via FRED; monthlyblocked: FRED/BLS rate limit 2026-09-30, retry
HIGHBOJ CGPI - electronic components (PWB, capacitors)Materials & passivesJapan owns high-end foil, glass, MLCC; its export price index leads Asia component pricingBOJ Time-Series Data Search; monthly (~T+10d)candidate
AXT InP substrate revenueNetworking & opticsInP is the only tight III-V wafer; EML for 1.6T optics gated by substrate rampAXT 10-Q / earnings release; quarterlycandidate
Ajinomoto ABF film volume/revenueMaterials & passivesMonopoly ABF film input; volume leads ABF substrate utilisation (>90% at leaders through 2027)Ajinomoto IR data book; quarterlycandidate
Ibiden Electronics segment sales & marginMaterials & passivesPurest AI-GPU ABF substrate read; margin shows pricing power under T-glass constraintCIQ segments / Ibiden IR; quarterlycandidate
Laser (EML) supplier backlog / book-to-bill (LITE+COHR)Networking & opticsEML shortage 2025-26 is the binding optics constraint; backlog gives lead-time proxyEarnings calls / 10-Q; quarterlycandidate
DRAM spot price (DDR5 16Gb)Memory & storageLeads monthly contract guidance by 1-2 months; catches memory shortage turn earlierTrendForce DRAMeXchange public page; dailycandidate
Tantalum / MLCC price-notice event logPower, grid & coolingHikes appear months before PPIs; event-type indicator for rolling 12w windowWeb/news search (Digitimes, Nikkei, TrendForce); weeklycandidate
PCB equipment orders (Han's CNC drilling/LDI)Semi equipment & partsAI PCB equipment TAM 3.8x 2024-26E; capex lead for HDI/HLC capacityCIQ / SZSE filings; quarterlycandidate
GaN-on-Si power device utilisation (Innoscience)Power, grid & cooling800V HVDC demand signal; but sector ~45% utilised so contrarian oversupply checkHKEX filings; half-yearlycandidate
US PPI - bare printed circuit boardsMaterials & passivesClean, long-history PCB price read; confirms M8/M9 and high-layer pricing passing throughBLS PPI via FRED; monthly (~T+15d)added v6: lead_mat_ppi_pcb_m
LME copper cash priceMaterials & passivesFoil is 35-40% of CCL cost; needed to net raw-material pass-through from true shortage premiumIMF via FRED; monthly (daily via COMEX HG=F yfinance)added v6: lead_mat_copper_px_m

Updated every week (not listed): AI-Infra Debt Issuance, OpenRouter Tokens.

OpenRouter Tokens

OpenRouter weekly tokens · Penetration · Grade 2
AWhy it is importantModels & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps — Developer multi-model API gateway
Why it mattersTokens are the unit of AI inference demand; rising volume means more model calls, pulling on compute and memory.
How representativeOpenRouter ~10T tokens/week is about 1% of est. global API and first-party tokens; small, but a fast, open read on developer model choice and demand trend.
TimingCoincident — Tokens are consumed as requests happen
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionWeekly count of tokens processed through OpenRouter, a gateway that routes developer requests to many AI models.
Higher = more developer inference demand, though promotions can inflate it.
Formula
Readingt = Vt
where V = the member's reported value in tokens/wk:
TermMember (reported series)Native unitAI shareWeight
VOpenRouter Weekly Tokens Processedtokens/wk—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous week
1-yr average = mean of Change over the past 12 months 47 observations
Unittokens/wk; change in %
FrequencyWeekly · latest period 2026-08-30 · recorded 2026-09-01
ScopeGlobal (OpenRouter users) · All models routed through OpenRouter; excludes first-party traffic at Google, OpenAI, Microsoft and China platforms.
Share of global total: <5% — About 1% of est. global API + first-party tokens (~10T/week vs ~4,300T/month total).
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise3 / 5SNR 3.0: the only weekly token series, but free or stealth model promotions cause spikes unrelated to underlying demand.
Reliability3 / 5Reliability 3.0: platform-published counts with no audit; users skew to coding and the definition is stable.
Scope<5%Scope score 2: under 1% of global tokens, so it is a sample rather than a market total.
Grade2 / 50.5 × SNR 3 + 0.5 × reliability 3 − 0.5 (scope < 10%) = 2.50 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.0050T100TLevel (tokens/wk)Change vs prior period (%)1-yr avg +8%+6%+10%−22%+5%17 Sep24 Dec31 Mar07 Jul13 Oct19 Jan27 Apr03 Aug09 Nov15 Feb24 May30 Aug
Latest2026-08-30: 113T
Compared with2026-08-23: 93T
Change+21.0% · 4-wk vs prior 4-wk +52.4%
1-yr avg change+8.2% per week (47 obs)
MomentumRising (slower)
DriverOpenRouter Weekly Tokens Processed: 20T (100% of the change)
ERecent news
  • 2026-08-05DeepSeek V4 Flash topped OpenRouter's weekly ranking with 7.22 trillion tokens, with Chinese models leading platform token volume. link ↗ Indicator then: 02 Aug −2.2%
  • 2026-07-08Chinese models reached up to 46% of US enterprise token usage on OpenRouter as the cost of US frontier models rose. link ↗ Indicator then: 05 Jul −0.0%

US Disclosed Tokens

US company-disclosed tokens (Google, OpenAI API) · Penetration · Grade 3
AWhy it is importantModels & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps — US-disclosed tokens (Google, OpenAI API)
Why it mattersToken volume at the largest US providers sets inference load; growth here drives GPU, memory and power orders upstream.
How representativeGoogle ~1,300T plus OpenAI API ~260T is ~36% of est. global tokens per month; mainly Google consumer and cloud surfaces plus OpenAI developer traffic.
TimingLeading — Inference load precedes capacity orders
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly tokens processed by Google and OpenAI's API, based on figures the companies disclose at earnings and events.
Higher = more AI inference running on the two largest US token platforms.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Google Monthly Tokens Processedtokens T/month100%83%
V2OpenAI API Tokens per Minutetokens T/month100%17%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 3 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
Unittokens T/month; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-28
ScopeUS company-disclosed · Google all-surface tokens (weight 0.83) and OpenAI API tokens (0.17); Microsoft and Fireworks dropped in v8 because they no longer disclose.
Share of global total: 36% — 36% of est. global tokens: Google ~1,300T + OpenAI API ~260T = ~1,560T/month vs ~4,300T/month.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise2.8 / 5SNR 2.8: Google's definition switched several times and includes AI Overviews and reasoning tokens; OpenAI prints come only at events.
Reliability3.8 / 5Reliability 3.8: company statements, not audited filings; OpenAI figures are promotional and 6-12 months apart.
Scope36%Covers 36% of global tokens, so it is the largest disclosed block but still not the whole market.
Grade3 / 50.5 × SNR 2.8 + 0.5 × reliability 3.8 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.005001,0001,500Level (tokens T/month)Change vs prior period (%)1-yr avg +81%+129%+94%+19%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 1,598 T
Compared with2026Q1: 1,339 T
Change+19.4%
1-yr avg change+80.6% per quarter (3 obs)
MomentumRising (slower)
DriverGoogle +259T (691T to 950T); OpenAI flat at 648T, so the blended gain fell to 19% from 94%.
EWhy it moved

What changed. 2026Q2: 1,598 T, +19.4% vs 2026Q1 (1-yr average +80.6% per quarter).

  • All of the 2026Q2 gain came from Google, whose Gemini API run-rate rose about 37% QoQ (691T to 950T tokens/month); OpenAI's leg was carried flat at 648T because no newer figure was disclosed.
  • On its 22 Jul 2026 Q2 call Alphabet said developers were pushing more than 22B tokens per minute through Gemini APIs, up from 16B in Q1 and 10B at end-2025, with Cloud revenue up 82% on inference demand.
  • Blended growth slowed from +94% to +19% mainly because OpenAI's last API disclosure (15B tokens per minute in April 2026, from 6B in October 2025) was already in the Q1 base, so half the aggregate had no update.
  • The next OpenAI API disclosure is the swing factor: if it keeps its October-to-April pace (about 2.5x in five months), the blended growth rate would re-accelerate well above Q2's 19%.
  • So what: Google's own leg (+37% QoQ) kept pace with Cloud revenue (+82% YoY), so inference demand is still compounding; the blended slowdown reflects a missing OpenAI update, not weaker usage.
FRecent news
  • 2026-07-22Google said its model APIs now process about 22 billion tokens per minute on the Q2 2026 earnings call, with nearly 500 Cloud customers each above 1 trillion tokens in a year. link ↗ Indicator then: 2Q26 +19.4%

Open the full deep-dive ↓

China Daily Tokens

China all-model daily tokens (National Data Administration) · Penetration · Grade 4
AWhy it is importantModels & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps — China national LLM token calls
Why it mattersShows how much AI inference China runs, which drives demand for domestic accelerators and cloud capacity.
How representativeChina ~30T tokens/day (~900T/month) is ~20% of est. global tokens; official national total across all Chinese models.
TimingCoincident — Official total of calls as they occur
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionDaily count of tokens processed by all large language models in China, reported by the National Data Administration.
Higher = more AI inference across China's model ecosystem.
Formula
Readingt = Vt
where V = the member's reported value in tokens T/day:
TermMember (reported series)Native unitAI shareWeight
VChina All-Models Daily Tokenstokens T/day—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous year
1-yr average = mean of Change over the past 12 months 1 observations
Unittokens T/day; change in %
FrequencyYearly · latest period 2026 · recorded 2026-04-07
ScopeChina (official) · National total of LLM token calls across all models; Doubao, SiliconFlow and IDC MaaS figures are subsets kept raw-only.
Share of global total: 20% — About 20% of est. global tokens: ~30T/day = ~900T/month vs ~4,300T/month.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise3 / 5SNR 3.0: an official total, but prints are sparse and the method is unpublished, so period-to-period moves are hard to interpret.
Reliability5 / 5Reliability 5.0: official government statistic, though methodology is not disclosed and long gaps separate prints.
Scope20%Covers ~20% of global tokens, so it is the only national-level view of China's usage.
Grade4 / 50.5 × SNR 3 + 0.5 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.0050.0100150Level (tokens T/day)Change vs prior period (%)1-yr avg +40%+99900%+40%2023202420252026
Latest2026: 140 T
Compared with2025: 100 T
Change+40.0%
1-yr avg change+40.0% per year (1 obs)
MomentumRising (slower)
DriverChina All-Models Daily Tokens: 40 T (100% of the change)
ERecent news
  • 2026-08-30China launched new data pilots and began testing token subscriptions, formalising tokens as a traded unit of AI usage. link ↗ Indicator then: 2025 +99900.0%
  • 2026-07-14Approaching.ai raised 1 billion yuan in a Series A to expand AI token factories serving rising domestic demand. link ↗ Indicator then: 2025 +99900.0%

US Firm AI Use (BTOS)

US firms using AI (Census BTOS) · Penetration · Grade 4
AWhy it is importantEnterprise & consumer use · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionEnterprise & consumer use — US firm-level AI adoption
Why it mattersEnterprise adoption sets the durable revenue base for AI software and cloud; slowing use would weaken the demand case for capacity.
How representativeCensus BTOS panel of ~1.2M US employer firms; the US is ~26% of world GDP, so ~25% of the global enterprise base.
TimingLagging — Firms adopt after models and tools mature
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionShare of US employer firms that report using AI in any business function, from the Census Bureau's biweekly survey.
Higher = broader enterprise adoption of AI across US businesses.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VUS Census BTOS%—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous week
1-yr average = mean of Change over the past 12 months 24 observations
Unit%; change in %
FrequencyWeekly · latest period 2026-08-23 · recorded 2026-08-30
ScopeUS · Census BTOS panel of about 1.2M US employer firms; forward-looking 6-month question and size-class splits stay raw-only.
Share of global total: 25% — 25% of the global enterprise base, since the US is ~26% of world GDP (IMF 2026).
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise3 / 5SNR 3.0: readings often reverse (29% of periods change direction) and the 2025-11 rewording lifted readings from ~10% to ~17-20%.
Reliability5 / 5Reliability 5.0: official Census survey with a large panel; use only the post-2025-11 series.
Scope25%Covers ~25% of the global enterprise base, so it represents the largest single economy.
Grade4 / 50.5 × SNR 3 + 0.5 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.00%10.0%20.0%Level (%)Change vs prior period (%)1-yr avg +4%+8%−2%+6%+4%+0%+1%+4%+1%−6%+73%+3%+1%+0%10 Sep17 Dec24 Mar30 Jun06 Oct12 Jan20 Apr27 Jul02 Nov08 Feb17 May23 Aug
Latest2026-08-23: 22.4%
Compared with2026-08-09: 21.8%
Change+2.8% · 4-wk vs prior 4-wk +7.5%
1-yr avg change+4.3% per week (24 obs)
MomentumFlat
DriverUS Census BTOS: 0.60% (100% of the change)
ERecent news
  • 2026-07-23NC Commerce published Census BTOS data showing limited AI adoption among North Carolina businesses. link ↗ Indicator then: 12 Jul +5.3%

US Worker GenAI Use

US workers using GenAI (St. Louis Fed RPS) · Penetration · Grade 3
AWhy it is importantEnterprise & consumer use · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionEnterprise & consumer use — US worker GenAI use at work
Why it mattersWorker usage shows whether GenAI is becoming daily practice, which supports paid seats and recurring inference demand.
How representativeRepresentative US worker survey; the US is ~26% of world GDP, so ~25% of the global base. A worker view distinct from firm adoption.
TimingLagging — Usage follows tool rollout and habit forming
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionShare of US workers who use generative AI at work, from the St. Louis Fed's Real-Time Population Survey.
Higher = deeper day-to-day worker use of GenAI, a demand signal for seats and tokens.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VSt. Louis Fed Real-Time Population Survey%—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Unit%; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-21
ScopeUS · Representative US worker survey; a worker lens that is distinct from the firm-level Census share.
Share of global total: 25% — 25% of the global base, since the US is ~26% of world GDP.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise2 / 5SNR 2.0: waves are sparse and answers are sensitive to question wording (St. Louis Fed note 'How you ask matters', 2026-06).
Reliability4 / 5Reliability 4.0: Federal Reserve survey with a consistent panel, but wording effects and sparse waves limit precision.
Scope25%Covers ~25% of the global base, so it speaks for the US only.
Grade3 / 50.5 × SNR 2 + 0.5 × reliability 4 = 3.00 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
20.0%30.0%40.0%50.0%Level (%)Change vs prior period (%)1-yr avg +7%−7%+6%+7%+6%+9%+7%+4%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 45.2%
Compared with2026Q1: 43.4%
Change+4.1%
1-yr avg change+6.6% per quarter (4 obs)
MomentumRising (slower)
DriverSt. Louis Fed Real-Time Population Survey: 1.79% (100% of the change)
ERecent news
  • 2026-09-01The St. Louis Fed published an analysis of which tasks workers use generative AI for, based on its Real-Time Population Survey. link ↗ Indicator then: 2Q26 +4.1%
  • 2026-07-16The St. Louis Fed released new survey findings on AI adoption and its effects on employment and productivity. link ↗ Indicator then: 2Q26 +4.1%

EU Firm AI Use

EU enterprises using AI (Eurostat) · Penetration · Grade 5
AWhy it is importantEnterprise & consumer use · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionEnterprise & consumer use — EU firm-level AI adoption (10+ staff)
Why it mattersShows enterprise uptake outside the US, the second large software market, and so the breadth of AI demand.
How representativeEurostat survey of EU27 firms with 10+ staff; EU27 is ~17% of world GDP, so ~15% of the global base. Annual and slow.
TimingLagging — Annual survey reports past-year usage
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionShare of EU27 enterprises with 10 or more staff that use AI, published annually by Eurostat.
Higher = broader enterprise AI adoption in Europe.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VEurostat%—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous year
1-yr average = mean of Change over the past 12 months 1 observations
Unit%; change in %
FrequencyYearly · latest period 2025 · recorded 2026-01-10
ScopeEU27 · Official Eurostat survey (isoc_eb_ai) of EU27 enterprises with 10+ staff; smaller firms are excluded.
Share of global total: 15% — 15% of the global base, since EU27 is ~17% of world GDP.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise4 / 5SNR 4.0: annual frequency removes short-term noise, but the information arrives slowly.
Reliability5 / 5Reliability 5.0: official statistical release with a stable definition, published about December.
Scope15%Covers ~15% of the global base, so it is a mid-sized regional read.
Grade5 / 50.5 × SNR 4 + 0.5 × reliability 5 = 4.50 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
5.00%10.0%15.0%20.0%Level (%)Change vs prior period (%)1-yr avg +48%+5%+67%+48%2022202320242025
Latest2025: 19.9%
Compared with2024: 13.5%
Change+48.0%
1-yr avg change+48.0% per year (1 obs)
MomentumRising (slower)
DriverEurostat: 6.47% (100% of the change)
ERecent news

No specific event news found for this period.

China GenAI Filings

China GenAI services filed (CAC) · Penetration · Grade 5
AWhy it is importantModels & AI apps + Enterprise & consumer use · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps + Enterprise & consumer use — China registered GenAI services
Why it mattersCounts how many public GenAI services China has cleared; more filings mean wider supply of apps competing for users and compute.
How representativeMandatory filing covers all public GenAI services in China, ~15% of the global base by GDP; counts services, not users or revenue.
TimingCoincident — Filings track launches as approved
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCumulative number of generative AI services that have completed mandatory filing with China's Cyberspace Administration (CAC).
Higher = more GenAI services launched in China; a supply-side diffusion measure, not usage.
Formula
Readingt = Vt
where V = the member's reported value in count:
TermMember (reported series)Native unitAI shareWeight
VChina CACcount—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 5 observations
Unitcount; change in %
FrequencyMonthly · latest period 2026-06 · recorded 2026-08-14
ScopeChina (official) · Registry of all public GenAI services in China, national filings plus local registrations; counts services, not users or revenue.
Share of global total: 15% — 15% of the global base, since China is ~17% of world GDP and filing is mandatory.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise4 / 5SNR 4.0: a smooth cumulative count (446 added in 2025), but batch timing follows regulatory policy rather than demand.
Reliability5 / 5Reliability 5.0: official administrative count published in bimonthly batches.
Scope15%Covers ~15% of the global base, so it reads China as a whole.
Grade5 / 50.5 × SNR 4 + 0.5 × reliability 5 = 4.50 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
2004006008001,000Level (count)Change vs prior period (%)1-yr avg +13%+15%+27%+22%Jun-23Sep-23Dec-23Mar-24Jun-24Sep-24Dec-24Mar-25Jun-25Sep-25Dec-25Mar-26Jun-26
Latest2026-06: 988
Compared with2026-04: 868
Change+13.8%
1-yr avg change+13.1% per month (5 obs)
MomentumAccelerating
DriverChina CAC: 120 (100% of the change)
ERecent news
  • 2026-07-15China's cyberspace regulator cleared seven more mobile generative AI services, including Apple Intelligence, adding to the cumulative filed-services count. link ↗ Indicator then: Jun-26 +13.8%

US AI Lab Run-Rate

Frontier-lab revenue run-rate (OpenAI + Anthropic) · Penetration · Grade 2
AWhy it is importantModels & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps — Frontier-lab revenue run-rate
Why it mattersLab revenue shows whether AI demand converts into paying customers, which funds training and inference compute orders.
How representativeOpenAI ~$30bn plus Anthropic ~$25bn is ~75% of global model-lab revenue; mainly enterprise API, coding and subscription customers.
TimingLeading — Revenue growth underwrites later compute purchases
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionAnnualized revenue run-rate of OpenAI and Anthropic, the two largest frontier model labs.
Higher = more paying demand for frontier models and APIs.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1OpenAI Annualized Revenue Run-RateUSD bn100%55%
V2Anthropic Annualized Revenue Run-RateUSD bn100%45%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 2 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD bn; change in %
FrequencyMonthly · latest period 2026-02 · recorded 2026-03-07
ScopeGlobal (US labs) · OpenAI (weight 0.55) and Anthropic (0.45); xAI, Mistral, Gemini API inside Google Cloud and China labs are outside.
Share of global total: 75% — About 75% of global model-lab revenue (OpenAI ~$30bn + Anthropic ~$25bn).
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise3 / 5SNR 3.0: event-driven disclosures bucketed monthly; run-rate annualization windows vary, though the revenue is entirely AI.
Reliability2.5 / 5Reliability 2.5: leaks and funding-timed statements; ARR versus recognized revenue and gross versus net definitions differ between the labs.
Scope75%Covers ~75% of global lab revenue, so it is close to the whole lab market.
Grade2 / 50.5 × SNR 3 + 0.5 × reliability 2.5 = 2.75 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$10.0bn$20.0bn$30.0bn$40.0bnLevel (USD bn)Change vs prior period (%)1-yr avg +79%Feb-23May-23Aug-23Nov-23Feb-24May-24Aug-24Nov-24Feb-25May-25Aug-25Nov-25Feb-26
Latest2026-02: $39.0bn
Compared with2025-12: $29.0bn
Change+34.5%
1-yr avg change+78.8% per month (2 obs)
MomentumRising (slower)
DriverOpenAI Annualized Revenue Run-Rate: $5.0bn (50% of the change)
ERecent news
  • 2026-08-17Anthropic's revenue run rate reportedly passed $65 billion ahead of a planned IPO. link ↗ Indicator then: Feb-26 +34.5%

China AI Lab Revenue

China model-lab revenue (Zhipu + MiniMax) · Penetration · Grade 4
AWhy it is importantModels & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps — Listed China model labs
Why it mattersRevenue at Chinese labs shows monetization of domestic models, a signal for China compute and cloud demand.
How representativeZhipu plus MiniMax ~$0.45bn a year is under 1% of ~$75bn global lab revenue; small, but the only listed read on China lab monetization.
TimingLagging — Semiannual reports on past-half results
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionSemiannual revenue reported by two listed Chinese model labs, Zhipu AI and MiniMax.
Higher = more monetization of Chinese foundation models.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Zhipu AI (2513.HK) RevenueCNY mn100%50%
V2MiniMax (0100.HK) RevenueUSD mn100%50%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous half-year
1-yr average = mean of Change over the past 12 months 1 observations
Non-USD members are converted at the half-year-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyHalf-yearly · latest period 2025H2 · recorded 2026-04-02
ScopeChina (listed labs) · Zhipu (2513.HK) and MiniMax (0100.HK), each weight 0.5; unlisted labs and big-tech models are outside.
Share of global total: <5% — Under 1% of global lab revenue: ~$0.45bn vs ~$75bn.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise4 / 5SNR 4.0: filed revenue that is entirely AI, but the history is short since both listed in 2026-01.
Reliability5 / 5Reliability 5.0: exchange-filed interim (~Aug) and annual (~Mar) reports; pre-IPO media estimates are void.
Scope<5%Covers under 1% of global lab revenue, so it is a China monetization read, not a market total.
Grade4 / 50.5 × SNR 4 + 0.5 × reliability 5 − 0.5 (scope < 10%) = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$50mn$75mn$100mn$125mnLevel (USD mn)Change vs prior period (%)1-yr avg +118%+118%2022H22023H12023H22024H12024H22025H12025H2
Latest2025H2: $128mn
Compared with2025H1: $59mn
Change+117.6%
1-yr avg change+117.6% per half-year (1 obs)
MomentumRising (slower)
DriverZhipu AI (2513.HK) Revenue: $51mn (74% of the change)
ERecent news
  • 2026-08-31Zhipu (Z.ai) reported roughly 400% first-half revenue growth with a narrower loss in its first post-IPO interim report. link ↗ Indicator then: 2025H2 +117.6%
  • 2026-08-26MiniMax published first-half 2026 results showing accelerating revenue. link ↗ Indicator then: 2025H2 +117.6%

Cloud AI Revenue

Cloud AI revenue (hyperscalers, neoclouds, Alibaba; AI-weighted) · Penetration · Grade 5
AWhy it is importantCloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCloud & neoclouds — Cloud and neocloud AI revenue
Why it mattersCloud revenue is where AI compute is sold; it shows whether chip and data-centre capex earns a return.
How representativeAWS 30% + Microsoft 21% + Google 13% + Alibaba 4% + neoclouds ~4% is ~70% of global cloud revenue; AI-weighted; mainly enterprise and lab customers.
TimingCoincident — Revenue recognised as compute is used
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of major cloud providers, each multiplied by an estimated AI share of that business.
Higher = more paid AI cloud consumption, both hyperscaler and neocloud.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Amazon Web Services Segment RevenueUSD bn15%24%
V2Google Cloud Segment RevenueUSD bn30%28%
V3Microsoft Intelligent Cloud Segment RevenueUSD bn20%30%
V4CoreWeave Revenue ($B/qtr)USD bn95%9%
V5Nebius Group Revenue ($M/qtr)USD mn90%2%
V6IREN Total Revenue ($M/qtr)USD mn60%1%
V7Alibaba Cloud Intelligence Group RevenueCNY bn30%6%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Non-USD members are converted at the quarter-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-26
ScopeGlobal · AWS, Google Cloud, Microsoft Intelligent Cloud, CoreWeave, Nebius, IREN and Alibaba Cloud; Azure growth %, Oracle OCI and Copilot seats stay raw-only.
Share of global total: 70% — About 70% of global cloud: Synergy Q2-2026 AWS 30% + Microsoft 21% + Google 13% + Alibaba 4% + neoclouds ~4%.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise4.2 / 5SNR 4.2: reported segments with stable definitions, but AI shares are estimates (15-95%) and Microsoft segments were redrawn in 2024-08.
Reliability5 / 5Reliability 5.0: audited company filings for every member.
Scope70%Covers ~70% of global cloud, so it is close to the whole market.
Grade5 / 50.5 × SNR 4.2 + 0.5 × reliability 5 = 4.60 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$10.0bn$15.0bn$20.0bn$25.0bn$30.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +11%−4%+7%+3%+8%+6%+7%+4%+11%+8%+10%+9%+17%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $26.8bn
Compared with2026Q1: $22.9bn
Change+17.4%
1-yr avg change+11.3% per quarter (4 obs)
MomentumAccelerating
DriverGoogle Cloud +$1.42B (6.0B to 7.43B AI-weighted), Intelligent Cloud +$0.93B, AWS +$0.70B, CoreWeave +$0.47B.
ERecent news
  • 2026-09-03Microsoft will disclose Azure quarterly revenue for the first time, giving a clearer dollar read on AI cloud growth. link ↗ Indicator then: 2Q26 +17.4%
  • 2026-08-18Google Cloud grew 82% in Q2 versus 43% for Azure and 37% for AWS. link ↗ Indicator then: 2Q26 +17.4%
  • 2026-07-30AWS posted its fastest growth since 2021 in Q2 on AI and chip demand, with capex raised sharply. link ↗ Indicator then: 2Q26 +17.4%

AI Compute Backlog

Cloud and neocloud AI compute backlog (RPO) · Supply-Demand · Grade 4
AWhy it is importantCloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCloud & neoclouds — Contracted AI compute backlog
Why it mattersBacklog is signed future compute demand; growth tells suppliers of chips, power and sites that orders are committed.
How representativeFive filers (Oracle, Microsoft, Amazon, Google Cloud, CoreWeave) hold ~80% of disclosed multi-year AI compute commitments; heavily OpenAI and Anthropic contracts.
TimingLeading — Contracts signed before capacity is built
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionContracted but not yet recognized revenue (RPO or backlog) at cloud and neocloud providers, weighted by AI share.
Higher = customers, mainly AI labs, pre-committing to more multi-year compute capacity.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Oracle Remaining Performance ObligationsUSD bn75%53%
V2Microsoft Commercial Remaining Performance ObligationUSD bn45%26%
V3Amazon Remaining Performance ObligationsUSD bn30%9%
V4Google Cloud Revenue Backlog ($B)USD bn40%7%
V5CoreWeave Revenue Backlog ($B)USD bn100%5%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-11
ScopeGlobal · Oracle, Microsoft, Amazon, Google Cloud and CoreWeave; Nebius-Microsoft and private neoclouds are not covered.
Share of global total: 80% — About 80% of disclosed multi-year AI compute commitments (five filers hold ~85%, including OpenAI-Oracle $300bn).
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Importance 5: backlog directly records signed multi-year AI compute demand before it turns into revenue.
Signal / noise2.6 / 5SNR 2.6: large single contracts (OpenAI, Meta, Anthropic) cause step-ups, and Oracle and Microsoft RPO include non-AI business.
Reliability5 / 5Reliability 5.0: filed quarterly data; fiscal quarters differ (ORCL FY May, MSFT FY Jun) and each member's latest quarter is used.
Scope80%Covers ~80% of disclosed commitments, so it is close to the whole contracted market.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 2.6 + 0.3 × reliability 5 = 4.28 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$500bn$1.00tn$1.50tnLevel (USD bn)Change vs prior period (%)1-yr avg +34%+10%−3%+13%+7%+8%+1%+13%+11%+15%+72%+31%+20%+14%2Q234Q232Q244Q242Q254Q252Q261
Latest2026Q2: $1.24tn
Compared with2026Q1: $1.09tn
Change+13.9%
1-yr avg change+34.3% per quarter (4 obs)
MomentumRising (slower)
DriverOracle 414.4 to 478.5, AWS 109.2 to 148.8, Google Cloud 184.8 to 205.6, Microsoft +22.9 to 307.8, CoreWeave +4.9 to 103.7 (USD bn).
EWhy it moved

What changed. 2026Q2: $1.24tn, +13.9% vs 2026Q1 (1-yr average +34.3% per quarter).

  • Oracle ($64bn) and Amazon ($40bn) supplied about 68% of the $152bn AI-weighted increase, with Microsoft and Google adding about $22bn each; the rise was broad, but growth slowed because the base was larger and CoreWeave added only $5bn.
  • Amazon's RPO jumped $132bn to $496bn after Anthropic agreed on 20 Apr 2026 to spend over $100bn on AWS over ten years, alongside Amazon's up-to-$25bn investment, booking multi-year compute directly into AWS backlog.
  • Oracle's fiscal Q4 (Mar-May) lifted RPO $85bn to $638bn, reported 10 Jun alongside a plan to raise more capital, while Microsoft's commercial RPO rose about $51bn as Azure passed $100bn of annual revenue.
  • Momentum is fading at the top contributor: Oracle's Jun-Aug quarter added only $26bn to $664bn, and CoreWeave's backlog is now converting to revenue faster than new contracts arrive, so 2026Q3 growth likely slows further.
  • So what: Backlog rose $152bn while group free cash flow fell to -$7bn: committed demand is outpacing builders' cash, so delivery depends on debt funding.
FRecent news
  • 2026-08-11CoreWeave beat quarterly estimates and raised its 2026 spending plan, citing record contracted backlog. link ↗ Indicator then: 2Q26 +13.9%
  • 2026-07-31Microsoft disclosed $678 billion of contracted revenue backlog after Azure passed $100 billion in annual revenue. link ↗ Indicator then: 2Q26 +13.9%
  • 2026-07-22Google Cloud backlog expanded to $514 billion in Q2 as cloud revenue grew 82%. link ↗ Indicator then: 2Q26 +13.9%

DRAM Contract Guidance

DDR5 contract price · Supply-Demand · Grade 4
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — Server DDR5 contract price
Why it mattersDRAM price balances AI server demand against supply; rising prices signal tight memory and raise cost for every server built.
How representativeServer DDR5 contract channel is ~70% of server DRAM bits (contract ~85% x DDR5 ~80% ex-HBM); mainly serves server and AI host-memory buyers.
TimingCoincident — Prices move with current supply and demand balance
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly contract price for DDR5 server DRAM, as tracked by TrendForce, with quarterly price guidance.
Higher = tighter DRAM supply against AI server demand.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VTrendForce DDR5 Server/PC DRAM Contract Price% QoQ (guidance midpoint)—100%
Changet = Readingt − Readingt−1 percentage points: the level is itself a growth rate
1-yr average = mean of Change over the past 12 months 6 observations
Unit%; change in percentage points
FrequencyMonthly · latest period 2026-06 · recorded 2026-08-31
ScopeGlobal · Server DDR5 contract channel; spot market, HBM and non-DDR5 DRAM are outside.
Share of global total: 70% — About 70% of server DRAM bits: contract channel ~85% x DDR5 ~80% of server DRAM ex-HBM.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: DRAM price directly reflects the balance between AI server demand and memory supply.
Signal / noise5 / 5SNR 5.0: a smooth monthly contract series with little seasonal or FX noise.
Reliability4 / 5Reliability 4.0: TrendForce month-end table from a private research firm; long-term agreements damped the 3Q26 increase.
Scope70%Covers ~70% of server DRAM bits, so it represents most of the market.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 5 + 0.3 × reliability 4 = 4.30 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
-50.0%0.00%50.0%100.0%Level (%)Change vs prior period (pp)1-yr avg +8pp+8pp−2pp−32ppJun-23Sep-23Dec-23Mar-24Jun-24Sep-24Dec-24Mar-25Jun-25Sep-25Dec-25Mar-26Jun-261
Latest2026-06: 60.5%
Compared with2026-03: 60.5%
Change+0.0pp
1-yr avg change+8.0pp per month (6 obs)
MomentumFlat
DriverTrendForce DDR5 Server/PC DRAM Contract Price: 0.00%
ERecent news
  • 2026-07-30TrendForce sees 2027 DRAM supply staying tight while NAND supply eases, so DRAM contract prices hold firmer than NAND. link ↗ Indicator then: Jun-26 +0.0pp
  • 2026-07-09TrendForce expects server DRAM contract prices to rise 13-18% QoQ in 3Q26, with long-term agreements capping increases. link ↗ Indicator then: Jun-26 +0.0pp

NAND Contract Price

NAND TLC wafer contract price · Supply-Demand · Grade 3
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — NAND TLC wafer contract price
Why it mattersNAND is the base of enterprise SSDs used for AI data storage; price shows storage tightness, a secondary AI input.
How representativeWafer contracts are ~55% of NAND bit sales, sold to module and enterprise SSD assemblers; secondary to DRAM and HBM for AI.
TimingCoincident — Contract prices reflect current market balance
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly contract price of NAND TLC wafers, tracked by TrendForce, with quarterly price guidance.
Higher = tighter NAND supply against enterprise SSD and AI storage demand.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VTrendForce NAND TLC Wafer Contract Price + Quarterly Guidance% QoQ (guidance midpoint)—100%
Changet = Readingt − Readingt−1 percentage points: the level is itself a growth rate
1-yr average = mean of Change over the past 12 months 4 observations
Unit%; change in percentage points
FrequencyMonthly · latest period 2026-03 · recorded 2026-07-31
ScopeGlobal · TLC wafer contracts sold to module and eSSD assemblers; retail and spot NAND are outside.
Share of global total: 55% — About 55% of NAND bit sales go through wafer contracts to module and eSSD assemblers.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: NAND is the base input for enterprise SSD, a secondary AI input behind DRAM and HBM.
Signal / noise4 / 5SNR 4.0: a smooth contract series, though it also moves with consumer and phone demand.
Reliability4 / 5Reliability 4.0: TrendForce private-firm price table, the main NAND price level available.
Scope55%Covers ~55% of NAND bit sales, so about half the market is outside.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 4 + 0.3 × reliability 4 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
-25.0%0.00%25.0%50.0%75.0%Level (%)Change vs prior period (pp)1-yr avg +16pp−7pp+0ppMar-23Jun-23Sep-23Dec-23Mar-24Jun-24Sep-24Dec-24Mar-25Jun-25Sep-25Dec-25Mar-26
Latest2026-03: 72.5%
Compared with2026-02: 57.5%
Change+15.0pp
1-yr avg change+16.2pp per month (4 obs)
MomentumRising (slower)
DriverTrendForce NAND TLC Wafer Contract Price + Quarterly Guidance: 15.0% (100% of the change)
ERecent news
  • 2026-08-18Top five NAND brands' combined revenue rose 77% QoQ in 2Q26, reflecting the sharp contract price increases. link ↗ Indicator then: Mar-26 +15.0pp
  • 2026-07-21TrendForce expects NAND supply growth to outpace demand in 2027, easing supply constraints in 2H27 and capping the contract price upcycle. link ↗ Indicator then: Mar-26 +15.0pp
  • 2026-07-03TrendForce says AI server demand supports NAND and DRAM prices in 3Q26, but gains moderate as consumer demand weakens. link ↗ Indicator then: Mar-26 +15.0pp

MLCC Unit Price

Japan MLCC implied ASP · Supply-Demand · Grade 3
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — Japan ceramic capacitor (MLCC) pricing
Why it mattersMLCCs sit on every server board; price shows component tightness, though AI is only one of many demand sources.
How representativeMurata, Taiyo Yuden, TDK and Kyocera Japan output is ~35% of global MLCC value; serves phones and cars as well, so a weak AI read.
TimingCoincident — Price tracks current component supply balance
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionAverage selling price per multilayer ceramic capacitor (MLCC) in Japan, implied from METI production value divided by quantity.
Higher = firmer component pricing, a sign of tighter MLCC supply or richer mix.
Formula
Readingt = Vt
where V = the member's reported value in JPY/unit:
TermMember (reported series)Native unitAI shareWeight
VJapan METI Ceramic Capacitor Production Value / QuantityJPY/unit—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 2 observations
UnitJPY/unit; change in %
FrequencyMonthly · latest period 2025-10 · recorded 2026-02-28
ScopeJapan · Japan-made ceramic capacitor output from Murata, Taiyo Yuden, TDK and Kyocera; overseas production is left out.
Share of global total: 35% — About 35% of global MLCC value: Murata ~40% + Taiyo Yuden ~10% + TDK / Kyocera ~10%, with METI covering ~60% of their output.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance2 / 5Importance 2: MLCC price only weakly reads AI demand, since most volume goes to phones, autos and PCs.
Signal / noise3 / 5SNR 3.0: JPY-denominated price with large 2024-26 currency swings, not FX-converted.
Reliability5 / 5Reliability 5.0: official METI statistic; the implied ASP is derived, not directly reported.
Scope35%Covers ~35% of global MLCC value, so it is a partial Japan-only read.
Grade3 / 50.4 × importance 2 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.20 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.500.600.700.800.90Level (JPY/unit)Change vs prior period (%)1-yr avg +15%−2%−3%+9%Oct-22Jan-23Apr-23Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25
Latest2025-10: 0.81 JPY/unit
Compared with2025-09: 0.74 JPY/unit
Change+9.1%
1-yr avg change+14.6% per month (2 obs)
MomentumRising (slower)
DriverJapan METI Ceramic Capacitor Production Value / Quantity: 0.07 JPY/unit (100% of the change)
ERecent news
  • 2026-07-30Samsung Electro-Mechanics will raise MLCC prices by 30% from August as AI server demand tightens supply. link ↗ Indicator then: Oct-25 +9.1%

Power Equip. Backlog

Power & electrical equipment backlog (USD, DC-weighted) · Supply-Demand · Grade 5
AWhy it is importantPower, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling — Grid and data-centre power equipment backlog
Why it mattersPower gear is a bottleneck for data centres; backlog growth shows orders queued and lead times lengthening.
How representativeSeven makers (GE Vernova, Vertiv, Siemens Energy, HD Hyundai Electric, Hyosung, LS Electric and others) are ~45% of global grid and data-centre power backlog.
TimingLeading — Orders book years before delivery and revenue
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarter-end order backlog of grid and data-center power equipment makers, converted to USD and weighted by data-center share.
Higher = more power equipment already ordered for data-center load, meaning tighter supply.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1GE Vernova Electrification Equipment BacklogUSD bn20%21%
V2GE Vernova Power Segment Equipment RPOUSD bn20%15%
V3Vertiv Backlog ($B)USD bn90%21%
V4Siemens Energy Grid Technologies Order BacklogEUR bn15%21%
V5HD Hyundai Electric Order BacklogUSD bn45%10%
V6Hyosung Heavy Industries Order BacklogKRW bn30%10%
V7LS Electric Order Backlog (KRW bn)KRW bn18%2%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 2 observations
Non-USD members are converted at the quarter-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2025Q4 · recorded 2026-02-13
ScopeGlobal · GE Vernova (Electrification and Power), Vertiv, Siemens Energy Grid Technologies, HD Hyundai Electric, Hyosung Heavy, LS Electric; Eaton stays raw-only.
Share of global total: 45% — About 45% of global grid / DC power-equipment backlog across seven makers; Hitachi Energy, Schneider, Mitsubishi and Toshiba are not in USD.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Importance 5: power gear is a hard bottleneck for new AI data centers, so backlog reads supply tightness directly.
Signal / noise4 / 5SNR 4.0: smooth stock figures, but large project bookings step the series and AI shares run from 15% to 90%.
Reliability4 / 5Reliability 4.0: company-disclosed filings, but Hyosung and LS Electric come from IR decks with date labels to verify.
Scope45%Covers ~45% of global backlog, so it is a large sample but not a total.
Grade5 / 50.4 × importance 5 + 0.3 × SNR 4 + 0.3 × reliability 4 = 4.40 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$10.0bn$20.0bn$30.0bn$40.0bnLevel (USD bn)Change vs prior period (%)1-yr avg +18%+8%+6%+6%+8%+7%+10%+25%4Q222Q234Q232Q244Q242Q254Q25
Latest2025Q4: $38.7bn
Compared with2025Q3: $30.9bn
Change+24.9%
1-yr avg change+17.6% per quarter (2 obs)
MomentumAccelerating
DriverVertiv Backlog ($B): $4.9bn (64% of the change)
ERecent news
  • 2026-08-28GE Vernova's electrification revenue rose 68% on data center deals in a single quarter. link ↗ Indicator then: 4Q25 +24.9%
  • 2026-07-29Vertiv shares fell 17% after a revenue miss in Q2, though management called the issue temporary and raised its outlook. link ↗ Indicator then: 4Q25 +24.9%
  • 2026-07-23GE Vernova's backlog reached $176 billion in Q2 as power and electrification demand accelerated. link ↗ Indicator then: 4Q25 +24.9%
  • 2026-07-02HD Hyundai Electric signed a $721 million deal with Big Tech to supply power equipment to a North America data center. link ↗ Indicator then: 4Q25 +24.9%

Grid Equipment PPI

US PPI grid equipment (power transformers + switchgear) · Supply-Demand · Grade 5
AWhy it is importantPower, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling — US transformer and switchgear prices
Why it mattersTransformer and switchgear prices show how scarce grid gear is for data-centre hookups; rising prices point to a power bottleneck.
How representativeUS-made transformers and switchgear are ~10% of global grid-equipment value; small, but a clean monthly price read on scarcity.
TimingCoincident — Producer prices move with current tightness
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionWeighted US producer price index for power transformers (weight 0.6) and switchgear (0.4), published monthly by the BLS.
Higher = rising prices for grid equipment, a sign of tight supply for DC power build-outs.
Formula
Readingt = Σi ( weighti × Vi,t ) weights re-scaled to the members present
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1US PPIindex—60%
V2US PPIindex—40%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
Unitindex; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-14
ScopeUS · BLS PPI for US-made transformer and switchgear manufacturing; imports and non-US makers are outside. Both series sit on 1980s bases.
Share of global total: 10% — About 10% of global grid-equipment value: US-made transformers and switchgear.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Importance 5: transformer and switchgear pricing reads how tight the power-equipment chain is for data centers.
Signal / noise4 / 5SNR 4.0: smooth trend, but prices pass through copper and grain-oriented electrical steel costs, which must be netted out.
Reliability5 / 5Reliability 5.0: official BLS monthly index; 2026-08 readings were 475.1 (transformers) and 411.5 (switchgear).
Scope10%Covers ~10% of global value, so it is a US price signal only.
Grade5 / 50.4 × importance 5 + 0.3 × SNR 4 + 0.3 × reliability 5 = 4.70 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
300350400450Level (index)Change vs prior period (%)1-yr avg +1%+1%−1%+0%+0%+0%+2%+1%+2%+1%+1%+3%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 444
Compared with2026-06: 432
Change+2.8%
1-yr avg change+0.7% per month (11 obs)
MomentumFlat
DriverUS PPI: 10.9 (92% of the change)
ERecent news
  • 2026-07-09US utilities are racing to secure transformers and turbines as data center demand strains equipment supply, lifting prices and lead times. link ↗ Indicator then: Jun-26 +0.0%

N. America DC Vacancy

North America DC vacancy (CBRE primary markets) · Supply-Demand · Grade 4
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — North America colocation vacancy
Why it mattersVacancy shows whether data-centre space is scarce; falling vacancy means AI tenants are absorbing capacity and pushing new builds.
How representativeNorth America ~40% of global colocation inventory x CBRE primary markets ~75% = ~30%; mainly hyperscaler and AI lab leases.
TimingCoincident — Vacancy reflects space already leased
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionShare of available colocation space that is empty in North America's primary data-center markets, per CBRE.
Lower = tighter colocation supply, meaning stronger demand for data-center space.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VCBRE North America DC Vacancy%—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous year
1-yr average = mean of Change over the past 12 months 2 observations
Unit%; change in %
FrequencyYearly · latest period 2026 · recorded 2026-08-31
ScopeNorth America · CBRE primary markets only; secondary markets and self-built hyperscale campuses are left out.
Share of global total: 30% — About 30% of global colocation inventory: North America ~40% x CBRE primary markets ~75%.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: vacancy is a direct tightness gauge for colocation supply.
Signal / noise4 / 5SNR 4.0: a slow semiannual rate with little noise, but vendors differ on market boundaries and preleasing definitions.
Reliability4 / 5Reliability 4.0: established broker with a consistent method; a single vendor's survey rather than an official statistic.
Scope30%Covers ~30% of global inventory, so it is a North America read.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 4 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
1.00%2.00%3.00%4.00%Level (%)Change vs prior period (%)1-yr avg −13%+16%−49%−26%+0%2023202420252026
Latest2026: 1.40%
Compared with2025: 1.40%
Change+0.0%
1-yr avg change−13.2% per year (2 obs)
MomentumFlat
DriverCBRE North America DC Vacancy: 0.00%
EWhy it moved

What changed. 2026: 1.40%, +0.0% vs 2025 (1-yr average −13.2% per year).

  • Vacancy held at the 1.4% record low because H1 2026 net absorption of 1,456 MW (+11.7% YoY) kept pace with a 33.7% jump in primary-market inventory to 10,903 MW, leaving almost nothing unleased.
  • New supply is arriving pre-committed: 80.4% of the 7,481 MW under construction was preleased in H1 2026 versus 74.3% a year earlier, so completions convert straight into occupied space rather than lifting vacancy.
  • Hyperscale and AI tenants are competing for large contiguous, powered blocks, and with grid connections the binding constraint, developers cannot add speculative space fast enough to rebuild an availability buffer.
  • Less than 1,500 MW of future primary-market capacity remains unleased, roughly six months of demand at the current pace, so vacancy only rises if absorption slows or power-ready deliveries accelerate.
  • So what: Vacancy pinned at a floor while PJM capacity still clears at its cap 6.8 GW short says power, not buildings, is the binding constraint on North American AI data-center supply.
FRecent news
  • 2026-09-02North American data center vacancy sits at an all-time low even as record construction is under way. link ↗ Indicator then: 2025 −26.3%
  • 2026-08-27CBRE reports data center demand still outpaces supply in North America despite record construction activity. link ↗ Indicator then: 2025 −26.3%
  • 2026-07-24CBRE data show North American data center growth slowing in Q2 as available capacity runs out. link ↗ Indicator then: 2025 −26.3%

US Capacity Auction Price

US capacity-auction clearing price (PJM, MISO) · Supply-Demand · Grade 4
AWhy it is importantPower, grid & cooling + Data centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling + Data centres & colo — US grid capacity auction prices
Why it mattersAuction prices show grid scarcity as data centres add load; high prices raise power cost and can slow site development.
How representativePJM (Northern Virginia, Ohio) ~15% plus MISO ~3% of global data-centre power draw = ~18%; mainly serves data-centre-heavy regions.
TimingLeading — Auctions price capacity years ahead of delivery
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionClearing price of annual capacity auctions in PJM and MISO, in dollars per megawatt-day, weighted by region.
Higher = scarcer grid capacity as data-center load grows.
Formula
Readingt = Σi ( weighti × Vi,t ) weights re-scaled to the members present
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1PJM Base Residual AuctionUSD/MW-day—70%
V2MISO Planning Resource AuctionUSD/MW-day—30%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous year
1-yr average = mean of Change over the past 12 months 1 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD/MW-day; change in %
FrequencyYearly · latest period 2025 · recorded 2025-12-27
ScopeUS (PJM, MISO) · PJM Base Residual Auction (weight 0.7, RTO price) and MISO Planning Resource Auction summer price (0.3); other US grids are excluded.
Share of global total: 18% — About 18% of global DC power draw: PJM ~15% (Northern Virginia, Ohio) + MISO ~3%.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: capacity prices show whether grid supply can meet new large loads such as data centers.
Signal / noise2.7 / 5SNR 2.7: PJM prices are pinned at the cap, so the shortfall in MW carries the signal; MISO auction design changes add noise.
Reliability5 / 5Reliability 5.0: official grid-operator auction results, with sparse annual prints.
Scope18%Covers ~18% of global DC power draw, so it reads two key US grids.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 2.7 + 0.3 × reliability 5 = 3.91 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$200.00$400.00Level (USD/MW-day)Change vs prior period (%)1-yr avg +119%−76%+752%+119%2022202320242025
Latest2025: $433.36
Compared with2024: $197.94
Change+118.9%
1-yr avg change+118.9% per year (1 obs)
MomentumRising (slower)
DriverMISO Planning Resource Auction: $190.95 (81% of the change)
ERecent news
  • 2026-08-12FERC allowed MISO to correct a $280M error in its capacity auction results. link ↗ Indicator then: 2025 +118.9%
  • 2026-07-16PJM's capacity auction cleared at the price cap again, reflecting tight supply amid data center load growth. link ↗ Indicator then: 2025 +118.9%
  • 2026-07-14PJM's capacity auction procured 138,318 MW of generation resources as it works to address growing electricity demand. link ↗ Indicator then: 2025 +118.9%

ERCOT Reserve Margin

ERCOT planning reserve margin (CDR) · Supply-Demand · Grade 3
AWhy it is importantPower, grid & cooling + Data centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling + Data centres & colo — Texas grid reserve margin
Why it mattersA thin reserve margin warns that Texas, a large data-centre growth market, may lack power for new AI load.
How representativeERCOT is ~5% of global data-centre power draw; small, but Texas is a fast-growing AI campus location and a useful stress read.
TimingLeading — Forecast of future supply versus demand
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionPlanning reserve margin forecast for the Texas grid (ERCOT), from its Capacity, Demand and Reserves (CDR) report.
Lower = tighter Texas grid, as large data-center loads absorb spare generation capacity.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VERCOT CDR Planning Reserve Margin%—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous half-year
1-yr average = mean of Change over the past 12 months 2 observations
Unit%; change in %
FrequencyHalf-yearly · latest period 2026H1 · recorded 2026-03-10
ScopeUS (Texas) · ERCOT CDR planning reserve margin and adjusted peak forecast; other US grids are excluded.
Share of global total: 5% — About 5% of global DC power draw.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: reserve margin reflects how far data-center load growth is squeezing grid supply.
Signal / noise2 / 5SNR 2.0: officer-letter large loads inflate the forecast, and the 2025 SB6 law changed the method.
Reliability5 / 5Reliability 5.0: official ERCOT report published each May and December, though forecast assumptions are revised.
Scope5%Covers ~5% of global DC power draw, so it is a single-region read.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 2 + 0.3 × reliability 5 − 0.5 (scope < 10%) = 3.20 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
10.0%20.0%30.0%40.0%50.0%Level (%)Change vs prior period (%)1-yr avg −1%−39%+54%−14%+48%−56%−9%+6%2023H12023H22024H12024H22025H12025H22026H1
Latest2026H1: 18.3%
Compared with2025H2: 17.2%
Change+6.4%
1-yr avg change−1.3% per half-year (2 obs)
MomentumTurned up
DriverERCOT CDR Planning Reserve Margin: 1.10% (100% of the change)
ERecent news
  • 2026-08-12Texas set a new peak demand record, while supply constraints will limit growth. link ↗ Indicator then: 2026H1 +6.4%
  • 2026-08-04Texas governor paused new data center grid approvals pending a statewide audit, as ERCOT faces a 474 GW interconnection queue. link ↗ Indicator then: 2026H1 +6.4%
  • 2026-07-29ERCOT forecasts Texas energy demand will double within six years, driven largely by large loads such as data centers. link ↗ Indicator then: 2026H1 +6.4%

GPU/XPU Vendor Revenue

GPU / XPU vendor revenue (NVIDIA, Broadcom, AMD, Marvell) · Downstream HW: Semi & ODM · Grade 5
AWhy it is importantAI chips & ASIC · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionAI chips & ASIC — GPU and custom-chip vendor revenue
Why it mattersAccelerator vendors' sales are the main measure of AI chip supply shipped; they set demand for memory, packaging and servers.
How representativeNVIDIA ~80%, Broadcom ~8%, AMD ~5%, Marvell ~2% is ~90% of AI-accelerator value; serves hyperscalers and labs, with Huawei and in-house chips outside.
TimingCoincident — Revenue booked as chips ship
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly AI-related revenue reported by NVIDIA, Broadcom, AMD and Marvell, weighted by each line's AI share.
Higher = more AI accelerators shipped and paid for; lower = accelerator demand or supply easing.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1NVIDIA Data Center Compute RevenueUSD bn100%83%
V2Broadcom AI Semiconductor RevenueUSD bn100%12%
V3AMD Data Center Segment RevenueUSD mn50%3%
V4Marvell Data Center End-Market RevenueUSD bn75%2%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 3 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q1 · recorded 2026-05-04
ScopeGlobal · NVIDIA data center compute, Broadcom AI semiconductors, AMD data center (about half AI), Marvell data center (75% AI); Huawei and in-house chips excluded.
Share of global total: 90% — 90% of 2026 AI-accelerator value: NVIDIA ~80%, Broadcom ~8%, AMD ~5%, Marvell ~2%; Huawei and in-house chips outside.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: NVIDIA and Broadcom lines are primary anchors of AI accelerator demand, filed in statutory quarterly reports.
Signal / noise4.7 / 5SNR 4.7: NVIDIA (83% weight) is pure AI; Broadcom XPU lumpiness and AMD CPU mix add some noise.
Reliability4.9 / 5Reliability 4.9: audited quarterly filings; residual risk from write-downs (H20, MI308) and Marvell's 2025 divestiture base change.
Scope90%Covers ~90% of AI-accelerator value, so it is close to the whole vendor market.
Grade5 / 50.4 × importance 5 + 0.3 × SNR 4.7 + 0.3 × reliability 4.9 = 4.88 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$20.0bn$40.0bn$60.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +16%+38%+42%+28%+15%+21%+16%+4%+2%+26%+20%1Q233Q231Q243Q241Q253Q251Q26
Latest2026Q1: $63.8bn
Compared with2025Q4: $53.3bn
Change+19.7%
1-yr avg change+16.1% per quarter (3 obs)
MomentumRising (slower)
DriverNVIDIA Data Center Compute Revenue: $8.3bn (79% of the change)
ERecent news
  • 2026-08-27Marvell reported record second-quarter fiscal 2027 revenue and raised its annual forecast on data center demand. link ↗ Indicator then: 1Q26 +19.7%
  • 2026-08-26NVIDIA reported second-quarter fiscal 2027 results, with data center compute remaining the main revenue driver. link ↗ Indicator then: 1Q26 +19.7%
  • 2026-08-04AMD reported record second-quarter 2026 revenue, with data center sales roughly doubling year over year. link ↗ Indicator then: 1Q26 +19.7%

TSMC HPC Revenue

TSMC HPC revenue (monthly revenue × HPC share) · Downstream HW: Semi & ODM · Grade 5
AWhy it is importantFoundry & packaging · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionFoundry & packaging — TSMC high-performance computing wafers
Why it mattersTSMC makes nearly all leading AI chips; its HPC sales show AI silicon output one step before finished systems.
How representativeTSMC makes ~90% of 5nm-and-below wafers and nearly all CoWoS-L; HPC ~60% of revenue, so ~85% of AI-accelerator wafer value, mainly NVIDIA and custom-chip customers.
TimingLeading — Wafers are sold before systems ship
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly TSMC revenue multiplied by the latest quarterly share from high-performance computing (HPC), an estimate of AI-heavy foundry sales.
Higher = more leading-edge wafers and CoWoS output going to AI chips.
Formula
Xt = V1,t × HPC sharelatest quarter ÷ 100
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1TSMCTWD k—80%
V2TSMC HPC Platform Revenue Share%—20%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeGlobal (Taiwan-listed) · TSMC monthly revenue times latest reported HPC platform share; other foundries and non-HPC platforms excluded.
Share of global total: 85% — 85% of AI-accelerator wafer value: TSMC ~90% of 5nm-and-below wafers and nearly all CoWoS-L; HPC ~60% of revenue.
Comparison windowTSMC monthly revenue follows wafer-out timing (std 16%, flips 64%)
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: TSMC is the near-monopoly for leading-edge logic and CoWoS, so it reads AI supply directly.
Signal / noise4 / 5SNR 4.0: single months swing with wafer-out timing and TWD; smartphone seasonality and 3-month average smooth it.
Reliability4.8 / 5Reliability 4.8: monthly statutory filing; the HPC share is reported quarterly, so the multiplier lags.
Scope85%Covers ~85% of AI-accelerator wafer value, so it is close to the whole foundry read.
Grade5 / 50.4 × importance 5 + 0.3 × SNR 4 + 0.3 × reliability 4.8 = 4.64 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$10.0bn$20.0bn$30.0bnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +12%−2%+3%+29%+23%+6%+16%+6%+11%+0%+13%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $26.8bn
Compared with2026-04: $21.5bn
Change+25.0%
1-yr avg change+12.2% per window (4 obs)
MomentumAccelerating
DriverTSMC: $1.6bn (100% of the change)
ERecent news
  • 2026-08-08TSMC's Q2 earnings rose 77% and its 2026 capex plan reached about US$64 billion to meet AI demand. link ↗ Indicator then: Jul-26 +25.0%

TW ASIC Design Revenue

Taiwan custom-ASIC design-service revenue (GUC + Alchip) · Downstream HW: Semi & ODM · Grade 3
AWhy it is importantAI chips & ASIC · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionAI chips & ASIC — Custom-ASIC design services (Taiwan)
Why it mattersDesign houses turn hyperscaler chip specs into silicon; their revenue shows custom-ASIC programs ramping beyond NVIDIA.
How representativeGUC plus Alchip ~25% of custom-ASIC design-service revenue (Broadcom ~60%, Marvell ~13%); a read on the non-NVIDIA accelerator programs.
TimingLeading — Design and tape-out revenue precedes volume shipments
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCombined monthly revenue of Global Unichip and Alchip, Taiwan's custom AI chip design-service houses.
Higher = more hyperscaler custom ASIC programs taping out or shipping.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = (1/3) × Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Global UnichipTWD k60%40%
V2AlchipTWD k90%60%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn, trailing 3-month average; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · GUC (AI/HPC ~60%) and Alchip (AI ~90%) monthly revenue; Broadcom and Marvell design services excluded.
Share of global total: 25% — 25% of custom AI-ASIC design-service revenue; Broadcom ~60% and Marvell ~13% make up the rest.
Comparison windowAuto-widened: compared as single months the reading swung by ±18% per month and kept reversing direction (noise cap 12%); trailing 3 months vs the 3 before cut that to ±6%
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: direct read of custom ASIC programs, but only two Taiwan firms in a market led by Broadcom.
Signal / noise2 / 5SNR 2.0: turnkey wafer pass-through and one-off NRE alternate, so months are lumpy; gaps at Trainium2 to 3.
Reliability5 / 5Reliability 5.0: statutory monthly filings from the Taiwan exchange, rarely revised.
Scope25%Covers ~25% of design-service revenue, so it is a partial sample of the ASIC market.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 2 + 0.3 × reliability 5 = 3.70 → 4, capped at the weaker of SNR / reliability + 1 = 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$100mn$150mn$200mn$250mnLevel (USD mn, trailing 3-month average)Change vs the prior 3-month window (%)1-yr avg +20%+8%+8%+33%−11%−6%−10%−12%−5%+6%−4%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-2612345
Latest2026-07: $218mn
Compared with2026-04: $119mn
Change+82.6%
1-yr avg change+19.7% per window (4 obs)
MomentumTurned up
DriverAlchip: $49mn (85% of the change)
EWhy it moved

What changed. 2026-07: $218mn, +82.6% vs 2026-04 (1-yr average +19.7% per window).

  • Alchip drove the move: the 3-month average rose from 119.2 to 217.7, and Alchip's 46.4 to 121.2 is about three quarters of the 98.5 gain, while GUC added about 24; this is concentrated in one program.
  • Alchip's July revenue doubled to over NT$7.4bn on 10 Aug as its customer's 3nm AI accelerator entered mass production, a new monthly record, with wafer and packaging pass-through lifting sales.
  • GUC's July sales rose 158% year on year to an all-time high (reported 17 Aug) and its turnkey share passed 80% of revenue, so GUC's contribution is steadier but smaller.
  • Alchip guided Q3 to another record on 14 Aug despite gross-margin pressure, so the 3-month figure should keep rising through August data; the turning point is when the 3nm ramp plateaus.
  • So what: ASIC design-service revenue has doubled on one 3nm ramp; the supply signal is real, but a single-customer program concentrates the risk.
FRecent news
  • 2026-08-10Alchip July revenue doubled to over NT$7.4 billion as 3nm AI chip mass production set a new monthly record. link ↗ Indicator then: Jul-26 +82.6%
  • 2026-08-14Alchip's Q2 revenue rose 82.6% as the N3 AI accelerator ramped, and it guided a record Q3. link ↗ Indicator then: Jul-26 +82.6%
  • 2026-08-17Global Unichip hit an all-time high as July sales surged 158% year on year. link ↗ Indicator then: Jul-26 +82.6%

Open the full deep-dive ↓

TW Electronics Orders

Taiwan electronic-products export orders · Downstream HW: Semi & ODM · Grade 4
AWhy it is importantFoundry & packaging + Servers & ODM · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionFoundry & packaging + Servers & ODM — Taiwan electronics export orders
Why it mattersTaiwan builds most AI chips and servers; new orders show demand hitting the supply base before shipments.
How representativeMOEA electronic orders are ~50% of global foundry and OSAT value (ICs and components ~55%); AI-linked ~40%, so a broad, noisy read.
TimingLeading — Orders are placed before shipment and revenue
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of export orders Taiwan firms receive for electronic products, including goods made offshore.
Higher = customers placing more chip and component orders, typically 1-3 months before shipments.
Formula
Xt = Vt
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VTaiwan Export OrdersUSD bn—100%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 2 observations
UnitUSD bn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-20
ScopeTaiwan · MOEA electronic-products orders, mostly foundry and IC, produced in Taiwan or offshore; AI-linked ~40% per member data.
Share of global total: 50% — 50% of global foundry + OSAT value: ICs and components are ~55% of it.
Comparison windowExport orders alternate month to month (std 15%, flips 62%)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: leads shipments, but member score is 3 because it overlaps TSMC revenue and component exports.
Signal / noise3 / 5SNR 3.0: orders alternate month to month (std 15%, flips 62%); USD vs TWD moves add noise.
Reliability5 / 5Reliability 5.0: official MOEA statistic, though offshore production means orders differ from Taiwan output.
Scope50%Covers ~50% of global foundry + OSAT value, so about half the market.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$60.0bn$80.0bn$100bn$120bnLevel (USD bn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +16%+12%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $119bn
Compared with2026-04: $98.9bn
Change+20.4%
1-yr avg change+15.9% per window (2 obs)
MomentumAccelerating
DriverTaiwan Export Orders: $5.4bn (100% of the change)
ERecent news

No specific event news found for this period.

AI Chip Shipments

Global AI chip shipments (Epoch, H100e) · Downstream HW: Semi & ODM · Grade 4
AWhy it is importantAI chips & ASIC · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionAI chips & ASIC — Cross-vendor AI chip shipments
Why it mattersShipment units show compute supply added each quarter across all designers, the physical base for model training and inference.
How representativeEpoch covers NVIDIA, AMD, Google TPU, Amazon Trainium and Huawei, ~95% of AI compute shipped, so ~90% of the global link.
TimingCoincident — Counts chips as they ship
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionEpoch AI's estimate of quarterly AI chip shipments across all designers, converted into NVIDIA H100-equivalent units.
Higher = more AI compute capacity physically shipped, independent of chip price.
Formula
Readingt = Vt
where V = the member's reported value in H100e mn:
TermMember (reported series)Native unitAI shareWeight
VEpoch AI Chip SalesH100e mn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitH100e mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-07
ScopeGlobal · NVIDIA, AMD, Google TPU, Amazon Trainium and Huawei shipments; estimates built from filings, analyst and media data.
Share of global total: 90% — 90% of AI compute shipped; Epoch's designers cover about 95%.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: the only cross-vendor unit series including TPU, Trainium and Huawei, so it reads compute supply directly.
Signal / noise3 / 5SNR 3.0: estimates carry wide 90% intervals and mix chip generations into one H100e unit.
Reliability4 / 5Reliability 4.0: Epoch estimates, not filings; each release revises history.
Scope90%Covers ~90% of shipped AI compute, so it is close to the whole market.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 3 + 0.3 × reliability 4 = 4.10 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.002.004.00Level (H100e mn)Change vs prior period (%)1-yr avg +12%+110%+61%+36%+55%+25%+27%+47%+34%+14%+26%+18%+2%+2%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 4.54 H100e mn
Compared with2026Q1: 4.46 H100e mn
Change+1.6%
1-yr avg change+12.0% per quarter (4 obs)
MomentumFlat
DriverEpoch H100e shipments 4.462mn to 4.535mn; growth fell from +17.8% in 4Q25 to +2.2% in 1Q26 and +1.6% in 2Q26.
EWhy it moved

What changed. 2026Q2: 4.54 H100e mn, +1.6% vs 2026Q1 (1-yr average +12.0% per quarter).

  • The near-flat 2026Q2 print looks like a stale vintage: the series' current vintage puts 2026Q1 at 4.54mn and 2026Q2 at 5.82mn H100e (+28% QoQ), with Google TPU v7 and Nvidia B300 contributing about 53% and 45% of the gain.
  • The earlier 2026Q1 stall is a coverage artefact: Amazon Trainium2 and Huawei Ascend carry no 2026 estimates yet, removing about 0.35mn H100e versus 2025Q4, while Nvidia still added about 0.43mn as B300 replaced B200.
  • Nvidia's calendar-quarter demand kept compounding: fiscal Q1 2027 (Feb-Apr 2026) data-center revenue rose 21% QoQ to $75.2bn, and fiscal Q2 (May-Jul) total revenue reached $96.2bn with a $108bn Q3 guide.
  • Google's Ironwood TPU v7, generally available from November 2025 and anchored by Anthropic's plan for up to one million TPUs, ramped to about 1.4mn H100e in 2026Q2, making custom silicon the fastest-growing slice of shipments.
  • So what: Against Nvidia's 21% sequential data-center revenue growth and a $108bn next-quarter guide, the flat print reflects data lag and coverage gaps, not demand digestion.
FRecent news
  • 2026-09-03Broadcom's AI revenue tripled to US$16.7 billion as custom accelerator demand outstripped its roadmap. link ↗ Indicator then: 2Q26 +1.6%
  • 2026-08-27Nvidia expects about $20 billion of Vera Rubin system sales in Q3, roughly 20% of data center revenue, as shipments begin. link ↗ Indicator then: 2Q26 +1.6%
  • 2026-07-21Nvidia confirmed Vera Rubin systems are shipping, adding a new accelerator generation to quarterly volumes. link ↗ Indicator then: 2Q26 +1.6%

T-Glass Cloth Revenue

Low-CTE glass cloth for AI substrates (Nitto Boseki Electronic Materials) · Downstream HW: Semi & ODM · Grade 4
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — Low-CTE glass cloth for substrates
Why it mattersT-glass cloth is a scarce input to AI chip substrates; shortages here can hold back accelerator output upstream.
How representativeNitto Boseki is ~90% of low-CTE T-glass for AI substrates; segment revenue (T-glass ~50%, plus E-glass) gives ~80% coverage, serving substrate makers.
TimingLeading — Materials are bought ahead of substrate and chip builds
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of Nitto Boseki's Electronic Materials segment, which includes low-CTE T-glass cloth used in AI chip substrates.
Higher = more demand for the scarce glass cloth in AI ABF and BT substrates.
Formula
Readingt = Vt
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VNitto Boseki Electronic Materials Business RevenueJPY mn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Non-USD members are converted at the quarter-average FX rate before summing.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-07
ScopeJapan-listed · Nitto Boseki Electronic Materials segment (T-glass ~50%, plus standard E-glass); other T-glass suppliers excluded.
Share of global total: 80% — 80% of low-CTE T-glass for AI substrates: Nitto Boseki ~90%, less the E-glass in the segment.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: T-glass gates AI substrate supply, but the member is scored 4 as segment revenue includes non-AI glass.
Signal / noise3 / 5SNR 3.0: half the segment is standard E-glass, and allocation news during the shortage moves reported timing.
Reliability5 / 5Reliability 5.0: CIQ segment data from audited filings; the segment definition is stable.
Scope80%Covers ~80% of T-glass supply, so it is a near-complete supplier read.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.40 → 5, capped at the weaker of SNR / reliability + 1 = 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$60mn$80mn$100mn$120mnLevel (USD mn)Change vs prior period (%)1-yr avg +6%+1%+5%+4%+4%+6%+3%+4%+12%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $113mn
Compared with2026Q1: $101mn
Change+11.6%
1-yr avg change+6.0% per quarter (4 obs)
MomentumAccelerating
DriverNitto Boseki Electronic Materials Business Revenue: $12mn (100% of the change)
ERecent news
  • 2026-08-06Nittobo raised its FY2027 net profit forecast by JPY 3B and said it plans no further T-glass price hikes. link ↗ Indicator then: 2Q26 +11.6%
  • 2026-07-03Guangyuan is investing about US$1B in T-glass capacity as Chinese suppliers challenge Japanese dominance of low-CTE glass cloth. link ↗ Indicator then: 2Q26 +11.6%

Memory Maker Revenue

Memory, HBM & storage maker revenue (AI-weighted) · Downstream HW: Semi & ODM · Grade 4
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — HBM, DRAM, NAND and HDD makers
Why it mattersMemory and storage sales show how much AI demand reaches the hardware that holds model data; HBM is required in every accelerator.
How representativeSK hynix ~36%, Samsung ~33%, Micron ~24% of DRAM and HBM; with SanDisk and HDD makers, ~85% of AI memory and storage value.
TimingCoincident — Revenue booked as memory ships
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of memory and storage makers, each weighted by its AI-related share of sales.
Higher = more spending on HBM, server DRAM, enterprise SSD and nearline disks, partly price-driven.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1SK hynix Quarterly RevenueKRW bn60%41%
V2Samsung Electronics DS Division Revenue & OPKRW bn35%25%
V3Micron Quarterly RevenueUSD mn55%25%
V4SanDisk Datacenter End-Market RevenueUSD mn85%2%
V5Seagate Total Revenue (USD mn/qtr)USD mn80%3%
V6Western Digital Total RevenueUSD mn85%4%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Non-USD members are converted at the quarter-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-31
ScopeGlobal · SK hynix, Samsung DS, Micron, SanDisk DC, Seagate, Western Digital; AI shares 35-85% by member; other memory makers excluded.
Share of global total: 85% — 85% of AI memory and storage value: SK hynix ~36%, Samsung ~33%, Micron ~24% of DRAM/HBM; SanDisk ~12% NAND eSSD; Seagate ~40%, WD ~42% HDD.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: HBM and storage are core AI inputs, though members score 3-4 as revenue is price-driven.
Signal / noise2.8 / 5SNR 2.8: 2025-26 price supercycle, Samsung foundry losses and non-AI DRAM/NAND sales blur volume.
Reliability5 / 5Reliability 5.0: audited quarterly filings from all six companies.
Scope85%Covers ~85% of AI memory and storage value, so it is close to the whole market.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 2.8 + 0.3 × reliability 5 = 4.34 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$25.0bn$50.0bn$75.0bn$100bnLevel (USD mn)Change vs prior period (%)1-yr avg +41%+8%+10%+22%+13%+22%+7%+10%−9%+14%+15%+27%+64%+55%2Q234Q232Q244Q242Q254Q252Q261
Latest2026Q2: $96.2bn
Compared with2026Q1: $61.9bn
Change+55.4%
1-yr avg change+40.5% per quarter (4 obs)
MomentumRising (slower)
DriverSK hynix (KRW 22.7tn to 34.3tn equivalent, +51%), Samsung DS (+56%) and Micron (+74%) drove the quarter; HDD makers added under 3% of the increase.
EWhy it moved

What changed. 2026Q2: $96.2bn, +55.4% vs 2026Q1 (1-yr average +40.5% per quarter).

  • The 55% quarter-on-quarter jump was concentrated in the three DRAM/HBM makers: SK hynix and Samsung each supplied about a third of the gross increase and Micron another 28%, while SanDisk, Seagate and Western Digital together added under 4%.
  • The common driver was price, not volume: in its fiscal Q3 (March-May 2026) Micron's DRAM average selling prices rose in the low-60s percent while bit shipments grew only low-single digits, lifting revenue 74% sequentially to $41.5B.
  • Korean makers showed the same mechanism in calendar Q2: SK hynix revenue rose 51% to KRW 79.3tn on higher DRAM/NAND prices and first HBM4 volume shipments, and Samsung's DS revenue rose 56% to KRW 127.5tn on server-memory pricing.
  • The pace eased from Q1's 64% because contract hikes are narrowing (server DRAM contracts were expected to rise 13-18% in Q3 as long-term agreements cap increases), so Q3 growth depends more on HBM4 volumes than price.
  • So what: Revenue now tracks memory contract prices almost one-for-one; watch DRAM contract price momentum, as slowing price hikes will decelerate this aggregate before any volume change shows.
FRecent news
  • 2026-07-30Samsung's DS unit delivered 99.7% of Q2 operating profit, with HBM4 revenue reportedly set to triple in Q3. link ↗ Indicator then: 2Q26 +55.4%
  • 2026-07-29SK hynix reported record Q2 profit that missed forecasts and outlined W40tr-plus in spending. link ↗ Indicator then: 2Q26 +55.4%

Korea Chip Exports (10-day)

Korea semiconductor exports — 10-day customs flash · Downstream HW: Semi & ODM · Grade 3
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — Korea chip exports, 10-day flash
Why it mattersKorea ships most memory; early customs data gives a fast read on memory demand before company earnings.
How representativeKorea ~60% of global memory bits and memory ~60% of Korean chip exports, so ~35% of memory and chip exports; includes non-AI chips.
TimingLeading — Published mid-month, ahead of earnings and monthly data
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionKorea Customs' first 10-day and 20-day semiconductor export values, published mid-month ahead of the full month.
Higher = stronger memory and chip shipments out of Korea, mostly memory.
Formula
Readingt = Vt
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VKorea Customs 1-10 / 1-20 Day Semiconductor ExportsUSD bn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous week
1-yr average = mean of Change over the past 12 months 7 observations
UnitUSD mn; change in %
FrequencyWeekly · latest period 2026-08-23 · recorded 2026-08-22
ScopeKorea exports · Semiconductor exports from Korea Customs dekadal releases; not adjusted for working days; non-Korean chip makers excluded.
Share of global total: 35% — 35% of memory + chip exports: Korea ~60% of global memory bits, memory ~60% of Korean chip exports.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: early read of Korean memory shipments, but chip exports include non-AI products.
Signal / noise2 / 5SNR 2.0: working-day differences swing values (Chuseok turned 2025-10 days 1-20 negative).
Reliability5 / 5Reliability 5.0: official customs data, published on the 11th, 21st and 1st.
Scope35%Covers ~35% of memory + chip exports, so it is a partial sample.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 2 + 0.3 × reliability 5 = 3.70 → 4, capped at the weaker of SNR / reliability + 1 = 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$5.0bn$10.0bn$15.0bn$20.0bn$25.0bn$30.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +15%10 Sep17 Dec24 Mar30 Jun06 Oct12 Jan20 Apr27 Jul02 Nov08 Feb17 May23 Aug
Latest2026-08-23: $26.0bn
Compared with2026-07-26: $22.1bn
Change+17.7% · 4-wk vs prior 4-wk +52.3%
1-yr avg change+14.7% per week (7 obs)
MomentumTurned up
DriverKorea Customs 1-10 / 1-20 Day Semiconductor Exports: $3.9bn (100% of the change)
ERecent news
  • 2026-09-02Korea's August semiconductor exports roughly tripled year over year. link ↗ Indicator then: 23 Aug +17.7%
  • 2026-08-21Korea's exports in August 1-20 rose 56% on robust chip shipments. link ↗ Indicator then: 26 Jul −13.3%

Korea Memory → Taiwan

Korea memory exports to Taiwan (HBM proxy) · Downstream HW: Semi & ODM · Grade 4
AWhy it is importantMemory & storage + Foundry & packaging · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage + Foundry & packaging — HBM shipments to Taiwan packaging
Why it mattersNearly all HBM goes to Taiwan for CoWoS packaging, so these exports show memory supply feeding accelerator builds.
How representativeSK hynix plus Samsung ~65% of HBM bits shipped Korea-to-Taiwan, ~60% of HBM flowing into CoWoS; includes some non-HBM memory.
TimingLeading — HBM ships to packaging before accelerators are finished
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of Korean memory chips (HS 8542.32) exported to Taiwan, used as a proxy for HBM going into CoWoS packaging.
Higher = more HBM flowing to TSMC for pairing with accelerators.
Formula
Xt = Vt
Readingt = (1/6) × Σj=0…5 Xt−j trailing 6 months, recomputed every month
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VKorea HS 8542.32 Memory Exports to TaiwanUSD bn—100%
Changet = Readingt ÷ Readingt−6 − 1 this 6-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 1 observations
UnitUSD mn, trailing 6-month average; change in %
FrequencyMonthly · latest period 2025-12 · recorded 2026-04-15
ScopeKorea to Taiwan · HS 8542.32 memory exports to Taiwan, mainly SK hynix and Samsung HBM; other memory shipped to Taiwan is included.
Share of global total: 60% — 60% of HBM flowing into CoWoS: SK hynix + Samsung ~65% of HBM bits shipped via Korea-to-Taiwan.
Comparison windowAuto-widened: compared as single months the reading swung by ±30% per month and kept reversing direction (noise cap 12%); trailing 6 months vs the 6 before cut that to ±10%
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: HBM is required for every accelerator, and Taiwan is where it is packaged.
Signal / noise3 / 5SNR 3.0: value mixes price and volume, and non-HBM memory is included.
Reliability5 / 5Reliability 5.0: official customs statistic, rarely revised.
Scope60%Covers ~60% of HBM into CoWoS, so it is a majority read.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.40 → 5, capped at the weaker of SNR / reliability + 1 = 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$1.0bn$2.0bn$3.0bnLevel (USD mn, trailing 6-month average)Change vs the prior 6-month window (%)1-yr avg +55%−53%−41%+35%+66%+34%+102%+261%+183%+37%−1%+44%Dec-22Mar-23Jun-23Sep-23Dec-23Mar-24Jun-24Sep-24Dec-24Mar-25Jun-25Sep-25Dec-25
Latest2025-12: $2.7bn
Compared with2025-06: $1.8bn
Change+55.2%
1-yr avg change+55.2% per window (1 obs)
MomentumRising (slower)
DriverKorea HS 8542.32 Memory Exports to Taiwan: $24mn (100% of the change)
ERecent news

No specific event news found for this period.

TW AI-Server ODM Revenue

Taiwan AI-server ODM revenue · Downstream HW: Semi & ODM · Grade 3
AWhy it is importantServers & ODM · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionServers & ODM — Taiwan AI-server assembly (ODM)
Why it mattersODMs build the racks that hyperscalers buy; their revenue shows AI servers moving from chips into deployed systems.
How representativeHon Hai ~40%, Wistron/Wiwynn ~20%, Quanta ~15%, Inventec ~5%, Gigabyte ~5%, about 85% of AI servers; ~75% after non-Taiwan assemblers.
TimingCoincident — Revenue booked as racks are delivered
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCombined monthly revenue of five Taiwan AI-server makers, weighted by each firm's AI-server share.
Higher = more AI racks assembled and recognised for hyperscaler customers.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Hon HaiTWD k45%53%
V2QuantaTWD k60%18%
V3WistronTWD k65%24%
V4InventecTWD k30%3%
V5GigabyteTWD k50%2%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Hon Hai (45% AI), Quanta (60%), Wistron incl. Wiwynn (65%), Inventec (30%), Gigabyte (50%); non-Taiwan assemblers excluded.
Share of global total: 75% — 75% of AI-server ODM output: the five hold ~85% (Hon Hai ~40%, Wistron/Wiwynn ~20%, Quanta ~15%), times 0.9 for non-Taiwan assemblers.
Comparison windowRack shipments recognised in lumps (std 15%, flips 43%)
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: rack assembly is the last step before deployment, but notebooks and phones sit in the same revenue.
Signal / noise2.2 / 5SNR 2.2: iPhone and notebook seasonality plus lumpy rack recognition (std 15%); Wistron double-counts Wiwynn.
Reliability5 / 5Reliability 5.0: statutory monthly filings from each company.
Scope75%Covers ~75% of AI-server ODM output, so it is a large majority.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 2.2 + 0.3 × reliability 5 = 3.76 → 4, capped at the weaker of SNR / reliability + 1 = 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$20.0bn$40.0bn$60.0bn$80.0bnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +12%−9%−10%+18%+26%−7%+4%+12%+13%+16%+7%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $80.6bn
Compared with2026-04: $71.8bn
Change+12.3%
1-yr avg change+12.4% per window (4 obs)
MomentumRising (slower)
DriverHon Hai: $1.3bn (69% of the change)
ERecent news
  • 2026-09-05Foxconn's August revenue hit a record NT$921.8B on strong AI computing demand. link ↗ Indicator then: Jul-26 +12.3%
  • 2026-08-12Foxconn said AI servers now account for more than half of its revenue. link ↗ Indicator then: Jul-26 +12.3%
  • 2026-08-04Wistron's Q2 profit rose 54% to a record and it is investing over NT$10B in capacity and an AI computing center. link ↗ Indicator then: Jul-26 +12.3%

AI-Server Rails + BMC

TW monthly rev AI server shipment proxy (King Slide + ASPEED) · Downstream HW: Semi & ODM · Grade 5
AWhy it is importantServers & ODM · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionServers & ODM — Server rails and management chips
Why it mattersEach server needs one management chip and rails; their revenue is a unit-count read on AI servers shipped.
How representativeASPEED ~70% of server BMCs and King Slide ~60% of AI-rack slide rails, so ~65% of AI-server units; small parts, clean unit proxy.
TimingLeading — Parts ship before final server assembly
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCombined monthly revenue of King Slide (server rails) and ASPEED (server management chips), used as a per-server unit count proxy.
Higher = more servers being built; the signal usually leads ODM revenue by about one month.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1King SlideTWD k55%70%
V2ASPEEDTWD k35%30%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Non-USD members are converted at the month-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · King Slide (AI-rack rails, 55% AI) and ASPEED (server BMC, 35% AI); ODM and other rail or BMC makers excluded.
Share of global total: 65% — 65% of AI-server units: ASPEED ~70% of server BMCs, King Slide ~60% of AI-rack slide rails.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: clean unit proxy, but King Slide is non-critical hardware (member score 1) and ASPEED mixes general servers.
Signal / noise4.7 / 5SNR 4.7: one BMC per server and rails are steady; King Slide reversal share 24%; price hikes and tariff stocking affect ASPEED.
Reliability5 / 5Reliability 5.0: statutory monthly filings.
Scope65%Covers ~65% of AI-server units, so it is a majority read.
Grade5 / 50.4 × importance 4 + 0.3 × SNR 4.7 + 0.3 × reliability 5 = 4.51 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$50mn$100mn$150mnLevel (USD mn)Change vs prior period (%)1-yr avg +14%+5%+5%+8%+10%+6%+2%+1%+5%+3%+26%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-261
Latest2026-07: $125mn
Compared with2026-06: $92mn
Change+36.7%
1-yr avg change+13.6% per month (11 obs)
MomentumAccelerating
DriverKing Slide: $32mn (94% of the change)
ERecent news
  • 2026-09-04Aspeed plans double-digit price increases in Q4 and says next year's order backlog already exceeds this year's revenue. link ↗ Indicator then: Jul-26 +36.7%
  • 2026-08-06King Slide posted a fifth straight monthly revenue record on AI server rail demand. link ↗ Indicator then: Jul-26 +36.7%
  • 2026-07-30Aspeed expects AI server demand to drive growth through 2027. link ↗ Indicator then: Jun-26 +14.5%
  • 2026-07-07King Slide reported record second-quarter revenue on AI server slide-rail demand. link ↗ Indicator then: Jun-26 +14.5%

TW ICT Export Orders

Taiwan ICT export orders · Downstream HW: Semi & ODM · Grade 4
AWhy it is importantServers & ODM · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionServers & ODM — Taiwan-firm AI server orders
Why it mattersTaiwan firms assemble most AI servers; new export orders show rack demand before it is shipped or booked as revenue.
How representativeAbout 70% of AI-server orders: MOEA counts offshore-built orders (~90% of AI-server ODM orders); PCs and networking dilute it. Mainly serves US hyperscaler rack programs.
TimingLeading — Orders precede shipments and ODM revenue by months
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of export orders Taiwan firms receive for information and communication technology products, including offshore-built servers.
Higher = more server and networking orders placed, typically 1-3 months before ODM revenue.
Formula
Xt = Vt
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VTaiwan Export OrdersUSD bn—100%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 2 observations
UnitUSD bn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-20
ScopeTaiwan · MOEA ICT orders (AI servers ~55%), plus PCs and networking; includes offshore production of Taiwan firms.
Share of global total: 70% — 70% of AI-server orders: MOEA orders cover ~90% of AI-server ODM orders, less PCs and networking in ICT.
Comparison windowExport orders alternate month to month (std 18%, flips 75%)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: leading read of AI-server demand, though the same signal appears in ODM revenue.
Signal / noise3 / 5SNR 3.0: orders alternate month to month (std 18%, flips 75%), so single months are unreadable.
Reliability5 / 5Reliability 5.0: official MOEA statistic.
Scope70%Covers ~70% of AI-server orders, so it is a large majority.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$40.0bn$60.0bn$80.0bn$100bnLevel (USD bn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +11%+10%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $99.8bn
Compared with2026-04: $88.5bn
Change+12.8%
1-yr avg change+11.3% per window (2 obs)
MomentumAccelerating
DriverTaiwan Export Orders: $1.8bn (100% of the change)
ERecent news
  • 2026-08-20Taiwan's July export orders reached a record US$97.9B, up over 60% year on year, driven by AI orders. link ↗ Indicator then: Jul-26 +12.8%

US Server Imports

US server imports (HS 8471.50, world) · Downstream HW: Semi & ODM · Grade 4
AWhy it is importantServers & ODM + Data centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionServers & ODM + Data centres & colo — US server arrivals (HS 8471.50)
Why it mattersServers landing in the US show racks actually being delivered into US data centres, the largest AI demand market.
How representativeAbout 50% of AI-server demand: US is ~55% of global demand and imports ~90% of US supply; mostly hyperscaler and neocloud clusters.
TimingCoincident — Customs value records physical delivery when it happens
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of US imports of servers and processing units (HS 8471.50) from the world.
Higher = more AI racks landing in the US for data center fills.
Formula
Xt = Vt
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VUS Imports HS 8471.50 Processing UnitsUSD bn—100%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-09-06
ScopeUS imports · HS 8471.50 imports from all origins; classification shifts across 8471.50, 8471.80 and 8473.30 can move value.
Share of global total: 50% — 50% of AI-server demand: the US is ~55% of global demand and imports ~90% of US supply.
Comparison windowCustoms value lumpy by shipment (std 16%, flips 67%)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: hardest data on AI racks arriving in the US, but the code is broader than AI servers.
Signal / noise3 / 5SNR 3.0: tariff front-loading, the December 2025 rush before the Sec. 232 AI-chip tariff and the shutdown gap distort months.
Reliability5 / 5Reliability 5.0: official Census data; classification and shutdown gaps limit continuity.
Scope50%Covers ~50% of AI-server demand, so it is about half the market.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$25.0bn$50.0bn$75.0bn$100bnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +18%−1%+18%+31%+20%−15%+42%+87%+14%+25%+15%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $84.1bn
Compared with2026-04: $71.0bn
Change+18.4%
1-yr avg change+17.9% per window (4 obs)
MomentumAccelerating
DriverUS Imports HS 8471.50 Processing Units: $8.3bn (100% of the change)
ERecent news
  • 2026-08-31The Trump administration is weighing extending chip tariffs to laptops and servers, possibly scrapping January's data center exemptions. link ↗ Indicator then: Jul-26 +18.4%
  • 2026-08-11The US trade deficit grew for a fourth consecutive month as AI investment pulled in imports. link ↗ Indicator then: Jul-26 +18.4%

Optical Module Revenue

Optical module / component maker revenue (Innolight, Eoptolink, Coherent, Lumentum, Fabrinet) · Downstream HW: Peripherals (power, optics) · Grade 4
AWhy it is importantNetworking & optics · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionNetworking & optics — Optical transceivers and lasers
Why it mattersOptical modules link GPUs across racks; revenue growth shows cluster scale-out spending turning into shipments.
How representativeInnolight, Eoptolink, Coherent, Lumentum and Fabrinet cover ~55% of the optical-module market; Innolight ~25% and Eoptolink ~15% mainly serve hyperscaler 800G orders.
TimingCoincident — Reported revenue records shipments in the same quarter
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of five optical module and component makers, weighted by each firm's AI datacom share.
Higher = more 800G and 1.6T transceivers and lasers going into AI clusters.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Innolight RevenueUSD mn95%28%
V2Eoptolink RevenueUSD mn95%20%
V3Coherent Datacom / Networking RevenueUSD mn90%23%
V4Lumentum Total RevenueUSD mn75%16%
V5Fabrinet Revenue ($M/qtr)USD mn55%13%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-12
ScopeGlobal (US and China makers) · Innolight, Eoptolink, Coherent datacom, Lumentum, Fabrinet; AI shares 55-95%; other transceiver makers excluded.
Share of global total: 55% — 55% of the transceiver market: Innolight ~25%, Eoptolink ~15%, Coherent ~10%, Lumentum lasers ~5%, plus Fabrinet contract build (partly overlapping).
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: optics scale with cluster size, but members score 4 because revenue mixes telecom and non-AI products.
Signal / noise3.1 / 5SNR 3.1: Coherent restructuring, CNY conversion, Fabrinet single-customer concentration and the 800G to 1.6T transition add noise.
Reliability5 / 5Reliability 5.0: filed quarterly revenue from listed companies; Coherent segment breaks are the main risk.
Scope55%Covers ~55% of transceiver value, so it is a majority read.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3.1 + 0.3 × reliability 5 = 4.03 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$2.0bn$4.0bn$6.0bn$8.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +20%−0%+62%+10%+6%+20%+10%+25%+22%+22%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $7.9bn
Compared with2026Q1: $6.4bn
Change+22.0%
1-yr avg change+19.8% per quarter (4 obs)
MomentumRising (slower)
DriverInnolight added about $395M in 2026Q2 to $3,160M, over half of the $1.42B quarterly increase; Eoptolink added $600M on 1.6T volume.
ERecent news
  • 2026-08-12Lumentum's earnings topped estimates, with supply chain constraints limiting shipments. link ↗ Indicator then: 2Q26 +22.0%
  • 2026-08-05Chinese optical module makers' shares slumped after a report of a planned US import ban on transceivers. link ↗ Indicator then: 2Q26 +22.0%
  • 2026-07-28Zhongji Innolight raised US$6.81B in its Hong Kong listing, Asia's second-largest IPO of 2026. link ↗ Indicator then: 2Q26 +22.0%

DC Networking Revenue

DC switching / networking revenue (NVIDIA + Arista) · Downstream HW: Peripherals (power, optics) · Grade 4
AWhy it is importantNetworking & optics · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionNetworking & optics — AI cluster switching fabric
Why it mattersNetworking spend rises with cluster size; it shows how many GPUs are being wired into single training clusters.
How representativeNVIDIA ~50% and Arista ~15% give ~65% of AI data-centre networking; serves hyperscaler and large neocloud clusters.
TimingCoincident — Revenue booked as switches ship to clusters
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of NVIDIA's data center networking line plus Arista Networks, weighted by AI share.
Higher = AI clusters getting larger and needing more scale-up and scale-out switching.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1NVIDIA Data Center Networking RevenueUSD bn100%86%
V2Arista Networks Revenue ($B/qtr)USD mn45%14%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-04
ScopeGlobal · NVIDIA InfiniBand, Spectrum-X and NVLink (100% AI) plus Arista (45% AI); Cisco, Broadcom switches and white-box excluded.
Share of global total: 65% — 65% of AI data center networking: NVIDIA ~50% and Arista ~15%.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: networking share rising with cluster size signals bigger deployments; it is one step from accelerators.
Signal / noise4 / 5SNR 4.0: NVLink switch recognition timing and Arista deferred-revenue swings on AI acceptance add some noise.
Reliability5 / 5Reliability 5.0: audited quarterly filings from both companies.
Scope65%Covers ~65% of AI DC networking, so it is a large majority.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 5 = 4.30 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$5.0bn$10.0bn$15.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +29%+51%+38%+22%−3%+14%−11%−2%+54%+39%+12%+31%+32%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $16.2bn
Compared with2026Q1: $12.2bn
Change+32.3%
1-yr avg change+28.6% per quarter (4 obs)
MomentumAccelerating
DriverNVIDIA Data Center Networking Revenue: $3.8bn (96% of the change)
ERecent news
  • 2026-08-27NVIDIA reported record fiscal Q2 revenue of about $96B, with data center revenue up 117%. link ↗ Indicator then: 2Q26 +32.3%
  • 2026-08-05Arista raised its 2026 guidance after a Q2 beat, citing supply upside. link ↗ Indicator then: 2Q26 +32.3%

Accton Switch Revenue

Taiwan DC switch revenue (Accton) · Downstream HW: Peripherals (power, optics) · Grade 4
AWhy it is importantNetworking & optics · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionNetworking & optics — White-box 800G switch maker
Why it mattersAccton supplies white-box Ethernet switches to hyperscalers; monthly sales show Ethernet AI fabric build-out speed.
How representativeAccton ~50% of white-box switches; white-box ~30% of AI Ethernet switching, so ~15% of the link. A single-company read, but monthly and early.
TimingCoincident — Monthly sales follow switch shipments closely
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Accton, Taiwan's main white-box data center switch maker.
Higher = more 800G Ethernet switches shipped into AI and cloud data centers.
Formula
Xt = Vt
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VAcctonTWD k—100%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Accton monthly revenue only; Arista, Cisco and other white-box makers excluded. AI share set at 100%.
Share of global total: 15% — 15% of AI Ethernet switching: Accton ~50% of white-box switches, white-box ~30% of AI Ethernet switching.
Comparison windowProject-based switch shipments (std 14%, flips 43%)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: 800G switches are a direct AI networking read, from a single company.
Signal / noise4 / 5SNR 4.0: high DC-networking purity and steady trend (reversal share 24%); project-based shipments add some noise.
Reliability5 / 5Reliability 5.0: statutory monthly filing.
Scope15%Covers ~15% of AI Ethernet switching, so it is a small sample.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 5 = 4.30 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$1.0bn$2.0bn$3.0bn$4.0bnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +14%−6%−3%+31%+16%+34%+18%+37%+11%−4%+8%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-261234567
Latest2026-07: $3.4bn
Compared with2026-04: $2.4bn
Change+40.6%
1-yr avg change+14.0% per window (4 obs)
MomentumAccelerating
DriverAccton: $355mn (100% of the change)
EWhy it moved

What changed. 2026-07: $3.4bn, +40.6% vs 2026-04 (1-yr average +14.0% per window).

  • Accton is the only member: its rolling 3-month revenue reached 3,378 versus 2,403 in April (+40.6%), and monthly revenue has been stepping up since April after a flat 2,200-2,250 range in late 2025 to March.
  • Accton set a third straight monthly revenue record in June (reported 7 Jul) on AI infrastructure demand, so the July total built on an already high base.
  • The 8 Aug report on July revenue tied the jump to AI switch demand and expanding 1.6T port shipments, the higher-speed generation that carries more value per switch.
  • Switch orders follow cloud accelerator deployments, so the same hyperscaler build-out lifting ASIC revenue supports this move; a plateau in monthly records would be the turning signal.
  • So what: Switch revenue is up 41% on 1.6T shipments and cloud AI cluster build-outs; it corroborates ASIC demand, but depends on a few hyperscaler customers.
FRecent news
  • 2026-07-07Accton set a third straight monthly revenue record on AI infrastructure demand. link ↗ Indicator then: Jun-26 +36.2%
  • 2026-08-08Accton revenue jumped on AI switch demand as 1.6T shipments expanded. link ↗ Indicator then: Jul-26 +40.6%

Open the full deep-dive ↓

China Optics Exports

China optical transceiver module exports (China Customs) · Downstream HW: Peripherals (power, optics) · Grade 2
AWhy it is importantNetworking & optics · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionNetworking & optics — China-made optical module exports
Why it mattersChina-based plants make about half of global optical-module value, so their exports track AI cluster optics supply.
How representativeAbout 45% of global optical-module value: China plants ~50%, less non-AI telecom gear in the HS codes; mainly US hyperscaler 800G and 1.6T orders.
TimingCoincident — Customs exports record modules as they ship
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of optical transceiver module exports reported by China Customs.
Higher = more optical modules leaving China, mostly to overseas data centers; a cross-check only.
Formula
Xt = Vt
Readingt = (1/3) × Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VChina Customs Optical Transceiver Module ExportsUSD mn—100%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 0 observations
UnitUSD mn, trailing 3-month average; change in %
FrequencyMonthly · latest period 2024-12 · recorded 2025-04-20
ScopeChina exports · HS 8517.62 and 8517.79 exports, which include non-data-center telecom gear; other countries' plants excluded.
Share of global total: 45% — 45% of global optical-module value: China-based plants ~50%, less telecom gear in the HS codes.
Comparison windowAuto-widened: compared as single months the reading swung by ±18% per month and kept reversing direction (noise cap 12%); trailing 3 months vs the 3 before cut that to ±7%
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: China-based plants dominate optics, but the HS codes are not AI-specific, so it is a cross-check.
Signal / noise1 / 5SNR 1.0: HS codes are dominated by non-DC network equipment, which swamps the AI signal.
Reliability5 / 5Reliability 5.0: official customs statistic; China Customs blocks the cloud sandbox (HTTP 412) so fetches run locally.
Scope45%Covers ~45% of global optical-module value, so it is a large minority.
Grade2 / 50.4 × importance 4 + 0.3 × SNR 1 + 0.3 × reliability 5 = 3.40 → 3, capped at the weaker of SNR / reliability + 1 = 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$2.0bn$3.0bn$4.0bn$5.0bn$6.0bnLevel (USD mn, trailing 3-month average)Change vs the prior 3-month window (%)−35%+7%+25%+1%−32%+3%+5%+1%−23%+12%+7%+5%Dec-21Mar-22Jun-22Sep-22Dec-22Mar-23Jun-23Sep-23Dec-23Mar-24Jun-24Sep-24Dec-24
Latest2024-12: $3.6bn
Compared with2024-09: $3.4bn
Change+4.7%
1-yr avg changen/a per window (0 obs)
MomentumRising (slower)
DriverChina Customs Optical Transceiver Module Exports: −$19mn (100% of the change)
ERecent news
  • 2026-08-11The FCC proposed banning imports of Chinese optical transceivers, putting China's 56% share of global module manufacturing and its export volumes at policy risk. link ↗ Indicator then: Dec-24 +4.7%
  • 2026-08-05Chinese optical module makers' shares slumped after a report that the US plans to ban imports of their transceivers. link ↗ Indicator then: Dec-24 +4.7%

TW Power & Cooling Rev.

Taiwan server power & liquid-cooling revenue (Delta, Lite-On, AVC, Auras) · Downstream HW: Peripherals (power, optics) · Grade 4
AWhy it is importantPower, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling — AI rack power and liquid cooling
Why it mattersPower shelves and liquid cooling are needed for every dense AI rack; their sales show rack build-out beyond the chips.
How representativeAbout 55% of AI-rack power and cooling: Delta ~50% and Lite-On ~15% of power supplies, AVC ~30% and Auras ~10% of liquid cooling; mainly serves NVIDIA rack programs.
TimingCoincident — Sales follow rack shipments month by month
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCombined monthly revenue of Delta, Lite-On, AVC and Auras, weighted by their AI power and cooling share.
Higher = more power supplies and liquid cooling content going into AI racks.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Delta ElectronicsTWD k35%64%
V2Lite-OnTWD k30%15%
V3Asia Vital ComponentsTWD k55%17%
V4AurasTWD k45%4%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Non-USD members are converted at the month-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Delta (35% AI), Lite-On (30%), AVC (55%), Auras (45%); mixed with EV, automation, optoelectronics and notebook thermal.
Share of global total: 55% — 55% of AI-rack power and cooling: power 65% (Delta ~50%, Lite-On ~15%) and cooling 40% (AVC ~30%, Auras ~10%), content-weighted.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: per-rack power and cooling content scales with AI deployment, though members score 3 as they mix other products.
Signal / noise3.6 / 5SNR 3.6: AVC is the most consistent (reversal share 6%); Delta's EV and automation mix, and Lite-On and Auras noise, dilute it.
Reliability5 / 5Reliability 5.0: statutory monthly filings from the same MOPS release.
Scope55%Covers ~55% of AI-rack power and cooling, so it is a majority read.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3.6 + 0.3 × reliability 5 = 4.18 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$250mn$500mn$750mn$1.0bn$1.2bnLevel (USD mn)Change vs prior period (%)1-yr avg +3%−4%−2%+4%+6%+6%−3%−2%+7%+3%+0%−5%+2%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26123
Latest2026-07: $1.3bn
Compared with2026-06: $1.2bn
Change+1.8%
1-yr avg change+3.3% per month (11 obs)
MomentumFlat
DriverAuras: $14mn (61% of the change)
ERecent news
  • 2026-09-06Delta Electronics raised its AI revenue outlook on stronger data center demand, supporting its power and cooling revenue. link ↗ Indicator then: Jul-26 +1.8%
  • 2026-07-31Delta lifted capex to NT$70 billion for global capacity expansion, saying AI demand shows no sign of cooling. link ↗ Indicator then: Jul-26 +1.8%
  • 2026-07-30Lite-On plans a US$919 million Texas investment to expand AI server power product capacity. link ↗ Indicator then: Jun-26 +9.7%
  • 2026-07-14Liquid-cooling orders are booked through year-end with production lines on double shifts. link ↗ Indicator then: Jun-26 +9.7%

US Transformer Imports

US large power transformer imports (HS 8504.23) · Downstream HW: Peripherals (power, optics) · Grade 4
AWhy it is importantPower, grid & cooling + Data centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling + Data centres & colo — Grid large power transformers
Why it mattersTransformers are a hard bottleneck for connecting new data centres to the grid; imports show supply arriving for that.
How representativeAbout 35% of global data-centre-driven demand: imports ~80% of US supply and US ~45% of demand; serves utilities and large campus developers.
TimingLeading — Grid equipment arrives before data centres energise
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of US imports of large power transformers (HS 8504.23), the grid equipment data centers need.
Higher = more grid and substation equipment landing in the US to serve data-center load growth.
Formula
Xt = Vt
Readingt = Σj=0…5 Xt−j trailing 6 months, recomputed every month
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VUS Imports HS 8504.23 Large Power TransformersUSD mn—100%
Changet = Readingt ÷ Readingt−6 − 1 this 6-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 2 observations
UnitUSD mn, trailing 6-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-09-06
ScopeUS imports · Customs-reported large power transformer imports by origin country; excludes domestically made units and smaller distribution transformers.
Share of global total: 35% — About 35% of global DC-driven demand: imports are ~80% of US supply and the US is ~45% of demand.
Comparison windowCustoms value lumpy by shipment (v5, widened from 3): 3-month changes swung −33% to +89% within five months; latest 6 months vs the 6 before
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: transformers are a hard bottleneck for data-center power hookups, so imports read supply-side demand directly.
Signal / noise3 / 5Score 3.0: single shipments are large, so monthly customs value is lumpy (std 35%, direction flips 67%); read the 3-month average.
Reliability5 / 5Score 5.0: official Census customs data, pulled by API; revisions are small.
Scope35%Covers about 35% of the global total, a large but US-only slice.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.40 → 5, capped at the weaker of SNR / reliability + 1 = 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$500mn$1.0bn$1.5bn$2.0bn$2.5bnLevel (USD mn, trailing 6-month sum)Change vs the prior 6-month window (%)1-yr avg +7%+44%+21%+9%+28%+42%+27%+20%+14%+7%+3%−5%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $2.3bn
Compared with2026-01: $2.0bn
Change+11.5%
1-yr avg change+7.0% per window (2 obs)
MomentumAccelerating
DriverThe series is a single import total with no country or product split, so the May-July rise cannot be attributed to a specific supplier or customer.
ERecent news
  • 2026-07-13Global transformer demand is outrunning factory capacity, lengthening lead times as power needs soar. link ↗ Indicator then: Jun-26 +3.0%

Power-Gen Equipment Rev.

Power-generation equipment revenue (GE Vernova Power, Caterpillar, Cummins, Bloom) · Downstream HW: Peripherals (power, optics) · Grade 4
AWhy it is importantPower, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling — On-site and grid generation equipment
Why it mattersGas turbines, gensets and fuel cells power sites the grid cannot serve; sales show how hard firms work around grid delays.
How representativeAbout 50% of data-centre-linked generation equipment: GE Vernova ~35% of heavy-duty gas turbines, Caterpillar ~40% and Cummins ~20% of large gensets; Bloom leads fuel cells.
TimingLeading — Equipment is ordered well before sites need power
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of on-site and grid power-generation equipment makers serving data centers: GE Vernova Power, Caterpillar, Cummins, Bloom.
Higher = more turbines, gensets and fuel cells delivered to power new AI data centers.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1GE Vernova Power Segment RevenueUSD mn30%45%
V2Caterpillar Energy & TransportationUSD mn45%30%
V3Cummins Power Systems Segment SalesUSD mn35%17%
V4Bloom Energy RevenueUSD mn60%8%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-05
ScopeGlobal (US-led) · GE Vernova Power segment, Caterpillar power generation sales, Cummins Power Systems and Bloom Energy; other turbine and genset makers are left out.
Share of global total: 50% — About 50% of DC-linked generation equipment: GE Vernova ~35% of heavy-duty gas turbines, Caterpillar ~40% and Cummins ~20% of large DC gensets.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: direct read on power supply for data centers, but only 30-60% of each maker's revenue is DC-linked (AI shares 0.3-0.6).
Signal / noise3.4 / 5Score 3.4: order and acceptance timing is lumpy (Bloom SNR 2), and turbine revenue also serves utilities and industry.
Reliability4.2 / 5Score 4.2: filed segment revenue from audited reports; CIQ has no orders line for GE Vernova, so revenue is a delivery series.
Scope50%Covers about 50% of DC-linked generation equipment, so it is a solid partial read.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3.4 + 0.3 × reliability 4.2 = 3.88 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$2.0bn$3.0bn$4.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +8%+29%−1%+25%−23%+15%−1%+25%−19%+15%+7%+20%−11%+14%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $4.1bn
Compared with2026Q1: $3.6bn
Change+14.2%
1-yr avg change+7.8% per quarter (4 obs)
MomentumTurned up
DriverBloom Energy Revenue: $189mn (37% of the change)
EWhy it moved

What changed. 2026Q2: $4.1bn, +14.2% vs 2026Q1 (1-yr average +7.8% per quarter).

  • The 14% q/q rise was broad-based: Bloom contributed about 37% of the gain, GE Vernova Power 30%, Caterpillar power generation 25% and Cummins about 8%, all citing data-center demand for on-site and backup power.
  • Bloom's Q2 product revenue reached $935mn (+215% y/y) as AI data-center fuel-cell installations were accepted, taking total revenue past $1bn for the first time; on 28 July it raised 2026 guidance to $3.9-4.2bn.
  • Caterpillar's power generation sales rose to $3.1bn (+29% y/y) on large reciprocating gensets and turbines for data centers, and GE Vernova Power revenue rose to $5.5bn (+14% y/y) led by aeroderivative turbine volume and price.
  • The Q1 dip followed the usual post-Q4 delivery drop; capacity, not demand, is the limit, with GE Vernova's gas backlog plus reservations at 116 GW against 20 GW/year of output and Cummins short of large-genset capacity.
  • So what: Power gear grew 14% q/q versus Accton switches' 47%; with 116 GW of turbine backlog against 20 GW/year output, power delivery will pace AI capacity additions.
FRecent news
  • 2026-08-04Caterpillar lifted its 2026 sales growth target on strong data center demand for power generation equipment. link ↗ Indicator then: 2Q26 +14.2%
  • 2026-08-04Cummins raised its full-year 2026 outlook on data center power demand after strong second-quarter results. link ↗ Indicator then: 2Q26 +14.2%
  • 2026-07-28Bloom Energy reported record second-quarter 2026 revenue and raised full-year guidance. link ↗ Indicator then: 2Q26 +14.2%
  • 2026-07-23GE Vernova's gas turbine backlog rose to 116 GW in the second quarter, pointing to sustained power equipment revenue. link ↗ Indicator then: 2Q26 +14.2%

Open the full deep-dive ↓

US DC Construction

US data-center construction spending (Census C30) · Downstream HW: Data Center · Grade 4
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — US data-centre buildings
Why it mattersShells, power and cooling must be built before servers can be installed, so construction spend gates AI capacity.
How representativeAbout 45% of global data-centre construction spend: Census covers all US private builds; includes non-AI sites, excludes servers inside.
TimingLeading — Buildings precede server installs by several quarters
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of private data-center construction put in place in the US, seasonally adjusted annual rate (Census C30).
Higher = more money being spent on building data-center shells, ahead of equipment installs.
Formula
Readingt = Vt
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VUS Census C30USD bn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
UnitUSD mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-09-01
ScopeUS · All US private data-center construction as counted by Census; includes non-AI builds and excludes servers and equipment inside the building.
Share of global total: 45% — About 45% of global DC construction spend: C30 covers all US private DC construction and the US is ~45% of global.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: strong read on physical DC build, but not AI-specific because non-AI data centers are included.
Signal / noise4 / 5Score 4.0: official monthly series with clear signal; noise comes from non-AI builds and delayed releases after the 2025-10 to 11 shutdown.
Reliability5 / 5Score 5.0: official Census statistic, but large annual revisions each July can rewrite history.
Scope45%Covers about 45% of the global total, so it is the US half of the picture.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 5 = 4.30 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$20.0bn$40.0bn$60.0bn$80.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +4%+11%+9%−7%+2%+7%+1%+13%+2%+7%+1%+6%+6%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $75.2bn
Compared with2026-06: $70.8bn
Change+6.2%
1-yr avg change+4.0% per month (11 obs)
MomentumRising (slower)
DriverCensus C30, seasonally adjusted annual rate: 75,166 in Jul-26 versus 47,810 in Jul-25; monthly gains of 6.4%, 6.2%, 7.7%, 6.2% since April.
ERecent news
  • 2026-09-01Census data showed data-center construction spending surged in July. link ↗ Indicator then: Jul-26 +6.2%
  • 2026-08-03Data centers drove growth in US nonresidential construction spending in June even as total construction spending fell. link ↗ Indicator then: Jul-26 +6.2%
  • 2026-07-28ConstructConnect reported $22.3 billion of data center construction starts, the second-highest on record. link ↗ Indicator then: Jun-26 +7.7%

Frontier DC Capacity

Frontier AI data-center capacity (Epoch) · Downstream HW: Data Center · Grade 4
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — Frontier AI campus capacity
Why it mattersGiant training campuses set the ceiling for frontier model compute; megawatts planned show where future GPU demand will land.
How representativeAbout 50% of AI data-centre capacity under build: Epoch tracks ~40 frontier campuses; mainly OpenAI, Anthropic, Meta, xAI and Google sites.
TimingLeading — Planned megawatts precede chips and racks installed
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionTotal operational plus planned power capacity, in megawatts, of frontier AI data-center campuses tracked by Epoch AI.
Higher = more frontier-scale AI compute sites operating or planned; a step up usually means new campuses added.
Formula
Readingt = Vt
where V = the member's reported value in MW:
TermMember (reported series)Native unitAI shareWeight
VEpoch AI Frontier Data CentersMW—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
UnitMW; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-24
ScopeGlobal (mostly US) · About 40 frontier AI campuses, tracked by satellite imagery and permit filings; smaller and non-frontier data centers are left out.
Share of global total: 50% — About 50% of AI DC capacity under build: Epoch's ~40 campuses cover roughly half.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: purpose-built for AI-scale sites, so it reads AI data-center demand directly, though limited to frontier campuses.
Signal / noise4 / 5Score 4.0: consistent method, but it moves only when sites are added or re-estimated, not with smooth activity.
Reliability4 / 5Score 4.0: third-party research database built from satellite and permit data; estimates can be revised.
Scope50%Covers about 50% of AI DC capacity under build, a broad slice of frontier demand.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 4 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.005,00010k15kLevel (MW)Change vs prior period (%)1-yr avg +11%+8%+9%+5%+3%+7%+22%+10%+11%+4%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 12,535
Compared with2026-06: 12,068
Change+3.9% reported — not comparable (greyed)
1-yr avg change+10.9% per month (11 obs)
MomentumTurned up
DriverEpoch AI Frontier Data Centers: 467 (100% of the change)
ERecent news
  • 2026-08-11Super Micro landed a gigawatt-scale AI data-center deal with SpaceX and xAI, adding to planned frontier capacity. link ↗ Indicator then: Jul-26 +3.9%
  • 2026-08-11Mistral AI outlined a $38 billion European compute plan, adding planned frontier training capacity. link ↗ Indicator then: Jul-26 +3.9%

Utility Contracted DC Load

US utility contracted DC load (Dominion, AEP, Southern, Exelon) · Downstream HW: Data Center · Grade 4
AWhy it is importantData centres & colo + Power, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo + Power, grid & cooling — Utility-contracted large load
Why it mattersSigned power contracts show data-centre projects reaching firm commitment; grid supply is a key limit on AI growth.
How representativeAbout 20% of global: Dominion, AEP, Southern and Exelon hold ~45% of the US contracted large-load pipeline; serves hyperscaler campuses.
TimingLeading — Power contracts are signed years before load arrives
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly gigawatts of large electricity load contracted with four US utilities, mostly for data centers: Dominion, AEP, Southern, Exelon.
Higher = more signed data-center power demand that utilities must serve, a leading sign of DC builds.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Dominion Energy Data-Center Capacity under Electric Service AgreementsGW100%25%
V2AEP Contracted Load Additions by 2030GW80%30%
V3Southern Co / Georgia Power Contracted Large LoadGW80%15%
V4Exelon High-Probability Large Load PipelineGW85%30%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 3 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitGW; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-06
ScopeUS · Contract-backed stages only (ESA, LOA, high-probability) at Dominion, AEP, Southern Co and Exelon; other utilities and speculative queue requests are excluded.
Share of global total: 20% — About 20% of global: four utilities ≈ 45% of the US contracted large-load pipeline, and the US is ~45% of global.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: signed power contracts are among the most direct and early signals of committed data-center demand.
Signal / noise3.2 / 5Score 3.2: AEP raises its figure every quarter, Georgia Power approvals cause steps, and Exelon tightened its tier definition in 2025.
Reliability4 / 5Score 4.0: company-reported figures on earnings calls and filings, not audited statistics; definitions differ by utility.
Scope20%Covers about 20% of the global total, so it samples a few key utilities.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 3.2 + 0.3 × reliability 4 = 4.16 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
40.060.080.0100Level (GW)Change vs prior period (%)1-yr avg +20%+45%+8%+6%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 90.2
Compared with2026Q1: 84.9
Change+6.2%
1-yr avg change+20.0% per quarter (3 obs)
MomentumRising (slower)
DriverAEP rose 4.8 GW to 55.2 and Southern 4.8 to 13.6; Exelon fell 5.95 to 9.35; Dominion 10.4 to 12.0.
EWhy it moved

What changed. 2026Q2: 90.2, +6.2% vs 2026Q1 (1-yr average +20.0% per quarter).

  • The aggregate's net gain came from AEP and Southern adding about 4.8 GW each with Dominion adding 1.6 GW, while Exelon's 5.9 GW drop offset more than half of that; this was not a sector-wide increase.
  • Southern signed about 6 GW of new large-load contracts in the quarter, including a 25-year, 3.2 GW Georgia Power agreement with OpenAI near Savannah and roughly 3 GW at Alabama Power, raising contracted load to 17 GW (disclosed 30 Jul 2026).
  • AEP added about 6 GW of signed load agreements in Q2, mostly in Texas, which lifted contracted additions through 2030 to 69 GW, and on 30 Jul 2026 it raised its 2026 EPS guidance to $6.25-6.55.
  • Exelon now counts a project as high-probability only once the customer signs a transmission security agreement and posts collateral; that cut the category from 18 GW to about 11 GW, so the decline reflects stricter screening rather than customers leaving.
  • So what: Contracted gigawatts are rising more slowly as utilities demand collateral, so 2028+ load is firming up; check against CBRE under-construction data, where Atlanta's surge matches Southern's gains.
FRecent news
  • 2026-08-04Southern Co. said contracted large load rose to 17 GW in the second quarter. link ↗ Indicator then: 2Q26 +6.2%
  • 2026-07-31Exelon cut its high-probability data-center load pipeline by 40% after screening requests. link ↗ Indicator then: 2Q26 +6.2%
  • 2026-07-31Dominion beat second-quarter 2026 profit estimates, with data-center demand underpinning its contracted capacity. link ↗ Indicator then: 2Q26 +6.2%
  • 2026-07-30AEP raised full-year guidance on AI-driven demand, citing a 69 GW demand pipeline. link ↗ Indicator then: 2Q26 +6.2%

ERCOT Large-Load Approvals

ERCOT large loads approved to energize · Downstream HW: Data Center · Grade 3
AWhy it is importantData centres & colo + Power, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo + Power, grid & cooling — Texas approved large loads
Why it mattersApproval to energise is a late-stage step, so Texas approvals show large AI and other sites about to draw power.
How representativeAbout 5% of global load: ERCOT ~15% of the US pipeline, rounded down for crypto and industrial loads. Small but a clean monthly official read.
TimingLeading — Approval comes just before sites energise
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionGigawatts of large electricity loads that ERCOT, the Texas grid operator, has approved to energize.
Higher = more large loads, mostly data centers, cleared to connect to the Texas grid.
Formula
Readingt = Vt
where V = the member's reported value in GW:
TermMember (reported series)Native unitAI shareWeight
VERCOT Large Loads Approved to EnergizeGW—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 9 observations
UnitGW; change in %
FrequencyMonthly · latest period 2026-05 · recorded 2026-08-20
ScopeTexas (ERCOT) · Official ERCOT count of large loads approved to energize; includes crypto and industrial loads, and excludes other US grids.
Share of global total: 5% — About 5%: ERCOT ≈ 15% of the US large-load pipeline × US ≈ 45% of global gives ~7, rounded down for non-DC loads.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: approval to energize is a firm, late-stage step toward power use, but includes non-AI loads.
Signal / noise3 / 5Score 3.0: approvals arrive in batches, and crypto and industrial loads add non-AI noise.
Reliability5 / 5Score 5.0: official grid-operator monthly TAC report, a primary source.
Scope5%Covers only about 5% of the global total, so it is a regional cross-check.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 − 0.5 (scope < 10%) = 3.50 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
6.007.008.009.0010.0Level (GW)Change vs prior period (%)1-yr avg +2%+1%+5%+0%+3%+1%May-23Aug-23Nov-23Feb-24May-24Aug-24Nov-24Feb-25May-25Aug-25Nov-25Feb-26May-26
Latest2026-05: 9.1
Compared with2026-04: 9.0
Change+0.6%
1-yr avg change+2.3% per month (9 obs)
MomentumFlat
DriverERCOT Large Loads Approved to Energize: 0.0 (100% of the change)
ERecent news
  • 2026-09-01ERCOT delayed Batch Zero classifications for Texas large-load projects a second time. link ↗ Indicator then: May-26 +0.6%
  • 2026-08-21ERCOT aims to finish the governor-ordered data-center audit by December. link ↗ Indicator then: May-26 +0.6%
  • 2026-07-28CenterPoint expects 14 GW to be eligible for ERCOT's Batch Zero large-load process. link ↗ Indicator then: May-26 +0.6%

N. America DC Under Constr.

North America DC capacity under construction (CBRE) · Downstream HW: Data Center · Grade 4
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — Leasing-market capacity under construction
Why it mattersCapacity under construction and preleased share show how much new data-centre supply is coming and already claimed.
How representativeAbout 35% of global: North America ~50% of capacity under construction times CBRE primary markets ~75%; mostly hyperscaler preleases.
TimingLeading — Buildings under construction precede energised capacity
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMegawatts of data-center capacity under construction in North America's primary markets, with the share already preleased (CBRE).
Higher = more DC capacity being built, and a high preleased share means tenants have already committed.
Formula
Readingt = Vt
where V = the member's reported value in MW:
TermMember (reported series)Native unitAI shareWeight
VCBRE North America DC Capacity Under ConstructionMW—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous year
1-yr average = mean of Change over the past 12 months 2 observations
UnitMW; change in %
FrequencyYearly · latest period 2026 · recorded 2026-08-31
ScopeNorth America · CBRE primary markets only; secondary markets and self-built hyperscale campuses outside CBRE coverage are left out.
Share of global total: 35% — About 35% of global: North America ≈ 50% of global capacity under construction × CBRE primary markets ≈ 75%.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: direct read of physical DC supply pipeline and preleasing, though not limited to AI workloads.
Signal / noise4 / 5Score 4.0: consistent vendor method; semiannual H1/H2 prints are bucketed as yearly, so updates are infrequent.
Reliability4 / 5Score 4.0: broker market research based on surveys and tracking; estimates can be restated.
Scope35%Covers about 35% of the global total, a large regional block.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 4 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
2,0004,0006,0008,000Level (MW)Change vs prior period (%)1-yr avg +10%+46%+106%−6%+25%2023202420252026
Latest2026: 7,481
Compared with2025: 5,994
Change+24.8%
1-yr avg change+9.6% per year (2 obs)
MomentumTurned up
DriverCBRE North America DC Capacity Under Construction: 1,487 (100% of the change)
EWhy it moved

What changed. 2026: 7,481, +24.8% vs 2025 (1-yr average +9.6% per year).

  • Atlanta drove roughly two-thirds of the ~1.5 GW year-on-year increase, with under-construction capacity up 52% to 2,882 MW; Northern Virginia supplied most of the rest, rising 16.5% to 2,420 MW.
  • Atlanta overtook Northern Virginia as the largest build market thanks to tax incentives, available labor, rural sites and cooperative power supply, while Dominion's batched power delivery limited how quickly Northern Virginia projects could start.
  • Record-low 1.4% vacancy left under 1,500 MW available across primary markets, about six months of absorption, which pushed tenants to commit earlier and lifted preleasing of capacity under construction from 74.3% to 80.4%.
  • Shortages of equipment and mechanical/electrical capacity are delaying ready-for-service dates by more than six months, so part of the increase is projects staying in the pipeline longer, not only new starts.
  • So what: The rebound after 2025's dip is heavily preleased and centred on Atlanta, which matches Southern's 6 GW of new contracted load and suggests demand is moving to markets where power is available.
FRecent news
  • 2026-08-27CBRE reported North American data-center demand outpacing supply despite record construction activity. link ↗ Indicator then: 2025 −5.6%
  • 2026-08-27US data-center vacancy hit a record-low 1.4% in H1 2026, with capacity under construction heavily preleased. link ↗ Indicator then: 2025 −5.6%

Front-End WFE Revenue

Front-end WFE maker revenue (ASML, AMAT, Lam, KLA, TEL, Kokusai, Lasertec) · Semicon Upstream Supply · Grade 5
AWhy it is importantSemi equipment & parts · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts — Front-end wafer-fab tools
Why it mattersFab tools must be bought before chips can be made; revenue shows chipmakers' confidence in future AI and other chip demand.
How representativeASML, AMAT, Lam, KLA, TEL, Kokusai and Lasertec hold ~78% of global WFE (ASML 23%, AMAT 17%, Lam 14%); serve TSMC, Samsung, SK hynix, Micron.
TimingLeading — Tools are ordered 1-2 years before chips ship
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of the seven largest front-end wafer-fab equipment makers: ASML, AMAT, Lam, KLA, TEL, Kokusai, Lasertec.
Higher = chipmakers are buying more fab tools, an early sign of leading-edge logic, HBM and packaging expansion.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1ASML Net Sales (EUR bn/qtr)EUR mn50%33%
V2Applied Materials Revenue ($B/qtr)USD mn45%24%
V3Lam Research Revenue ($B/qtr)USD mn50%18%
V4KLA Revenue ($B/qtr)USD mn50%12%
V5Tokyo Electron SPE SalesJPY bn40%10%
V6Kokusai Electric RevenueJPY mn40%1%
V7Lasertec RevenueJPY mn70%2%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Non-USD members are converted at the quarter-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-10
ScopeGlobal · ASML, Applied Materials, Lam Research, KLA, Tokyo Electron SPE, Kokusai and Lasertec; smaller tool makers are left out.
Share of global total: 78% — About 78% of global WFE (Gartner 2025: ASML 23%, AMAT 17%, Lam 14%, TEL 13%, KLA 8%, Kokusai 2%, Lasertec 1%).
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: tool spend leads chip output and reads leading-edge logic, DRAM/HBM and packaging demand directly.
Signal / noise3.7 / 5Score 3.7: AI share is only 40-70% of each maker's sales; ASML is acceptance-based and Lasertec deliveries are lumpy.
Reliability4.9 / 5Score 4.9: audited filed revenue from listed companies; revisions are negligible.
Scope78%Covers ~78% of global WFE, so it is close to the whole market.
Grade5 / 50.4 × importance 5 + 0.3 × SNR 3.7 + 0.3 × reliability 4.9 = 4.58 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$7.5bn$10.0bn$12.5bn$15.0bn$17.5bnLevel (USD mn)Change vs prior period (%)1-yr avg +5%−1%−11%+17%−8%+6%+8%+15%−6%+1%+1%+7%+1%+10%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $16.4bn
Compared with2026Q1: $15.0bn
Change+9.8%
1-yr avg change+4.7% per quarter (4 obs)
MomentumAccelerating
DriverLam (+15% QoQ) and Applied (+13%) led the quarter, with ASML +6%; Lam's gain came from NAND and DRAM etch/deposition, Applied's from DRAM, advanced logic and packaging.
ERecent news
  • 2026-08-13Applied Materials guided next-quarter revenue above estimates on AI demand. link ↗ Indicator then: 2Q26 +9.8%
  • 2026-07-30Tokyo Electron posted record June-quarter sales and profit, raised guidance and announced larger shareholder returns. link ↗ Indicator then: 2Q26 +9.8%
  • 2026-07-28KLA reported record fiscal fourth-quarter revenue of $3.66 billion and guided higher. link ↗ Indicator then: 2Q26 +9.8%
  • 2026-07-15ASML raised its full-year sales forecast for the second time this year on AI chip demand. link ↗ Indicator then: 2Q26 +9.8%

Japan Equipment Billings

SEAJ Japan-made equipment billings · Semicon Upstream Supply · Grade 4
AWhy it is importantSemi equipment & parts · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts — Japan-made chip tools
Why it mattersJapan-made tools (etch, deposition, inspection) go into every advanced fab; monthly billings give an early tool-demand read.
How representativeAbout 30% of global WFE: TEL, Screen, Kokusai, Lasertec, Canon and Nikon; covers both AI and non-AI fabs, so a broad read.
TimingLeading — Tool billings precede fab output
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly billings of Japan-made semiconductor equipment, reported as a 3-month moving average by SEAJ.
Higher = more Japanese-made chip tools shipped, indicating rising global fab equipment spending.
Formula
Readingt = Vt
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VSEAJ Japan-Made Semiconductor Equipment BillingsJPY bn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Non-USD members are converted at the month-average FX rate before summing.
UnitUSD mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-25
ScopeJapan-made equipment · Billings of Japanese tool makers such as TEL, Screen, Kokusai, Lasertec, Canon and Nikon; non-Japanese makers are excluded.
Share of global total: 30% — About 30% of global WFE: Japan-made tools ≈ 30% of the global total.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: industry billings track tool demand across AI and non-AI fabs, so it is a broad rather than AI-only read.
Signal / noise4 / 5Score 4.0: 3-month averaging smooths noise, but China mature-node demand mixes into the total.
Reliability4 / 5Score 4.0: industry-association statistic compiled from member reports; not audited.
Scope30%Covers about 30% of the global total, so it is a partial, Japan-only view.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 4 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$1.0bn$2.0bn$3.0bn$4.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +3%−3%+3%+6%+1%+4%−6%+3%+2%−3%+1%+6%+7%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $3.4bn
Compared with2026-06: $3.2bn
Change+7.3%
1-yr avg change+2.9% per month (11 obs)
MomentumAccelerating
DriverSEAJ Japan-Made Semiconductor Equipment Billings: $235mn (100% of the change)
ERecent news
  • 2026-07-30Tokyo Electron, Japan's largest equipment maker, posted record quarterly sales and profit and raised guidance. link ↗ Indicator then: Jun-26 −2.4%

Global Equipment Billings

SEMI global equipment billings (WWSEMS headline) · Semicon Upstream Supply · Grade 4
AWhy it is importantSemi equipment & parts · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts — All chip equipment billings
Why it mattersTotal equipment billings show how much the whole industry is investing in new capacity, AI and non-AI.
How representativeAbout 95% of global equipment billings via SEMI and SEAJ members; not AI-specific, so AI share depends on the tool mix.
TimingLeading — Billings precede capacity and chip output
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly worldwide semiconductor equipment billings, the SEMI WWSEMS global headline in US dollars.
Higher = more global chip-equipment spending, a broad sign of fab expansion.
Formula
Readingt = Vt
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VSEMI WWSEMS Global Equipment BillingsUSD bn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-09-03
ScopeGlobal · SEMI and SEAJ member reporting of global equipment billings, with a regional split; non-member sales are left out.
Share of global total: 95% — About 95% of global equipment billings, based on SEMI / SEAJ member reporting.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: near-total market but not AI-specific, so AI share depends on the tool mix.
Signal / noise4 / 5Score 4.0: clean global level, but it has a long lag (about early December for Q3) and includes non-AI demand.
Reliability4 / 5Score 4.0: industry-association compiled figures; free headline, subject to revision as members report.
Scope95%Covers ~95% of global billings, so it is essentially the whole market.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 4 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$20.0bn$25.0bn$30.0bn$35.0bn$40.0bn$45.0bnLevel (USD bn)Change vs prior period (%)1-yr avg +5%−4%−1%+10%−6%+1%+13%+10%−4%+3%+2%+8%+1%+11%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $40.5bn
Compared with2026Q1: $36.5bn
Change+10.9%
1-yr avg change+5.3% per quarter (4 obs)
MomentumAccelerating
DriverSEMI WWSEMS Global Equipment Billings: $4.0bn (100% of the change)
ERecent news
  • 2026-09-03SEMI reported Q2 2026 global equipment billings up 23% year over year to a record $40.53 billion. link ↗ Indicator then: 2Q26 +10.9%
  • 2026-07-15SEMI forecast 2026 global equipment sales at a record $165.9 billion. link ↗ Indicator then: 2Q26 +10.9%

TW Packaging Tool Revenue

Taiwan advanced-packaging & test tool makers revenue · Semicon Upstream Supply · Grade 4
AWhy it is importantSemi equipment & parts + Foundry & packaging · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts + Foundry & packaging — Taiwan CoWoS and test tools
Why it mattersCoWoS packaging is a key AI-chip bottleneck; Taiwan tool makers sell into it before capacity adds appear.
How representativeTaiwan makers ~30% of CoWoS/SoIC process-tool spend and ~35% of AI-chip test-interface spend; mainly serve TSMC and its OSATs.
TimingLeading — Tools are bought before packaging capacity ramps
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of ten Taiwan makers of advanced-packaging and chip-test tools, including CoWoS process tools, sockets and probe cards.
Higher = more orders for CoWoS packaging tools and AI-chip test hardware.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Grand Process TechnologyTWD k60%12%
V2C SunTWD k50%7%
V3Gallant MicroTWD k60%6%
V4Gallant PrecisionTWD k40%5%
V5All Ring TechTWD k40%6%
V6ScientechTWD k40%8%
V7WinWayTWD k60%12%
V8Chunghwa Precision TestTWD k40%12%
V9MPI CorpTWD k40%15%
V10Chroma ATETWD k30%17%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Non-USD members are converted at the month-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Grand Process, C Sun, Gallant Micro, Gallant Precision, All Ring, Scientech, WinWay, CHPT, MPI and Chroma; non-Taiwan tool makers are left out.
Share of global total: 30% — About 30%: Taiwan makers ≈ 30% of CoWoS / SoIC process-tool spend and ≈ 35% of AI-chip test-interface spend.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: CoWoS tools and AI test hardware are direct, early reads of advanced-packaging capacity additions.
Signal / noise2.6 / 5Score 2.6: small caps with lumpy delivery-based recognition; Chroma mixes in EV battery test and several tool legs overlap.
Reliability5 / 5Score 5.0: statutory monthly revenue filings by listed companies.
Scope30%Covers about 30% of global spend, a meaningful but partial slice.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 2.6 + 0.3 × reliability 5 = 4.28 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$50mn$100mn$150mn$200mnLevel (USD mn)Change vs prior period (%)1-yr avg +6%−6%−5%−2%−2%+3%+6%−8%−4%−5%−3%−5%+3%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26123
Latest2026-07: $191mn
Compared with2026-06: $161mn
Change+18.5%
1-yr avg change+6.5% per month (11 obs)
MomentumAccelerating
DriverChroma ATE: $11mn (38% of the change)
ERecent news

No specific event news found for this period.

Packaging & Test Tool Rev.

Packaging & test tool maker revenue (Advantest, Disco, Teradyne, Onto, BESI, Hanmi, ASMPT) · Semicon Upstream Supply · Grade 5
AWhy it is importantSemi equipment & parts + Foundry & packaging · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts + Foundry & packaging — Packaging and test tools
Why it mattersAdvanced packaging and test tools set how many AI chips and HBM stacks can be finished; orders precede that capacity.
How representativeAdvantest, Disco, Teradyne, Onto, BESI, Hanmi and ASMPT cover ~55% of packaging and test tool spend; Advantest ~60% of SoC test, BESI ~70% of hybrid bonding.
TimingLeading — Tools arrive before packaging and test capacity ramps
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of seven leading packaging and test tool makers: Advantest, Disco, Teradyne, Onto, BESI, Hanmi, ASMPT.
Higher = more spending on AI-chip testing, HBM stacking and advanced-packaging tools.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Advantest Total RevenueJPY mn60%59%
V2Disco Quarterly ShipmentsJPY bn45%12%
V3Teradyne Semiconductor Test RevenueUSD mn40%9%
V4Onto Innovation RevenueUSD mn50%5%
V5BESI Total Revenue (EUR mn/qtr)EUR mn50%5%
V6Hanmi Semiconductor Total RevenueKRW mn90%6%
V7ASMPT Semiconductor Solutions Segment RevenueHKD mn25%3%
V8RoboTechnikCNY mn60%1%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Non-USD members are converted at the quarter-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-06
ScopeGlobal · Advantest, Disco, Teradyne, Onto Innovation, BESI, Hanmi and ASMPT Semiconductor Solutions; other packaging and test tool makers are left out.
Share of global total: 55% — About 55% of AP and test tool spend: Advantest ~60% of SoC ATE, Disco ~75% of dicing, BESI ~70% of hybrid bonding.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: HBM bonders, hybrid bonding and AI-chip testers are direct reads of AI packaging and test demand.
Signal / noise3.6 / 5Score 3.6: AI share ranges 25-90%, and ASMPT TCB sits inside a wire-bond cycle.
Reliability4.9 / 5Score 4.9: filed revenue and segment revenue from listed companies.
Scope55%Covers about 55% of global AP and test tool spend, over half the market.
Grade5 / 50.4 × importance 5 + 0.3 × SNR 3.6 + 0.3 × reliability 4.9 = 4.55 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$1.0bn$2.0bn$3.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +11%−15%−1%−5%+37%+18%+3%+2%+10%−2%+12%+14%+19%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $2.8bn
Compared with2026Q1: $2.3bn
Change+19.3%
1-yr avg change+10.9% per quarter (4 obs)
MomentumAccelerating
DriverAdvantest Total Revenue: $148mn (33% of the change)
ERecent news
  • 2026-07-30Advantest posted record quarterly profit on AI chip testing demand and raised its forecast. link ↗ Indicator then: 2Q26 +19.3%
  • 2026-07-29Teradyne beat Q2 2026 estimates with record revenue as AI demand lifted semiconductor test. link ↗ Indicator then: 2Q26 +19.3%
  • 2026-07-23Besi's Q2 2026 orders more than doubled on AI and hybrid bonding demand. link ↗ Indicator then: 2Q26 +19.3%
  • 2026-07-22Samsung plans a 50-tool hybrid bonding production line in Pyeongtaek, a potential demand source for Besi and other bonder makers. link ↗ Indicator then: 2Q26 +19.3%

Tool Sub-Supplier Revenue

Equipment-upstream supplier revenue (Entegris, UCT, MKS, Horiba, VAT, Ichor, Advanced Energy) · Semicon Upstream Supply · Grade 4
AWhy it is importantSemi equipment & parts · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts — Subsystems inside fab tools
Why it mattersGas, RF, vacuum and purity parts sit inside every fab tool, so their sales move just ahead of tool makers' revenue.
How representativeSeven suppliers are ~40% of merchant subsystems, which are ~25% of a fab tool's parts cost; serve ASML, AMAT, Lam and TEL.
TimingLeading — Parts ship before tools are finished and billed
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue of seven suppliers of subsystems and materials to fab-tool makers: Entegris, UCT, MKS, Horiba, VAT, Ichor, Advanced Energy.
Higher = tool makers are building more equipment, so upstream parts demand is rising ahead of fab tool revenue.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Entegris Revenue by SegmentUSD mn40%25%
V2Ultra Clean Holdings Products RevenueUSD mn45%18%
V3MKS Vacuum Solutions Segment RevenueUSD mn45%18%
V4VAT Group Net Sales (CHF m)CHF mn45%11%
V5Horiba Semiconductor Segment SalesJPY mn40%10%
V6Ichor Holdings Revenue ($M/qtr)USD mn45%9%
V7Advanced Energy Semiconductor Equipment RevenueUSD mn45%9%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Non-USD members are converted at the quarter-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-07
ScopeGlobal · Gas and fluid delivery, RF power, vacuum, mass-flow controllers and purity products from these seven; other parts suppliers are left out.
Share of global total: 40% — About 40% of merchant supply of a category worth ≈ 25% of the WFE bill of materials.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: parts shipped to tool makers lead tool revenue, but demand reflects all fabs, not just AI.
Signal / noise3.2 / 5Score 3.2: AI share is about 40-45% per company; Entegris also depends on fab utilisation, and MKS and AEIS mix non-semi lines.
Reliability4.9 / 5Score 4.9: audited filed revenue and segment revenue from listed companies.
Scope40%Covers about 40% of merchant supply, a solid partial sample.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3.2 + 0.3 × reliability 4.9 = 4.03 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$800mn$1.0bn$1.2bn$1.4bnLevel (USD mn)Change vs prior period (%)1-yr avg +6%+0%+11%−5%+1%−2%+1%+2%+21%2Q234Q232Q244Q242Q254Q252Q261
Latest2026Q2: $1.3bn
Compared with2026Q1: $1.0bn
Change+21.0%
1-yr avg change+5.6% per quarter (4 obs)
MomentumAccelerating
DriverUCT (+48), VAT (+38), MKS (+37) and Horiba (+30) led the USD mn QoQ gain; every member grew.
EWhy it moved

What changed. 2026Q2: $1.3bn, +21.0% vs 2026Q1 (1-yr average +5.6% per quarter).

  • All seven suppliers grew 11-32% quarter on quarter; the largest dollar gains came from Ultra Clean (~22%), VAT (~18%) and MKS (~17%), so the jump reflects higher fab-tool build rates across the sector rather than one company.
  • Ultra Clean's Q2 revenue rose from $533.7mn to a record $644.9mn (reported 3 Aug 2026), and Q3 guidance of $700-750mn implies its subsystem build rate for equipment makers is still rising.
  • MKS semiconductor revenue reached $554mn, up 19% quarter on quarter (reported 5 Aug 2026), as tool makers increased orders for vacuum, power and gas-delivery subsystems ahead of advanced-logic and memory fab expansions tied to AI data centers.
  • VAT's record Q2 order intake of CHF 500mn, up 40% quarter on quarter (22 Jul 2026), points to further revenue gains over the next one to two quarters; a fall in orders would be the first sign of a peak.
  • So what: Subsystem revenue typically leads equipment makers' shipments by about a quarter, so this step-up suggests WFE output rises in 2H26, ahead of the memory capacity increases in DRAM pricing indicators.
FRecent news
  • 2026-08-04Entegris beat Q2 2026 forecasts and its shares rose 9% on strong materials and purity-solutions demand. link ↗ Indicator then: 2Q26 +21.0%
  • 2026-08-03Ultra Clean reported record Q2 2026 revenue, though cash burn weighed on the stock. link ↗ Indicator then: 2Q26 +21.0%
  • 2026-08-03Advanced Energy posted record Q2 2026 revenue and signalled broader growth into 2027 on semiconductor and AI demand. link ↗ Indicator then: 2Q26 +21.0%
  • 2026-07-22VAT Group beat H1 2026 revenue expectations with record orders, though AI-ramp margin pressure hit the shares. link ↗ Indicator then: 2Q26 +21.0%

TW Tool Parts Revenue

Taiwan equipment-parts makers revenue (Gudeng + Foxsemicon) · Semicon Upstream Supply · Grade 4
AWhy it is importantSemi equipment & parts · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts — EUV pods and tool modules
Why it mattersGudeng's EUV pods and Foxsemicon's modules are needed at the start of tool building; monthly sales give an early tool read.
How representativeAbout 20% of Taiwan-sourced WFE parts: Gudeng ~80% of EUV pods, Foxsemicon ~10% of AMAT outsourced modules; only ~45-70% AI-linked.
TimingLeading — Parts are made before tools ship
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of two Taiwan equipment-parts makers: Gudeng, which makes EUV pods, and Foxsemicon, which makes AMAT modules.
Higher = more EUV layers and Applied Materials tool builds, an early monthly signal for fab equipment demand.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Gudeng PrecisionTWD k70%45%
V2FoxsemiconTWD k45%55%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Non-USD members are converted at the month-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Gudeng Precision (EUV pods) and Foxsemicon (AMAT outsourced modules and parts); other Taiwan parts suppliers are left out.
Share of global total: 20% — About 20% of Taiwan-sourced WFE parts: Gudeng ≈ 80% of EUV pods and Foxsemicon ≈ 10% of AMAT outsourced modules.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: both firms sit early in the tool supply chain, but only ~45-70% of sales are AI-linked.
Signal / noise3.6 / 5Score 3.6: two companies make it concentrated, and Foxsemicon has a small global share.
Reliability5 / 5Score 5.0: statutory monthly revenue filings by listed companies.
Scope20%Covers about 20%, so it is a narrow sample of parts supply.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3.6 + 0.3 × reliability 5 = 4.18 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$10mn$20mn$30mn$40mn$50mnLevel (USD mn)Change vs prior period (%)1-yr avg +3%−8%−3%+8%+1%−14%−8%−9%−6%−4%−4%+6%−5%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $49mn
Compared with2026-06: $52mn
Change−5.2%
1-yr avg change+2.7% per month (11 obs)
MomentumTurned down
DriverFoxsemicon: −$5mn (182% of the change)
ERecent news
  • 2026-09-01Gudeng expects robust second-half revenue growth in advanced-packaging wafer carriers. link ↗ Indicator then: Jul-26 −5.2%
  • 2026-08-07Foxsemicon is investing US$234 million in a Thailand Phase II expansion of its semiconductor equipment footprint. link ↗ Indicator then: Jul-26 −5.2%

Tool Exports (NL+JP+US)

Equipment exports: Netherlands + Japan + US (HS 8486, world) · Semicon Upstream Supply · Grade 4
AWhy it is importantSemi equipment & parts · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts — Tool exports from NL, JP, US
Why it mattersExports show finished chip tools leaving the main makers, before fabs book them as equipment and start output.
How representativeAbout 80% of global HS 8486 exports: Netherlands, Japan and US are ~85% of the total; includes China DUV and mature-node tools.
TimingLeading — Exports precede fab installation and output
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of semiconductor manufacturing equipment (HS 8486) exported to the world by the Netherlands, Japan and the US.
Higher = more chip tools shipped worldwide, a monthly read on fab equipment demand.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Netherlands HS 8486 ExportsEUR bn45%45%
V2Japan HS 8486 Exports — WorldUSD bn35%28%
V3US HS 8486 ExportsUSD bn40%27%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 3 observations
Non-USD members are converted at the month-average FX rate before summing.
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-05 · recorded 2026-08-15
ScopeNetherlands, Japan, US exports · Official customs exports under HS 8486 from the three main exporters; other exporting countries are left out.
Share of global total: 80% — About 80% of global HS 8486 exports: the three exporters ≈ 85% of the total.
Comparison windowEUV deliveries of $150-200mn each swing the month (std 33%)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Score 4: measures tool shipments broadly, but includes China DUV and mature-node tools that are not AI.
Signal / noise3.2 / 5Score 3.2: single EUV tools make Dutch months lumpy, and most US-brand tools ship from offshore plants.
Reliability5 / 5Score 5.0: official customs statistics from Census, CBS and Japan MoF, published about 4-6 weeks after month-end.
Scope80%Covers about 80% of global exports, so it is close to the whole traded market.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3.2 + 0.3 × reliability 5 = 4.06 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$6.0bn$7.0bn$8.0bn$9.0bnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg −2%−5%+2%−1%+8%−6%+20%−6%−0%−4%+3%−4%−7%May-23Aug-23Nov-23Feb-24May-24Aug-24Nov-24Feb-25May-25Aug-25Nov-25Feb-26May-261234
Latest2026-05: $7.2bn
Compared with2026-02: $7.7bn
Change−6.5%
1-yr avg change−2.5% per window (3 obs)
MomentumFalling faster
DriverNetherlands HS 8486 Exports: −$352mn (148% of the change)
ERecent news
  • 2026-08-19Japan's July exports beat estimates on robust chip shipments, with chip equipment exports up about 49%. link ↗ Indicator then: May-26 −6.5%
  • 2026-07-15ASML raised its 2026 sales outlook to about 45 billion euros and expanded EUV capacity plans, lifting Dutch tool exports. link ↗ Indicator then: May-26 −6.5%

Tool Shipments → Taiwan

Tool shipments into Taiwan (mirror: NL + JP exports to Taiwan) · Semicon Upstream Supply · Grade 2
AWhy it is importantSemi equipment & parts + Foundry & packaging · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts + Foundry & packaging — Tools shipped into Taiwan
Why it mattersTaiwan hosts leading-edge and CoWoS capacity, so tool shipments there show AI chip capacity being added.
How representativeAbout 15% of global: Taiwan ~20% of WFE demand, and Netherlands plus Japan ~70% of its tool imports; mainly serves TSMC.
TimingLeading — Tools arrive a year or more before output
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly value of chip-making equipment exported from the Netherlands and Japan to Taiwan, mirroring Taiwan's tool imports.
Higher = more tools for Taiwan's leading-edge (N3 / N2) and CoWoS capacity being delivered.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Netherlands HS 8486 ExportsEUR bn65%60%
V2Japan HS 8486 Exports — to TaiwanUSD bn65%40%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-06 · recorded 2026-08-27
ScopeNetherlands + Japan to Taiwan · HS 8486 exports from the Netherlands and Japan to Taiwan; US and other origins and non-Taiwan destinations are excluded.
Share of global total: 15% — About 15%: Taiwan ≈ 20% of global WFE demand, and NL + JP ≈ 70% of its tool imports.
Comparison windowLumpy EUV deliveries into Taiwan (std 30%, sign flips 67%)
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: Taiwan is where leading-edge and CoWoS capacity is built, so destination data reads AI capacity directly.
Signal / noise1.4 / 5Score 1.4: single EUV tools dominate the monthly print, making the series very lumpy.
Reliability5 / 5Score 5.0: official customs statistics; Taiwan import data by origin cover the same flow with less lag.
Scope15%Covers about 15% of the global total, a narrow but AI-relevant flow.
Grade2 / 50.4 × importance 5 + 0.3 × SNR 1.4 + 0.3 × reliability 5 = 3.92 → 4, capped at the weaker of SNR / reliability + 1 = 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$1.0bn$2.0bn$3.0bnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +3%−26%+20%−36%+67%−17%+44%+11%+31%−15%−1%−11%Jun-23Sep-23Dec-23Mar-24Jun-24Sep-24Dec-24Mar-25Jun-25Sep-25Dec-25Mar-26Jun-26
Latest2026-06: $2.9bn
Compared with2026-03: $2.1bn
Change+37.8%
1-yr avg change+2.6% per window (4 obs)
MomentumTurned up
DriverNetherlands HS 8486 Exports: $493mn (104% of the change)
ERecent news
  • 2026-07-15ASML raised 2026 guidance for the second time this year, with Taiwan's share of its sales rising to 30%. link ↗ Indicator then: Jun-26 +37.8%

Foundry & Memory Capex

Leading foundry + memory fab capex (TSMC, SK hynix, Samsung, Micron) · Semicon Upstream Supply · Grade 4
AWhy it is importantFoundry & packaging + Memory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionFoundry & packaging + Memory & storage — Leading foundry and memory capex
Why it mattersTSMC and the memory makers decide how much AI chip and HBM capacity exists; their capex shows expected AI demand.
How representativeTSMC, SK hynix, Samsung and Micron are ~65% of global semiconductor capex in 2026; it funds wafers and HBM for NVIDIA and custom ASICs.
TimingLeading — Capex is committed before capacity and revenue
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly capital spending of the four largest advanced chipmakers: TSMC, SK hynix, Samsung Electronics semiconductors and Micron.
Higher = chipmakers are funding more fab capacity, which will translate into equipment orders.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1TSMC Capex ($M/qtr, TTM)TWD mn60%28%
V2SK hynix Capex ($M/qtr, TTM)USD mn70%29%
V3Samsung Electronics Semiconductor Facility InvestmentKRW tn40%22%
V4Micron Cash Capital ExpenditureUSD mn60%21%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Non-USD members are converted at the quarter-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-31
ScopeGlobal · TSMC, SK hynix, Samsung semiconductor facility investment and Micron cash capex; Intel, SMIC and others are left out.
Share of global total: 65% — About 65% of global semiconductor capex in 2026.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Score 5: capex by the largest foundry and memory buyers is the direct source of tool demand for AI logic and HBM.
Signal / noise3.2 / 5Score 3.2: quarterly timing is noisy, and Samsung's split between memory and foundry is opaque.
Reliability4.8 / 5Score 4.8: filed capex from listed companies; reported values rarely revised.
Scope65%Covers about 65% of global capex, so it is a majority view.
Grade4 / 50.4 × importance 5 + 0.3 × SNR 3.2 + 0.3 × reliability 4.8 = 4.40 → 5, capped at the weaker of SNR / reliability + 1 = 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$5.0bn$10.0bn$15.0bn$20.0bn$25.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +22%+7%−11%+18%+60%−12%−17%+10%+58%−20%+38%2Q234Q232Q244Q242Q254Q252Q2612
Latest2026Q2: $24.0bn
Compared with2026Q1: $17.3bn
Change+38.4%
1-yr avg change+21.6% per quarter (4 obs)
MomentumTurned up
DriverTSMC added the most, rising to $9.4bn from $6.6bn; SK hynix ($5.4bn), Micron ($4.7bn) and Samsung ($4.4bn) also rose, with Samsung and SK hynix rebounding from Q1.
EWhy it moved

What changed. 2026Q2: $24.0bn, +38.4% vs 2026Q1 (1-yr average +21.6% per quarter).

  • The 38% Q2 rise was broad-based, with all four spenders higher, but TSMC drove about 41% of the increase and SK hynix and Samsung about 23% each, leaving Micron at 13%.
  • TSMC spent about $15.6bn in Q2, 42% more than in Q1, and on 16 July lifted its 2026 capex guide to $60-64bn from $52-56bn in January, citing long-term customer commitments for advanced nodes and packaging.
  • Memory makers turned record HBM and DRAM profits into capacity: Samsung's first-half facility investment topped $19bn alongside a record 2,450tn-won domestic plan, and SK hynix raised 2026 investment to a record ~$31bn on 29 July.
  • Micron's fiscal Q3 (March-May) net capex reached $7.1bn as it lifted fiscal 2026 spending to about $27bn, mostly for Taiwan and US clean rooms; Q2 broke the usual Q1 dip and Q4 spike, already topping Q4 2025.
  • So what: Fab capex rose 38% in Q2 while Dutch, Japanese and US tool exports rose only 8.7%, so clean rooms ran ahead of tool deliveries; tool shipments should catch up.
FRecent news
  • 2026-09-03TSMC fab equipment demand has nearly doubled in six months, pushing 2026 capex toward $64B amid tool shortages. link ↗ Indicator then: 2Q26 +38.4%
  • 2026-08-07SK hynix will invest $38 billion in new memory chip plants. link ↗ Indicator then: 2Q26 +38.4%
  • 2026-08-03SK hynix raised its annual chip investment to a record $31B. link ↗ Indicator then: 2Q26 +38.4%
  • 2026-07-27TSMC raised its 2026 capex budget to capture long-term AI and HPC demand. link ↗ Indicator then: 2Q26 +38.4%

Open the full deep-dive ↓

Hyperscaler Capex

AI infrastructure reported cash capex (US big 5 + 6 neoclouds) · Funding · Grade 5
AWhy it is importantCloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCloud & neoclouds — Hyperscaler and neocloud capex
Why it mattersThis cash spend buys the GPUs, servers and buildings every other link sells into; it is the chain's demand source.
How representativeUS big 5 ~70% plus six neoclouds ~15% give ~85% of global AI data-centre capex in 2026; Q2-2026 AI-weighted capex ~$100bn hyperscalers and $17bn neoclouds.
TimingCoincident — Reported cash spend matches current purchases; orders lead
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly cash capital spending of the five largest US cloud companies and six listed neoclouds, most of it for AI data centers.
Higher = more cash committed to AI infrastructure, the main demand driver for chips, servers and power.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1AMZN Cash Capital ExpenditureUSD bn75%22%
V2GOOGL Cash Capital ExpenditureUSD bn90%19%
V3MSFT Cash Capital ExpenditureUSD bn90%23%
V4META Cash Capital ExpenditureUSD bn90%15%
V5ORCL Cash Capital ExpenditureUSD bn95%7%
V6CRWV Cash Capital ExpenditureUSD bn100%6%
V7NBIS Cash Capital ExpenditureUSD bn100%5%
V8IREN Cash Capital ExpenditureUSD bn90%2%
V9Applied Digital Cash Capital ExpenditureUSD bn100%1%
V10TeraWulf Cash Capital ExpenditureUSD bn90%1%
V11Cipher Mining Cash Capital ExpenditureUSD bn90%0%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-20
ScopeUS (big 5 + neoclouds) · AMZN, GOOGL, MSFT, META, ORCL, CRWV, NBIS, IREN, Applied Digital, TeraWulf and Cipher; China hyperscalers, sovereign and private buyers are left out.
Share of global total: 85% — About 85% of global AI DC capex in 2026: big 5 ≈ 70% plus six listed neoclouds ≈ 15%.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only).
Signal / noise3.9 / 5Score 3.9: AI-weighted; only timing noise, plus non-AI spend at Amazon (logistics) and IREN (mining).
Reliability5 / 5Score 5.0: audited cash capex from filings; statutory and rarely revised.
Scope85%Covers about 85% of global AI DC capex, close to the whole market.
Grade5 / 50.5 × SNR 3.9 + 0.5 × reliability 5 = 4.45 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$50.0bn$100bn$150bn$200bnLevel (USD bn)Change vs prior period (%)1-yr avg +19%−2%+19%+6%+22%+7%+29%+0%+25%+9%+27%+17%+22%2Q234Q232Q244Q242Q254Q252Q2612
Latest2026Q2: $172bn
Compared with2026Q1: $141bn
Change+22.1%
1-yr avg change+18.9% per quarter (4 obs)
MomentumAccelerating
DriverAmazon ($40.7bn) and Alphabet ($40.4bn) led; Meta jumped to $27.1bn from $17.1bn, while Oracle eased to $15.7bn from $17.7bn.
ERecent news
  • 2026-08-02Amazon raised its 2026 AI capex plan to $220B and said capacity will not meet demand through 2027. link ↗ Indicator then: 2Q26 +22.1%
  • 2026-07-01CoreWeave guided 2026 capital spending to $30-35B to double its AI infrastructure capacity. link ↗ Indicator then: 2Q26 +22.1%

Hyperscaler Free Cash Flow

AI infrastructure free cash flow (US big 5 + 6 neoclouds) · Funding · Grade 4
AWhy it is importantCloud & neoclouds + Capital & funding · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCloud & neoclouds + Capital & funding — Cash left after capex
Why it mattersFree cash flow shows whether buyers can fund AI spend from operations or must borrow, which limits how long spending lasts.
How representativeSame ~85% of global AI data-centre capex (US big 5 ~70%, six neoclouds ~15%); mainly a read on hyperscaler funding capacity.
TimingLagging — Cash flow reflects past earnings and spending
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly free cash flow (operating cash flow minus capex) of the five largest US cloud companies and six listed neoclouds.
Higher = more internal cash to fund AI spending; lower or negative = growing reliance on debt or equity.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Amazon Free Cash FlowUSD bn100%22%
V2Alphabet Free Cash FlowUSD bn100%19%
V3Microsoft Free Cash FlowUSD bn100%23%
V4Meta Free Cash Flow ($B/qtr, TTM)USD bn100%15%
V5Oracle Free Cash FlowUSD bn100%7%
V6CoreWeave Free Cash FlowUSD bn100%6%
V7Nebius Free Cash FlowUSD bn100%5%
V8IREN Free Cash Flow ($B/qtr, TTM)USD bn100%2%
V9Applied Digital Free Cash FlowUSD bn100%1%
V10TeraWulf Free Cash Flow ($B/qtr)USD bn100%1%
V11Cipher Mining Free Cash FlowUSD bn100%0%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 3 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-20
ScopeUS (big 5 + neoclouds) · Amazon, Alphabet, Microsoft, Meta, Oracle, CoreWeave, Nebius, IREN, Applied Digital, TeraWulf and Cipher; whole-company FCF, not AI-only.
Share of global total: 85% — About 85% of global AI DC capex, so weights follow capex: big 5 ≈ 70%, six neoclouds ≈ 15%.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only).
Signal / noise2.9 / 5Score 2.9: capex dominates moves but tax timing adds noise, and it is whole-company FCF; neocloud FCF is lumpy with GPU deliveries.
Reliability5 / 5Score 5.0: cash-flow figures from audited filings; statutory and rarely revised.
Scope85%Covers about 85% of the global AI capex base, close to the whole market.
Grade4 / 50.5 × SNR 2.9 + 0.5 × reliability 5 = 3.95 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
−$25.0bn$0.00$25.0bn$50.0bn$75.0bnLevel (USD bn)Change vs prior period (%)1-yr avg −15%+78%−22%+5%−4%+7%−8%−29%−16%+78%−25%−97%2Q234Q232Q244Q242Q254Q252Q2612345
Latest2026Q2: −$7.3bn
Compared with2026Q1: $1.4bn
Changesign flip −$8.7bn
1-yr avg change−14.7% per quarter (3 obs)
MomentumFalling faster
DriverAmazon -8.82B, Alphabet -5.86B, CoreWeave -5.74B, Nebius -3.41B offset by Microsoft +19.64B; group -7.32B versus +1.36B in Q1 and +44.3B in 2025Q4.
EWhy it moved

What changed. 2026Q2: −$7.3bn, sign change (1-yr average −14.7% per quarter).

  • Alphabet (-$16.0bn) and Meta (-$11.5bn) made up about 84% of the $32.6bn gross decline, partly offset by $23.8bn of gains at Oracle, Amazon and Microsoft; the common driver was AI capex outrunning operating cash.
  • Alphabet spent $44.9bn on capex in Apr-Jun and on 22 Jul raised 2026 guidance to as much as $205bn, turning its quarterly free cash flow negative for the first time.
  • Meta's capex reached $31.1bn against $31.9bn of operating cash, leaving $784m of reported free cash flow, and on 29 Jul it lifted the floor of its 2026 capex range again while legal charges also weighed.
  • The offsets were timing, not restraint: Amazon recovered from its seasonal Q1 payables outflow despite raising 2026 capex to $220bn on 30 Jul, and Oracle's fiscal Q4 collections narrowed its burn before Jun-Aug fell back to -$5.4bn.
  • So what: Group cash burn widened while the compute backlog rose $152bn; contracted demand is now funded by debt, making bond-market access the binding constraint.
FRecent news
  • 2026-07-31Meta fell about 10% after burning through nearly all its cash in a single quarter on AI spending. link ↗ Indicator then: 1Q26 −96.9%
  • 2026-07-31Microsoft said cash will keep flowing from AI spending, and its shares rose. link ↗ Indicator then: 1Q26 −96.9%

Open the full deep-dive ↓

Hyperscaler Total Debt

AI infrastructure total debt outstanding (US big 5 + 6 neoclouds) · Funding · Grade 5
AWhy it is importantCapital & funding + Cloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Cloud & neoclouds — Borrowing by AI infrastructure buyers
Why it mattersRising debt shows AI buildout outrunning internal cash; it signals financing risk if returns or credit conditions weaken.
How representativeSame ~85% of global AI data-centre capex; Q2-2026 debt ~$310bn hyperscalers and $86bn neoclouds; borrowers are mainly Oracle, Meta and CoreWeave.
TimingLagging — Debt stock builds after borrowing decisions
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarter-end total debt outstanding of the US big 5 hyperscalers and six listed neoclouds, summed in USD billions.
Higher = more borrowing to fund AI data-center build-out; flat or lower = funding shifting to cash flow or equity.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Oracle Total Debt Outstanding ($B)USD bn100%27%
V2Amazon Total Debt Outstanding ($B)USD bn100%15%
V3Meta Total Debt Outstanding ($B)USD bn100%15%
V4Microsoft Total Debt OutstandingUSD bn100%12%
V5Alphabet Total Debt OutstandingUSD bn100%9%
V6CoreWeave Total Debt OutstandingUSD bn100%13%
V7Nebius Total Debt Outstanding ($B)USD bn100%3%
V8IREN Total Debt Outstanding ($B)USD bn100%2%
V9Applied Digital Total Debt OutstandingUSD bn100%1%
V10TeraWulf Total Debt OutstandingUSD bn100%1%
V11Cipher Mining Total Debt OutstandingUSD bn100%2%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-20
ScopeUS big 5 + listed neoclouds · Oracle, Amazon, Meta, Microsoft, Alphabet, CoreWeave, Nebius, IREN, Applied Digital, TeraWulf, Cipher Mining; excludes China hyperscalers, sovereign, xAI / Stargate, private neoclouds.
Share of global total: 85% — About 85% of global AI DC capex 2026: US big 5 about 70% plus six listed neoclouds about 15%.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only).
Signal / noise3.8 / 5SNR 3.8: filed stock data is smooth, but Microsoft and Amazon debt moves partly reflect repayments and non-AI funding rather than AI.
Reliability5 / 5Reliability 5.0: statutory filings for every member; neocloud project debt and DDTL step up in blocks but are reported.
Scope85%Covers about 85% of global AI DC capex, so it is close to the whole funded universe.
Grade5 / 50.5 × SNR 3.8 + 0.5 × reliability 5 = 4.40 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$200bn$400bn$600bn$800bn$1.00tnLevel (USD bn)Change vs prior period (%)1-yr avg +15%+1%+4%+0%−2%−1%+4%+3%+4%+6%+4%+23%+21%+13%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $867bn
Compared with2026Q1: $767bn
Change+12.9%
1-yr avg change+15.4% per quarter (4 obs)
MomentumRising (slower)
DriverMeta Total Debt Outstanding ($B): $25.5bn (26% of the change)
ERecent news
  • 2026-07-24Moody's warned that unprecedented AI spending threatens the credit quality of Amazon, Meta, Alphabet and others. link ↗ Indicator then: 2Q26 +12.9%
  • 2026-07-23BlackRock's $12B bond sale for Meta's El Paso data center showed AI spending moving the credit market. link ↗ Indicator then: 2Q26 +12.9%

Signed Leases Not Started

Hyperscaler leases signed, not yet commenced · Funding · Grade 4
AWhy it is importantData centres & colo + Capital & funding · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo + Capital & funding — Signed data-centre leases, not started
Why it mattersLeases signed but not started are committed future data-centre demand, a pipeline that feeds developers, power and equipment.
How representativeOracle (~$250bn), Microsoft (~$100bn) and Meta (~$50bn) are ~60% of disclosed hyperscaler uncommenced leases; Amazon and Alphabet are not included.
TimingLeading — Commitments come before capacity is delivered
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionUndiscounted future lease payments on data-center leases that are signed but not yet started, summed for Oracle, Microsoft and Meta.
Higher = hyperscalers committing to more future data-center capacity off balance sheet.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Oracle Leases Signed Not Yet CommencedUSD bn95%63%
V2Microsoft Leases Signed Not Yet CommencedUSD bn85%25%
V3Meta Leases Signed Not Yet CommencedUSD bn90%12%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-29
ScopeUS hyperscalers · Oracle (about $250bn), Microsoft (about $100bn), Meta (about $50bn); no neocloud equivalent is disclosed and Amazon and Alphabet are not included.
Share of global total: 60% — About 60% of disclosed hyperscaler uncommenced leases, from the three companies above.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only).
Signal / noise3.6 / 5SNR 3.6: filed footnotes are clearly AI-linked, but definitions differ by company and one very large lease causes a jump.
Reliability5 / 5Reliability 5.0: filed lease footnotes in 10-Q and 10-K; figures are company-reported and undiscounted.
Scope60%Covers about 60% of disclosed uncommenced leases, so a majority but not all.
Grade4 / 50.5 × SNR 3.6 + 0.5 × reliability 5 = 4.30 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$200bn$400bn$600bn$800bnLevel (USD bn)Change vs prior period (%)1-yr avg +49%+78%+9%+21%+18%+4%+4%+3%+42%+94%+26%+34%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $778bn
Compared with2026Q1: $580bn
Change+34.2%
1-yr avg change+49.0% per quarter (4 obs)
MomentumRising (slower)
DriverMicrosoft Leases Signed Not Yet Commenced: $113bn (57% of the change)
EWhy it moved

What changed. 2026Q2: $778bn, +34.2% vs 2026Q1 (1-yr average +49.0% per quarter).

  • The roughly $198bn quarter rise was a two-company move: Microsoft contributed about 57% and Meta about 44%, while Oracle was flat, so growth came from the two hyperscalers now signing leases at Oracle-like scale.
  • Microsoft's fiscal-year 10-K for the quarter to Jun 30, reported Jul 30, showed leases not yet commenced at $329.1bn versus $196.6bn in March, with more than $130bn signed in one quarter and commencing between FY2027 and FY2033.
  • Meta's Q2 10-Q put leases not yet commenced at about $279bn as of Jun 30, covering data centers, colocation and network sites starting through 2036, and it signed roughly $68bn more in July for 2027-2028 commencement.
  • Oracle stayed near $260bn at its May 31 fiscal year-end, as new signings roughly matched leases commencing; Meta's July $68bn already points to another rise in the Q3 reading.
  • So what: Lease commitments grew 34% in a quarter while 12-week AI debt issuance was flat, so hyperscalers are increasingly securing capacity through off-balance-sheet leases rather than new bonds.
FRecent news
  • 2026-08-11JLL reports record 25 GW of H1 2026 data center absorption, supporting more lease signings. link ↗ Indicator then: 2Q26 +34.2%
  • 2026-08-04Big Tech data-centre lease commitments have built up to about $1 trillion, Reuters reported. link ↗ Indicator then: 2Q26 +34.2%
  • 2026-07-27Data center lease commitments reached $850B, with Meta and Microsoft leading. link ↗ Indicator then: 2Q26 +34.2%

AI-Infra Debt Issuance

AI-infra debt issuance (bonds, HY, DC ABS / CMBS, private credit) · Funding · Grade 3
AWhy it is importantCapital & funding · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding — New AI-infrastructure debt sold
Why it mattersWeekly issuance shows how willing lenders are to fund AI build-out right now; closed markets would slow orders quickly.
How representativeCaptures ~85% of public bonds, high yield, ABS/CMBS and private credit for AI infrastructure; hyperscaler bonds carry the largest weight.
TimingLeading — Funding is raised before spending happens
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionWeekly sum of new AI-infrastructure debt: hyperscaler bonds, neocloud high-yield, data-center ABS / CMBS and private credit.
Higher = capital markets funding more AI build-out; sparse weeks mean the debt window is quiet or shut.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…11 Xt−j trailing 12 weeks, recomputed every week
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Hyperscaler Public Bond IssuanceUSD bn80%60%
V2Neocloud / AI-Infra High-Yield & Secured Bond IssuanceUSD bn100%14%
V3Data-Center ABS / CMBS IssuanceUSD bn90%10%
V4Private Credit / Project Finance for AI Data CentersUSD bn100%16%
Changet = Readingt ÷ Readingt−12 − 1 this 12-week window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 5 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD bn, trailing 12-week sum; change in %
FrequencyWeekly · latest period 2026-08-30 · recorded 2026-09-01
ScopeUS-centred, global AI infra · Hyperscaler public bonds (60% weight), neocloud HY bonds, DC ABS / CMBS, private credit and project finance for AI data centers.
Share of global total: 85% — Weekly logs capture about 85% of AI-infra debt: public IG, HY and ABS / CMBS about 60%, private credit about 40%.
Comparison windowEvent-type flow: a single $20-30bn bond deal dominates any one week
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only).
Signal / noise2.4 / 5SNR 2.4: a single $20-30bn bond dominates any week, and most neocloud weeks are zero, hence a 12-week rolling window.
Reliability4.2 / 5Reliability 4.2: bonds are filings-based, but private credit is media-sourced, disclosed late and includes undrawn commitments.
Scope85%Covers about 85% of AI-infra debt flows, so close to the whole market.
Grade3 / 50.5 × SNR 2.4 + 0.5 × reliability 4.2 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$50.0bn$100bn$150bn$200bnLevel (USD bn, trailing 12-week sum)Change vs the prior 12-week window (%)1-yr avg +34%−100%+52%−35%+12%+1450%+310%−69%+2432%−86%+56%−47%17 Sep24 Dec31 Mar07 Jul13 Oct19 Jan27 Apr03 Aug09 Nov15 Feb24 May30 Aug12
Latest2026-08-30: $46.3bn
Compared with2026-06-07: $57.2bn
Change−18.9%
1-yr avg change+33.7% per window (5 obs)
MomentumFalling (narrowing)
DriverPrivate Credit / Project Finance for AI Data Centers: $4.4bn (100% of the change)
EWhy it moved

What changed. 2026-08-30: $46.3bn, −18.9% vs 2026-06-07 (1-yr average +33.7% per window).

  • Private credit and project finance drove the move: the 12-week sum rose $4.4bn to $46.3bn, entirely from that member (12.5 to 16.9), while hyperscaler bonds (20.0) and neocloud high-yield (9.4) were unchanged.
  • On 28 Aug a $2.4bn debt financing for an Iren AI data center, led by Blue Owl funds, was announced, adding a large private-credit deal to the window.
  • Hyperscaler bond supply is still elevated after Alphabet's A$5.5bn (about $3.9bn) debut Australian-dollar bond on 19-20 Aug and Meta's push for a Korean won bond on 27 Aug, which keep the bond member at $20bn.
  • The year-on-year gap narrowed from -60% to -19% mostly because last year's comparison base shrank; watch whether the 1 Sep bond selloff in Oracle debt slows new issuance.
  • So what: Debt funding for AI buildout is shifting toward private lenders while public bond supply holds steady; rising credit stress in Oracle and neoclouds is the risk to watch.
FRecent news
  • 2026-08-28Blue Owl funds led a $2.4 billion debt financing for an Iren AI data center. link ↗ Indicator then: 23 Aug −59.7%
  • 2026-08-19Alphabet raised about $3.9 billion in its first Australian-dollar bond. link ↗ Indicator then: 16 Aug −60.5%
  • 2026-08-27Meta is pursuing a $724 million won-denominated bond in South Korea to diversify AI funding. link ↗ Indicator then: 23 Aug −59.7%
  • 2026-09-01Oracle shares fell 4% as a bond selloff tested its debt-funded AI buildout. link ↗ Indicator then: 30 Aug −18.9%

Storage Device PPI

US PPI computer storage devices manufacturing (BLS PCU334112334112) · Supply-Demand · Grade 3
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — US storage device prices
Why it mattersStorage prices rise when AI data needs outrun NAND and disk supply, so this index reads tightness in that link.
How representativeAbout 30% proxy: US-made storage devices only, catching SSD, HDD and NAND pass-through; not a global or contract price.
TimingCoincident — Producer prices move with current supply tightness
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly US producer price index for computer storage device manufacturing (BLS series PCU334112334112).
Higher = storage devices getting pricier as NAND / HDD shortage passes through; lower = supply easing.
Formula
Readingt = 30% × Vt
where V = the member's reported value in index:
TermMember (reported series)Native unitAI shareWeight
VBLS PPI seriesindex30%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Unitindex; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-14
ScopeUS (domestic producers) · BLS producer prices of US-made storage devices such as SSD and HDD; not a global price and not a NAND or DRAM contract price.
Share of global total: 30% — About 30% (proxy): US-produced storage price only, captures NAND / HDD / SSD pass-through but is not the global total.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: reads AI-driven storage tightness indirectly, through NAND / HDD pass-through into US producer prices.
Signal / noise3 / 5SNR 3: price moves reflect the storage shortage, but mix, non-AI demand and US-only production add noise.
Reliability5 / 5Reliability 5: official BLS statistic; release lags about one month and is subject to revision.
Scope30%Covers about 30% (proxy), so a partial US-only read of global storage pricing.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
40.060.080.0100120Level (index)Change vs prior period (%)1-yr avg +6%−1%+0%+0%+0%+0%+1%+1%+2%+4%+9%+3%+29%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 117
Compared with2026-06: 102
Change+13.8%
1-yr avg change+6.1% per month (11 obs)
MomentumRising (slower)
DriverBLS PPI series: 14.2 (100% of the change)
ERecent news
  • 2026-07-09Server DRAM contract prices are expected to rise 13-18% quarter on quarter in 3Q26 despite caps from long-term agreements. link ↗ Indicator then: Jun-26 +29.2%
  • 2026-07-04Samsung reportedly planned a 20% DRAM price hike for Q3, pushing up memory and storage device prices. link ↗ Indicator then: Jun-26 +29.2%

TW Memory Module Revenue

Taiwan memory module makers monthly revenue (ADATA 3260 + Transcend 2451) · Supply-Demand · Grade 3
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — Taiwan memory module sellers
Why it mattersADATA and Transcend revenue follows memory prices and volumes, so it gives a quick, small read on DRAM and NAND tightness.
How representativeAbout 10% proxy: two large Taiwan module sellers (ADATA 80% weight, Transcend 20%), not the global memory market; partly AI-driven.
TimingCoincident — Module revenue moves with current memory prices
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Taiwan memory module makers ADATA and Transcend, summed, used as a memory price and volume proxy.
Higher = tighter memory pricing (revenue is price x volume); lower = shortage easing or inventory drawn down.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = (1/3) × Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1ADATA monthly revenue (FinMind)TWD mn100%80%
V2Transcend monthly revenueTWD mn100%20%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn, trailing 3-month average; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · ADATA (3260, 80% weight) and Transcend (2451, 20%); two of the largest Taiwan DRAM / NAND module sellers, excluding memory makers themselves.
Share of global total: 10% — About 10% (proxy): two large Taiwan module sellers, not the global memory market.
Comparison windowAuto-widened: compared as single months the reading swung by ±16% per month and kept reversing direction (noise cap 12%); trailing 3 months vs the 3 before cut that to ±7%
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: reads memory tightness through module pricing, only part of which is AI-driven.
Signal / noise3 / 5SNR 3: revenue mixes price, volume and inventory effects, so it is not a pure price signal.
Reliability4 / 5Reliability 4: monthly revenue filed by listed companies via FinMind; module makers' reporting is timely but unaudited monthly.
Scope10%Covers about 10%, so a narrow sample of the memory supply chain.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$200mn$400mn$600mnLevel (USD mn, trailing 3-month average)Change vs the prior 3-month window (%)1-yr avg +40%−1%+5%+1%−16%+6%−3%+20%+17%+16%+54%+50%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-2612
Latest2026-07: $654mn
Compared with2026-04: $470mn
Change+39.1%
1-yr avg change+39.9% per window (4 obs)
MomentumRising (slower)
DriverADATA monthly revenue (FinMind): $78mn (147% of the change)
ERecent news
  • 2026-08-05DRAM and NAND contract prices hit record highs in July while spot-market momentum faded. link ↗ Indicator then: Jul-26 +39.1%
  • 2026-07-08ADATA reportedly expects Q3 DRAM prices up 20-30% and NAND up 35-40%. link ↗ Indicator then: Jun-26 +43.4%

Neocloud Equity Basket

AI-infra equity funding basket (CRWV, NBIS, ORCL, IREN, APLD) equal-weight index · Funding · Grade 4
AWhy it is importantCapital & funding + Cloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Cloud & neoclouds — Neocloud equity funding access
Why it mattersShare prices set whether neoclouds can raise equity for GPU purchases; a drop tightens funding for capacity build-out downstream.
How representativeFive names (CoreWeave, Nebius, Oracle, IREN, Applied Digital), about 30% proxy of AI-infra financing need; mainly tracks debt-funded GPU rental builders.
TimingLeading — Prices react before raises and capex plans
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionEqual-weight index of weekly closing prices of CoreWeave, Nebius, Oracle, IREN and Applied Digital, rebased to 100 on 2025-08-31.
Higher = equity window open and cheaper equity funding for AI build-out; sharp drops = window shutting.
Formula
Xt = Vt
Readingt = (1/4) × Σj=0…3 Xt−j trailing 4 weeks, recomputed every week
where V = the member's reported value in index:
TermMember (reported series)Native unitAI shareWeight
VWeekly closes via S&P Capital IQ; equal weightindex—100%
Changet = Readingt ÷ Readingt−4 − 1 this 4-week window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 13 observations
Unitindex, trailing 4-week average; change in %
FrequencyWeekly · latest period 2026-08-30 · recorded 2026-09-01
ScopeUS-listed · Five equities with heavy AI-capex financing needs: CRWV, NBIS, ORCL, IREN, APLD; price index only, market caps are not summed.
Share of global total: 30% — About 30% (proxy): five names with heavy AI-capex financing needs, not a share of the global total.
Comparison windowAuto-widened: compared as single weeks the reading swung by ±10% per week and kept reversing direction (noise cap 10%); trailing 4 weeks vs the 4 before cut that to ±4%
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: equity prices show directly whether AI-infra borrowers can raise capital, though they also reflect sentiment.
Signal / noise3 / 5SNR 3: high beta and sentiment swings move prices beyond funding conditions.
Reliability5 / 5Reliability 5: weekly closes from S&P Capital IQ; market prices are not revised.
Scope30%Covers about 30% (proxy), so a partial read of AI-infra financing conditions.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.00100200Level (index, trailing 4-week average)Change vs the prior 4-week window (%)1-yr avg +6%−9%+34%+5%−9%+15%+17%+22%+9%−17%+36%+13%−16%+21%+2%+13%17 Sep24 Dec31 Mar07 Jul13 Oct19 Jan27 Apr03 Aug09 Nov15 Feb24 May30 Aug
Latest2026-08-30: 162
Compared with2026-08-02: 146
Change+11.4%
1-yr avg change+5.8% per window (13 obs)
MomentumTurned up
DriverWeekly closes via S&P Capital IQ; equal weight: 1.5 (100% of the change)
EWhy it moved

What changed. 2026-08-30: 162, +11.4% vs 2026-08-02 (1-yr average +5.8% per window).

  • The basket closed the 30 Aug week at 162.49, up 11.4% from four weeks earlier but still about 20% below the late-June 203; this is a rebound led by high-beta neoclouds (CRWV, NBIS, IREN), not a broad re-rating.
  • CoreWeave's 11 Aug Q2 report, with revenue doubling year on year and a higher 2026 spending plan, lifted the stock about 14% and began the recovery from the 9 Aug trough of 143.19.
  • Nebius raised $5.75bn of convertibles on 25 Aug above its target, and Nvidia's 26 Aug Q2 results pushed CRWV, NBIS and IREN higher, showing funding markets are open again.
  • The rebound is fragile: IREN fell about 6% on 26 Aug before results and a warning of a coming neocloud price crash circulated, so the test is whether further financings price on similar terms.
  • So what: Equity funding capacity has recovered from July, but on sentiment; repeat issuance at tight terms is needed to confirm it.
FRecent news
  • 2026-08-11CoreWeave jumped about 14% after Q2 revenue doubled year on year and it raised its 2026 spending plan. link ↗ Indicator then: 09 Aug −22.6%
  • 2026-08-25Nebius raised $5.75bn of convertible debt, above its initial target, and the stock rose about 4% to end a six-session slide. link ↗ Indicator then: 23 Aug +6.9%
  • 2026-08-26Nvidia's Q2 results lifted CRWV, NBIS and IREN overnight. link ↗ Indicator then: 23 Aug +6.9%
  • 2026-08-27IREN reported a Q4 loss but beat revenue estimates after falling about 6% the day before. link ↗ Indicator then: 23 Aug +6.9%
  • 2026-07-16Nebius sank 13% as the neocloud trade unwound, setting up the July-August drawdown from the late-June peak. link ↗ Indicator then: 12 Jul −9.2%

Open the full deep-dive ↓

NVIDIA Supply Commitments

NVIDIA supply and capacity purchase commitments (10-Q/10-K) · Supply-Demand · Grade 5
AWhy it is importantAI chips & ASIC + Foundry & packaging · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionAI chips & ASIC + Foundry & packaging — NVIDIA forward capacity lock-up
Why it mattersNVIDIA's supplier commitments reserve HBM, CoWoS and foundry capacity; growth signals expected accelerator output and upstream orders.
How representativeAbout 60% of AI accelerator capacity demand (NVIDIA is the dominant buyer); excludes AMD, Broadcom and hyperscaler ASIC purchases.
TimingLeading — Commitments precede shipments by several quarters
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionNVIDIA's quarter-end total supply and capacity purchase commitments to suppliers, as reported in its 10-Q and 10-K, in USD billions.
Higher = NVIDIA locking up more HBM, CoWoS and foundry capacity, so supply is tighter for others.
Formula
Readingt = 60% × Vt
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VNVDA filingsUSD bn60%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-06-10
ScopeGlobal (NVIDIA) · NVIDIA's own supplier commitments only; excludes AMD, Broadcom and hyperscaler ASIC purchases.
Share of global total: 60% — About 60%: NVIDIA is the dominant AI accelerator buyer of HBM, CoWoS and foundry capacity; commitments show its forward lock-up.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Importance 5: directly measures the largest AI buyer's forward capacity reservation for scarce supply.
Signal / noise4 / 5SNR 4: mostly AI-driven, but the Jul-26 figure uses a broader definition, so the jump to 279 is partly definitional.
Reliability4 / 5Reliability 4: audited filings, but definitions changed; the Jul-26 10-Q states it rose from $119bn.
Scope60%Covers about 60% of AI accelerator capacity buying, so the dominant buyer.
Grade5 / 50.4 × importance 5 + 0.3 × SNR 4 + 0.3 × reliability 4 = 4.40 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$50.0bn$100bn$150bnLevel (USD bn)Change vs prior period (%)1-yr avg +32%+39%−4%+42%+35%+6%+7%−3%+5%+10%+89%+25%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $119bn
Compared with2026Q1: $95.2bn
Change+25.0%
1-yr avg change+32.3% per quarter (4 obs)
MomentumRising (slower)
DriverNVDA filings: $23.8bn (100% of the change)
ERecent news
  • 2026-08-29Nvidia locked in $279 billion of commitments largely tied to memory chips to secure supply. link ↗ Indicator then: 2Q26 +25.0%
  • 2026-08-27Nvidia's supply commitments more than doubled to $279 billion, a sharp rise in locked-in supplier purchases. link ↗ Indicator then: 2Q26 +25.0%
  • 2026-08-26Nvidia reported fiscal Q2 2027 profit of $59.69 billion, roughly double a year earlier, on AI spending. link ↗ Indicator then: 2Q26 +25.0%

SK hynix Inventory Days

SK hynix inventory days (inventory / quarterly COGS x 91) · Supply-Demand · Grade 4
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — Lead HBM maker inventory days
Why it mattersHBM is a gating input for AI accelerators; falling inventory days at the top supplier signal tight supply and pricing power.
How representativeSK hynix about 35% of the memory link as leading HBM supplier; serves mainly NVIDIA; excludes Samsung and Micron.
TimingCoincident — Inventory reflects current supply-demand balance
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly inventory days for SK hynix: inventory divided by quarterly cost of goods sold, times 91.
Lower = tighter supply: inventory is being sold faster than it builds; higher = supply loosening or stock building.
Formula
Readingt = 35% × Vt
where V = the member's reported value in days:
TermMember (reported series)Native unitAI shareWeight
VCIQ inventory and COGSdays35%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Unitdays; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-14
ScopeKorea (SK hynix) · SK hynix only, the leading HBM supplier; excludes Samsung and Micron.
Share of global total: 35% — About 35%: SK hynix is the leading HBM supplier, so its inventory days fall when supply is tight.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: inventory days at the lead HBM maker read supply tightness directly.
Signal / noise3 / 5SNR 3: a Q1 seasonal bump each year and non-HBM DRAM / NAND mix add noise.
Reliability5 / 5Reliability 5: computed from filed inventory and COGS via Capital IQ; audited statements.
Scope35%Covers about 35%, so one large supplier of three in DRAM.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
100125150175Level (days)Change vs prior period (%)1-yr avg +1%−24%−14%−11%+22%−18%+6%−11%+36%−32%−4%+10%+5%−8%2Q234Q232Q244Q242Q254Q252Q261
Latest2026Q2: 123 days
Compared with2026Q1: 133 days
Change−7.9%
1-yr avg change+1.0% per quarter (4 obs)
MomentumTurned down
DriverSingle-company series: DRAM bit shipments rose high-single-digit on HBM3E and AI server DRAM, and HBM4 mass shipments began in 2Q26, pulling days from 133 to 123.
ERecent news
  • 2026-07-29SK hynix posted record Q2 profit that missed forecasts, with sales below Wall Street targets and shares down about 10%. link ↗ Indicator then: 2Q26 −7.9%

Micron Inventory Days

Micron inventory days (inventory / quarterly COGS x 91) · Supply-Demand · Grade 4
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — Top-three DRAM/HBM maker inventory
Why it mattersMemory inventory days show whether DRAM and HBM supply is tight enough to limit AI server builds or raise prices.
How representativeMicron about 25% of the memory link, one of three DRAM/HBM makers; fiscal quarters mapped to calendar quarters.
TimingCoincident — Inventory reflects current supply-demand balance
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly inventory days for Micron: inventory divided by quarterly cost of goods sold, times 91.
Lower = tighter supply: inventory is being sold faster than it builds; higher = supply loosening or stock building.
Formula
Readingt = 25% × Vt
where V = the member's reported value in days:
TermMember (reported series)Native unitAI shareWeight
VCIQ inventory and COGS; SEC XBRLdays25%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Unitdays; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-12
ScopeUS (Micron) · Micron only, one of three DRAM / HBM makers; fiscal quarter ends mapped to the nearest calendar quarter end.
Share of global total: 25% — About 25%: Micron is one of three DRAM / HBM makers; fiscal quarters mapped to the nearest calendar quarter end.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: inventory days at a top-three DRAM / HBM maker read supply tightness directly.
Signal / noise3 / 5SNR 3: whole-company mix (DRAM and NAND) and fiscal-quarter mapping add noise.
Reliability5 / 5Reliability 5: filed inventory and COGS (Capital IQ, SEC XBRL for Aug-23 where CIQ was anomalous).
Scope25%Covers about 25%, so one of three DRAM makers.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
100120140160180Level (days)Change vs prior period (%)1-yr avg −3%+12%−8%+2%−4%+4%−8%+9%−15%−11%+3%−1%−1%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 122 days
Compared with2026Q1: 123 days
Change−1.1%
1-yr avg change−2.8% per quarter (4 obs)
MomentumFlat
DriverMicron is the only member; inventory stayed near USD 8.2-8.6bn while quarterly COGS kept rising, so days drifted down 1.1% to 121.8.
ERecent news

No specific event news found for this period.

Samsung Inventory Days

Samsung Electronics inventory days (inventory / quarterly COGS x 91) · Supply-Demand · Grade 2
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — Whole-company Samsung inventory
Why it mattersSamsung is a major HBM and DRAM supplier, but its inventory also mixes phones and displays, so it is a weak memory read.
How representativeAbout 10% effective coverage: whole-company inventory, memory only part; useful mainly as a cross-check against SK hynix and Micron.
TimingCoincident — Inventory reflects current balance, diluted by other units
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly inventory days for whole-company Samsung Electronics: inventory divided by quarterly cost of goods sold, times 91.
Lower = tighter supply: inventory is being sold faster than it builds; higher = supply loosening or stock building.
Formula
Readingt = 10% × Vt
where V = the member's reported value in days:
TermMember (reported series)Native unitAI shareWeight
VCIQ inventory and COGSdays10%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Unitdays; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-14
ScopeKorea (Samsung) · Whole-company inventory including phones, displays and memory; memory is only part.
Share of global total: 10% — About 10%: whole-company inventory (phones, displays, memory); memory is only part, so it is a weak direct read.
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance2 / 5Importance 2: whole-company inventory reads memory supply only weakly.
Signal / noise2 / 5SNR 2: phones, displays and non-memory stock dominate; days rose from 87 to 125 while peers moved the other way.
Reliability4 / 5Reliability 4: audited filings via Capital IQ, but the memory portion cannot be isolated.
Scope10%Covers about 10%, so a weak, partial read of memory.
Grade2 / 50.4 × importance 2 + 0.3 × SNR 2 + 0.3 × reliability 4 = 2.60 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
60.080.0100120140Level (days)Change vs prior period (%)1-yr avg +8%−11%−6%+4%+8%−13%+1%−5%−0%−8%+11%+6%+22%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 124 days
Compared with2026Q1: 102 days
Change+21.9%
1-yr avg change+7.7% per quarter (4 obs)
MomentumAccelerating
DriverCIQ inventory and COGS: 22.40 days (100% of the change)
EWhy it moved

What changed. 2026Q2: 124 days, +21.9% vs 2026Q1 (1-yr average +7.7% per quarter).

  • The jump came from the numerator: inventory rose about KRW13.1tn in the quarter to KRW71.4tn while cost of sales stayed flat at about KRW52.2tn, and finished goods added only KRW1.2tn.
  • Work-in-progress and semi-finished goods added KRW7.4tn and raw materials KRW4.5tn, as long-term supply agreements locked in customer volumes and Samsung pulled forward wafer starts and materials to meet future shipments; chip-division work-in-progress rose 35% in the first half.
  • Cost of sales did not grow with sales because the 28% quarter-on-quarter revenue jump to KRW171.5tn, with the chip division up from KRW81.7tn to KRW127.5tn, came mainly from higher memory prices rather than more units, which inflates days on a cost basis.
  • On July 30 Samsung said the shortage would last into 2028, so this looks like production built ahead of contracted shipments; a rise in finished goods rather than work-in-progress would instead signal unsold stock building up.
  • So what: The rise reflects production built ahead of contracted shipments, not unsold stock: finished goods barely moved while memory contract prices hit records, the opposite of the 2023 glut.
FRecent news
  • 2026-07-30Samsung said the memory chip shortage will extend to 2028 and touted long-term supply deals. link ↗ Indicator then: 2Q26 +21.9%
  • 2026-07-30Samsung posted a record $62 billion quarterly operating profit on the AI memory boom. link ↗ Indicator then: 2Q26 +21.9%
  • 2026-07-06Samsung guided a 19-fold jump in Q2 operating profit on memory demand. link ↗ Indicator then: 2Q26 +21.9%

Microsoft New DC Leases

Microsoft new finance-lease additions (ROU assets obtained, mostly data centers) · Downstream HW: Data Center · Grade 4
AWhy it is importantData centres & colo + Cloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo + Cloud & neoclouds — Hyperscaler data-center finance leases
Why it mattersFinance leases let cloud providers add data-center capacity without upfront capex; a rise shows capacity commitments flowing to landlords downstream.
How representativeMicrosoft only, about 15% of hyperscaler lease activity; mainly Azure and OpenAI capacity, stated as primarily data centers.
TimingLeading — Leases are signed before facilities are live
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionNon-cash data-center-type assets Microsoft obtained under new finance leases in the fiscal quarter, in USD billions.
Higher = Microsoft signing or starting more third-party data-center capacity, ahead of owned-build capex.
Formula
Xt = Vt
Readingt = Σj=0…3 Xt−j trailing 4 quarters, recomputed every quarter
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VSEC 10-Q/10-K XBRL; discrete quartersUSD bn—100%
Changet = Readingt ÷ Readingt−4 − 1 this 4-quarter window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 1 observations
UnitUSD bn, trailing 4-quarter sum; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-30
ScopeUS (Microsoft) · Microsoft finance-lease right-of-use assets, stated as primarily data centers; one hyperscaler only, FQ4 derived as full year less nine months.
Share of global total: 15% — About 15%: Microsoft states finance leases are primarily data centers; one hyperscaler only.
Comparison windowLease signings lumpy by campus (v5, widened from 2): 2-quarter changes swung +62% to −41% within a year; latest 4 quarters vs the 4 before
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: reads a leading hyperscaler's third-party data-center capacity additions, which lead owned-build capex.
Signal / noise3 / 5SNR 3: lease signings are lumpy by campus (std 47%, flips 60%), hence a 2-quarter rolling window.
Reliability4 / 5Reliability 4: SEC XBRL filings, but Q4 is derived by subtraction and not every lease is data-center.
Scope15%Covers about 15%, so a single-company sample.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.70 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$10.0bn$20.0bn$30.0bnLevel (USD bn, trailing 4-quarter sum)Change vs the prior 4-quarter window (%)1-yr avg +20%−26%+77%+130%+272%+238%+249%+140%+76%+78%+33%+39%+20%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $24.6bn
Compared with2025Q2: $20.5bn
Change+20.0%
1-yr avg change+20.0% per window (1 obs)
MomentumRising (slower)
DriverSEC 10-Q/10-K XBRL; discrete quarters: −$1.4bn (100% of the change)
ERecent news
  • 2026-07-30Microsoft brought 88 data centers online in FY2026, the capacity build behind its data center finance lease additions. link ↗ Indicator then: 2Q26 +20.0%
  • 2026-07-29Microsoft raised its capital spending plans on demand, lifting shares 8%. link ↗ Indicator then: 2Q26 +20.0%

Virginia Commercial Power (YoY)

Virginia commercial electricity sales (Northern Virginia DC alley proxy) · Downstream HW: Data Center · Grade 3
AWhy it is importantData centres & colo + Power, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo + Power, grid & cooling — Northern Virginia data-center power load
Why it mattersElectricity sales show data centers actually switched on and drawing power, the physical end of the capacity build.
How representativeVirginia commercial sales, about 10% proxy; data centers are the main driver of load growth but other commercial users are included.
TimingLagging — Load appears after facilities energize
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly commercial-sector electricity sales in Virginia, in GWh, used as a proxy for Northern Virginia data-center load.
Higher = more data-center power demand in the largest US data-center market; compare year on year.
Formula
Readingt = Vt
where V = the member's reported value in GWh:
TermMember (reported series)Native unitAI shareWeight
VEIA state retail salesGWh—100%
Changet = Readingt ÷ Readingt−12 − 1 same month a year earlier (seasonal series)
1-yr average = mean of Change over the past 12 months 10 observations
UnitGWh; change in %
FrequencyMonthly · latest period 2026-06 · recorded 2026-08-10
ScopeUS (Virginia) · EIA state retail sales, commercial sector; data centers are the main driver of load growth but other commercial users are included.
Share of global total: 10% — About 10% (proxy): data centers drive Virginia commercial load growth, but their share of the total is not measured.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: data-center power is the main growth driver, but the series also includes offices and retail.
Signal / noise3 / 5SNR 3: strongly seasonal with a summer peak, so only year-on-year comparison is meaningful.
Reliability4 / 5Reliability 4: official EIA statistic, subject to revision.
Scope10%Covers about 10%, so a partial state-level proxy.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
5,0006,0007,0008,0009,000Level (GWh)Change vs prior period (%)1-yr avg +6%−1%+16%+6%+4%+5%+3%+6%+10%+6%+5%Jun-23Sep-23Dec-23Mar-24Jun-24Sep-24Dec-24Mar-25Jun-25Sep-25Dec-25Mar-26Jun-26
Latest2026-06: 7,771 GWh
Compared with2025-06: 7,412 GWh
Change+4.8%
1-yr avg change+5.9% per month (10 obs)
MomentumRising (slower)
DriverEIA state retail sales: 537 GWh (100% of the change)
ERecent news
  • 2026-08-12Virginia regulators ordered Dominion to directly assign some transmission costs to data centers. link ↗ Indicator then: Jun-26 +4.8%
  • 2026-08-11Data center growth is pushing Dominion deeper into costly power markets to meet Virginia demand. link ↗ Indicator then: Jun-26 +4.8%
  • 2026-07-23A line fault dropped 3 GW of data center load in Virginia, showing the scale of Northern Virginia data center demand. link ↗ Indicator then: Jun-26 +4.8%

AI Hyperscaler Bond Issuance

AI hyperscaler and neocloud USD bond issuance (AMZN, GOOGL, MSFT, META, ORCL, CRWV), monthly · Funding · Grade 3
AWhy it is importantCapital & funding + Cloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Cloud & neoclouds — Hyperscaler and neocloud bond issuance
Why it mattersBond proceeds fund AI capex beyond operating cash flow; heavy issuance signals spending outrunning internal funds, with refinancing risk later.
How representativeSix issuers (Amazon, Alphabet, Microsoft, Meta, Oracle, CoreWeave), about 60% of AI-linked IG and HY bond supply in USD 2025-26.
TimingLeading — Debt is raised ahead of capex spending
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionTrailing three-month sum of USD bonds issued by Amazon, Alphabet, Microsoft, Meta, Oracle and CoreWeave, in USD billions.
Higher = these issuers raising more bond debt to fund AI capex; zero months mean no offering, not missing data.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…5 Xt−j trailing 6 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Amazon USD notes issued; debt funds AI capex buildUSD bn100%17%
V2Alphabet USD notes issued; debt funds AI capex buildUSD bn100%17%
V3Microsoft USD notes issued; debt funds AI capex buildUSD bn100%17%
V4Meta USD notes issued; debt funds AI capex buildUSD bn100%17%
V5Oracle USD notes issued; debt funds AI capex buildUSD bn100%17%
V6CoreWeave USD notes issued; debt funds AI capex buildUSD bn100%17%
Changet = Readingt ÷ Readingt−6 − 1 this 6-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 1 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD bn, trailing 6-month sum; change in %
FrequencyMonthly · latest period 2026-08 · recorded 2026-09-02
ScopeUS (USD tranches) · Amazon, Alphabet, Microsoft, Meta, Oracle and CoreWeave USD notes at announce date; excludes non-USD tranches and preferred / depositary shares.
Share of global total: 60% — About 60% of AI-linked IG / HY bond supply 2025-26; SpaceX / xAI, Nvidia and private SPVs are outside.
Comparison windowEvent-type flow (v5, widened from 3): one $20-30bn deal still dominated any 3-month window (3-month changes swung −77% to +226% in 2026); latest 6 months vs the 6 before
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: bond proceeds mostly fund AI data-center capex, so it reads funding demand directly.
Signal / noise3 / 5SNR 3: issuance is lumpy and excluded currencies and preferreds (e.g. Alphabet AUD, Amazon GBP) leave gaps; trailing sum smooths months.
Reliability4 / 5Reliability 4: issuance is public and filings-based, but classification of use of proceeds and tranche exclusions are judgement calls.
Scope60%Covers about 60% of AI-linked bond supply, a majority.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.70 → 4, capped at the weaker of SNR / reliability + 1 = 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$50.0bn$100bn$150bnLevel (USD bn, trailing 6-month sum)Change vs the prior 6-month window (%)1-yr avg −6%−100%−100%+33%−12%−38%+459%+1367%+40%−6%Aug-23Nov-23Feb-24May-24Aug-24Nov-24Feb-25May-25Aug-25Nov-25Feb-26May-26Aug-261234
Latest2026-08: $119bn
Compared with2026-02: $127bn
Change−6.5%
1-yr avg change−6.5% per window (1 obs)
MomentumTurned down
DriverOracle USD notes issued; debt funds AI capex build: −$25.0bn (125% of the change)
ERecent news
  • 2026-08-06Alphabet sought up to $25 billion in a 10-part bond sale to fund AI infrastructure spending. link ↗ Indicator then: Jul-26 +68.6%
  • 2026-07-07Amazon raised at least $25 billion in a bond sale for AI buildout and said it would issue no more debt in 2026. link ↗ Indicator then: Jun-26 +35.5%

Colo Bookings (DLR+EQIX)

Listed colocation signed bookings, annualized rent (Digital Realty + Equinix) · Downstream HW: Data Center · Grade 4
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — Retail and interconnection colo bookings
Why it mattersNew signed rent shows enterprise and cloud demand for leased data-center space, ahead of revenue recognition.
How representativeEquinix about 11% plus Digital Realty about 7%, roughly 18% of global colocation revenue; mix of enterprise, network and hyperscale tenants.
TimingLeading — Bookings precede revenue by quarters
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionAnnualized rent on new colocation leases signed in the quarter by Digital Realty and Equinix, in USD millions.
Higher = more data-center capacity pre-sold to tenants one to three years before revenue starts.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…1 Xt−j trailing 2 quarters, recomputed every quarter
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Digital Realty total bookingsUSD mn100%47%
V2Equinix annualized gross bookingsUSD mn100%53%
Changet = Readingt ÷ Readingt−2 − 1 this 2-quarter window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 2 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 2-quarter sum; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-09
ScopeGlobal (listed colocation) · Digital Realty total bookings (47% weight, incl. hyperscale) and Equinix gross bookings (53%, retail plus interconnection, excl. xScale).
Share of global total: 18% — About 18%: Equinix about 11% plus Digital Realty about 7% of global colocation revenue (Synergy 2025 shares, rounded).
Comparison windowHyperscale leases of $100-400mn annualized rent land in single quarters (DLR std 92%, flips 80%)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: bookings lead data-center revenue and reflect tenant demand for AI-capable capacity.
Signal / noise3 / 5SNR 3: bookings include non-AI enterprise demand, and Equinix 3Q24-1Q25 figures are derived from later stated YoY rates.
Reliability4 / 5Reliability 4: company-reported metrics, but definitions differ and Equinix disclosed gross bookings only from 2Q25.
Scope18%Covers about 18% of global colocation revenue, a meaningful minority.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.70 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$500mn$1.0bn$1.5bn$2.0bnLevel (USD mn, trailing 2-quarter sum)Change vs the prior 2-quarter window (%)1-yr avg +28%−13%+9%+32%+75%+24%2Q234Q232Q244Q242Q254Q252Q261
Latest2026Q2: $1.8bn
Compared with2025Q4: $1.5bn
Change−3.9% like-for-like (reported +23.6%)
1-yr avg change+27.9% per window (2 obs)
MomentumTurned down
DriverDigital Realty 601 (Q4-25), 1,107 (Q1-26), 1,014 (Q2-26); Equinix 868, 852, 802.
EWhy it moved

What changed. 2026Q2: $1.8bn, −3.9% vs 2025Q4 (1-yr average +27.9% per window).

  • The two-quarter total eased because the second quarter replaced a strong fourth quarter: Digital Realty accounted for about two-thirds of the decline, with bookings of $307mn against $400mn, and Equinix for the rest, with $424mn against a record $474mn.
  • Digital Realty's swing comes from hyperscale timing: its fourth-quarter bookings were $400mn at 100% share but only $175mn at its own share because of large joint-venture leases, and no comparable mega-lease followed its record 200 MW Charlotte AI inference lease in the first quarter.
  • Its smaller second-quarter bookings came mostly from enterprise and interconnection deals, with $88mn from sub-1 MW deployments and $20mn from interconnection, a mix that cannot match a single hyperscale signing in dollar terms.
  • Equinix's $424mn was still its second-highest quarter and up 23% year on year, and both companies raised 2026 guidance in late July, with Digital Realty's signed-not-commenced backlog at $1.9bn, so third-quarter hyperscale signings will decide whether the series turns up again.
  • So what: The dip reflects when hyperscale deals were signed, not weaker demand: retail and interconnection bookings held near records, and the backlog plus guidance raises point to continued data center absorption.
FRecent news
  • 2026-07-29Equinix reported record Q2 bookings and raised its 2026 guidance and long-term outlook. link ↗ Indicator then: 2Q26 +23.6%
  • 2026-07-23Digital Realty posted record Q2 bookings with a $1.9B backlog and raised 2026 guidance, with renewal spreads above 25%. link ↗ Indicator then: 2Q26 +23.6%

Colo MW Leased (IRM+APLD)

Listed wholesale / AI colocation MW leased (Iron Mountain + Applied Digital) · Downstream HW: Data Center · Grade 2
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — Wholesale AI campus MW signed
Why it mattersSigned megawatts show AI campus demand directly, before revenue or capex appears; it is the first sign of new capacity orders.
How representativeIron Mountain plus Applied Digital about 3% of global wholesale leasing; small but a clean trend read, mainly serving AI and cloud tenants.
TimingLeading — Leases precede construction and revenue
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMegawatts of data-center capacity signed in the quarter by Iron Mountain and Applied Digital.
Higher = more AI campus capacity pre-leased; a quiet quarter can just mean no large lease closed.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…1 Xt−j trailing 2 quarters, recomputed every quarter
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Iron Mountain new + expansion MW leased in the quarterMW100%35%
V2Applied Digital MW signed in the fiscal quarterMW100%65%
Changet = Readingt ÷ Readingt−2 − 1 this 2-quarter window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 1 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitMW, trailing 2-quarter sum; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-09
ScopeUS (IRM also Europe / India) · Iron Mountain new plus expansion MW leased (35% weight) and Applied Digital MW signed (65%); wholesale and AI colocation.
Share of global total: <5% — About 3%: roughly 1-2% of global wholesale leasing each.
Comparison windowA 100-400 MW campus lease lands in one quarter
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: MW leased shows AI campus demand directly, before revenue or capex.
Signal / noise2 / 5SNR 2: very lumpy, since one CoreWeave lease can be 150-400 MW, hence a 2-quarter rolling window.
Reliability4 / 5Reliability 4: company supplemental and filings data; Applied Digital is derived from change in signed MW.
Scope<5%Covers about 3%, so a thin sample dominated by single leases.
Grade2 / 50.4 × importance 4 + 0.3 × SNR 2 + 0.3 × reliability 4 − 0.5 (scope < 10%) = 2.90 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
200400600Level (MW, trailing 2-quarter sum)Change vs the prior 2-quarter window (%)1-yr avg +56%−36%+56%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 635
Compared with2025Q4: 407
Change+56.1%
1-yr avg change+56.1% per window (1 obs)
MomentumRising (slower)
DriverApplied Digital MW signed in the fiscal quarter: 400 (108% of the change)
ERecent news
  • 2026-08-05Iron Mountain raised its 2026 outlook as Q2 data center leasing passed 110 MW. link ↗ Indicator then: 2Q26 +56.1%
  • 2026-07-27Applied Digital reported fiscal Q4 and full-year 2026 results, with signed AI and HPC lease capacity driving its MW under lease. link ↗ Indicator then: 2Q26 +56.1%

GDS China Area Committed

GDS Holdings (China) net additional area committed · Downstream HW: Data Center · Grade 2
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — China data-hall area committed
Why it mattersChina colocation demand is a partial read of AI compute demand under export limits; bookings show domestic capacity orders.
How representativeGDS about 4% of global data-center capacity; China only, serving mainly Chinese cloud and internet firms.
TimingLeading — Bookings precede delivery and revenue
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionNet data-hall area newly committed by customers to GDS Holdings in the quarter, in square metres.
Higher = more China data-center demand; negative = churn or deconsolidation.
Formula
Xt = Vt
Readingt = Σj=0…1 Xt−j trailing 2 quarters, recomputed every quarter
where V = the member's reported value in sqm:
TermMember (reported series)Native unitAI shareWeight
VGDS 6-K: net additional total area committedsqm—100%
Changet = Readingt ÷ Readingt−2 − 1 this 2-quarter window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 1 observations
Unitsqm, trailing 2-quarter sum; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-09
ScopeChina · GDS 6-K net additional total area committed in China; excludes other Chinese operators.
Share of global total: <5% — About 4%: GDS is about 3-4% of global data-center capacity; China only.
Comparison windowLarge China wholesale orders and deconsolidations land in single quarters
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: China colocation demand is a partial read of AI compute demand there.
Signal / noise2 / 5SNR 2: churn, deconsolidations and non-AI enterprise demand make the net number volatile and sometimes negative.
Reliability4 / 5Reliability 4: company filing (6-K), but definitions and area basis can change.
Scope<5%Covers about 4%, so a narrow China sample.
Grade2 / 50.4 × importance 3 + 0.3 × SNR 2 + 0.3 × reliability 4 − 0.5 (scope < 10%) = 2.50 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.0050k100kLevel (sqm, trailing 2-quarter sum)Change vs the prior 2-quarter window (%)1-yr avg −82%−84%+380%+26%+114%−69%−82%+859%+1766%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 114,696 sqm
Compared with2025Q4: 6,146 sqm
Change+1766.2% reported — not comparable (greyed)
1-yr avg change−81.9% per window (1 obs)
MomentumTurned up
DriverGDS 6-K: net additional total area committed: 45,940 sqm (100% of the change)
ERecent news
  • 2026-08-14GDS raised 2026 guidance on its Q2 call and set a 1 GW sales target, citing AI-driven data-center demand. link ↗ Indicator then: 2Q26 +1766.2%
  • 2026-08-13GDS reported higher Q2 2026 income and revenue and raised its 2026 revenue guidance. link ↗ Indicator then: 2Q26 +1766.2%
  • 2026-08-12DayOne, GDS's international affiliate, was reported to have confidentially filed for a US IPO of about $5 billion. link ↗ Indicator then: 2Q26 +1766.2%

NEXTDC Contracted MW

NEXTDC contracted utilisation (Australia + Asia) · Downstream HW: Data Center · Grade 2
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — Australia/Asia contracted MW
Why it mattersContracted megawatts at a regional operator show Asia-Pacific cloud and AI demand for capacity, a stock that builds gradually.
How representativeNEXTDC about 2% of global colocation capacity; Australia, Kuala Lumpur, Auckland; serves mainly hyperscalers and enterprises.
TimingLeading — Contracts precede utilisation and revenue
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCumulative megawatts contracted by customers at NEXTDC, an Australia and Asia data-center operator (a stock, not a flow).
Higher = more contracted capacity in Australia / Asia; the change between updates equals new net contracts.
Formula
Readingt = Vt
where V = the member's reported value in MW:
TermMember (reported series)Native unitAI shareWeight
VNEXTDC ASX results / updatesMW—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous half-year
1-yr average = mean of Change over the past 12 months 2 observations
UnitMW; change in %
FrequencyHalf-yearly · latest period 2026H1 · recorded 2026-08-09
ScopeAustralia + Asia · NEXTDC pro forma contracted utilisation across Australia, Kuala Lumpur and Auckland; half-yearly.
Share of global total: <5% — About 2%: roughly 1% of global colocation capacity.
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: contracted MW shows regional AI and cloud demand for data-center capacity.
Signal / noise3 / 5SNR 3: a stock series is smooth, but it includes non-AI enterprise and cloud customers.
Reliability4 / 5Reliability 4: ASX results and company updates; pro forma figures can be restated.
Scope<5%Covers about 2%, so a small regional sample.
Grade2 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 4 − 0.5 (scope < 10%) = 2.80 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.00200400600800Level (MW)Change vs prior period (%)1-yr avg +74%+22%+64%+70%+78%2023H12023H22024H12024H22025H12025H22026H1
Latest2026H1: 740
Compared with2025H2: 417
Change+77.7%
1-yr avg change+73.9% per half-year (2 obs)
MomentumAccelerating
DriverNEXTDC ASX results / updates: 324 (100% of the change)
ERecent news
  • 2026-08-28NEXTDC reported record FY26 contracting, with contracted capacity tripling to 740 MW. link ↗ Indicator then: 2026H1 +77.7%
  • 2026-08-27NEXTDC posted record FY26 earnings and a strong outlook. link ↗ Indicator then: 2026H1 +77.7%
  • 2026-07-21NEXTDC pro forma contracted utilisation rose 11% to 740 MW, with the forward order pipeline reported at 565 MW. link ↗ Indicator then: 2026H1 +77.7%

AI Venture Funding

Global venture funding into AI companies (Crunchbase) · Funding · Grade 3
AWhy it is importantCapital & funding + Models & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Models & AI apps — Venture funding of AI companies
Why it mattersVenture dollars fund model labs and AI apps, the ultimate demand source; funding swings change compute orders downstream.
How representativeCrunchbase covers about 90% of disclosed global venture dollars; concentrated in a few large lab rounds such as OpenAI and Anthropic.
TimingLeading — Funding precedes compute spend by the labs
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionVenture funding raised by AI companies in the quarter, all stages, per Crunchbase, in USD billions.
Higher = more private capital flowing to AI labs and start-ups; a quarter can be dominated by a few mega-rounds.
Formula
Xt = Vt
Readingt = Σj=0…1 Xt−j trailing 2 quarters, recomputed every quarter
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VCrunchbase News quarterly recapUSD bn—100%
Changet = Readingt ÷ Readingt−2 − 1 this 2-quarter window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 2 observations
UnitUSD bn, trailing 2-quarter sum; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-10
ScopeGlobal · All-stage venture rounds for companies Crunchbase tags as AI; latest restated figures.
Share of global total: 90% — About 90%: Crunchbase tracks about 90% of disclosed global venture dollars.
Comparison windowMega-round driven (v5): single rounds (OpenAI, Anthropic, xAI) are 40-80% of a quarter, so a quarter after a record round always reads as a collapse; compared as the latest 2 quarters vs the 2 before
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importancen/aNot scored for this signal class (Funding / Penetration use SNR and reliability only).
Signal / noise3 / 5SNR 3: mega-rounds (OpenAI, Anthropic, xAI) are 40-80% of some quarters, and the AI tag is broad.
Reliability3 / 5Reliability 3: a data-vendor tally of announced rounds, restated later, not audited.
Scope90%Covers about 90% of disclosed venture dollars, so close to the whole disclosed market.
Grade3 / 50.5 × SNR 3 + 0.5 × reliability 3 = 3.00 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$100bn$200bn$300bn$400bnLevel (USD bn, trailing 2-quarter sum)Change vs the prior 2-quarter window (%)1-yr avg +130%+69%+145%+58%−18%+11%+262%+248%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $386bn
Compared with2025Q4: $111bn
Change+247.7%
1-yr avg change+129.6% per window (2 obs)
MomentumAccelerating
DriverTwo-quarter sum $386B (1Q26 $242B, 2Q26 $144B) versus $111B in 3Q25+4Q25, up 248%.
EWhy it moved

What changed. 2026Q2: $386bn, +247.7% vs 2025Q4 (1-yr average +129.6% per window).

  • AI venture funding in the first half of 2026 ran about 3.5 times the second half of 2025, and the jump was highly concentrated: OpenAI and Anthropic alone raised about $218bn, roughly 56% of the half-year total.
  • OpenAI closed a $122bn round at an $852bn valuation on 31 March 2026, the largest private financing on record, which lifted Q1 AI funding to about $242bn, roughly 80% of all global venture dollars.
  • Anthropic followed with a $65bn Series H at a $965bn valuation on 28 May, while 16 billion-dollar-plus rounds, seven of them frontier labs including DeepSeek, StepFun and Moonshot AI, made up 53% of Q2 venture.
  • Q2 AI funding alone fell to roughly $145bn from Q1's $242bn, so the half-year comparison flattens in Q3 unless another frontier-lab round of $50bn-plus closes before the expected IPOs.
  • So what: Funding is effectively frontier-lab compute financing; the roughly $190bn OpenAI/Anthropic raises underwrite cloud compute backlog, so a Q3 funding gap would show up later in backlog growth.
FRecent news
  • 2026-07-23Crunchbase reported billion-dollar-plus rounds are rising, concentrating venture funding in a few large AI financings. link ↗ Indicator then: 2Q26 +247.7%
  • 2026-07-16China and AI led Asia's startup funding to a multiyear peak in Q2 2026. link ↗ Indicator then: 2Q26 +247.7%
  • 2026-07-07North American startup funding set records in H1 2026, driven by AI. link ↗ Indicator then: 2Q26 +247.7%
  • 2026-07-02Global startup investment hit a record $510 billion in H1 2026 as AI accelerated funding and exits. link ↗ Indicator then: 2Q26 +247.7%

VNET committed MW

VNET wholesale IDC capacity committed by customers (MW, quarter-end) · Downstream HW: Data Center · Grade 2
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — China wholesale IDC commitments
Why it mattersCommitted capacity shows hyperscale customer demand in China for wholesale data centers, leading revenue.
How representativeVNET about 2-3% of global colocation capacity (about 1 GW in China); serves mainly Chinese hyperscale cloud customers.
TimingLeading — Commitments precede revenue recognition
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionWholesale data-center capacity that customers have committed to at VNET, China's largest carrier-neutral wholesale operator, in MW at quarter end.
Higher = more China AI / cloud capacity pre-committed ahead of delivery.
Formula
Readingt = Vt
where V = the member's reported value in MW:
TermMember (reported series)Native unitAI shareWeight
VVNET "total capacity committed"MW—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitMW; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-20
ScopeChina · VNET wholesale IDC only (retail excluded).
Share of global total: <5% — About 2-3% of global colocation capacity.
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: committed capacity leads revenue, but China AI demand is a smaller part of the global build.
Signal / noise3 / 5SNR 3: stock measure, smooth; includes non-AI cloud tenants.
Reliability4 / 5Reliability 4: company-reported in SEC 6-K releases; older quarters recast.
Scope<5%Covers a small slice of global capacity.
Grade2 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 4 − 0.5 (scope < 10%) = 2.80 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.002505007501,000Level (MW)Change vs prior period (%)1-yr avg +10%+22%+38%+0%+0%+8%+36%+19%+18%+10%+14%+2%+12%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 970
Compared with2026Q1: 869
Change+11.6%
1-yr avg change+9.6% per quarter (4 obs)
MomentumAccelerating
DriverVNET "total capacity committed": 101 (100% of the change)
ERecent news
  • 2026-08-18VNET reported Q2 2026 results with wholesale data-center capacity surpassing 1 GW. link ↗ Indicator then: 2Q26 +11.6%

US DC projects blocked

US data-center projects blocked or delayed by local opposition (Data Center Watch, USD bn per quarter) · Downstream HW: Data Center · Grade 2
AWhy it is importantData centres & colo + Power, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo + Power, grid & cooling — US local opposition to data centers
Why it mattersLocal opposition and permitting friction can block or delay capacity by quarters, constraining where AI supply can land.
How representativeUS is about 45-50% of global data-center capex; tracker coverage of projects is partial, so it is a directional read.
TimingLeading — Delays show before capacity slips
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionValue of US data-center projects blocked or delayed by local opposition in the quarter, as tallied by Data Center Watch (10a Labs), in USD bn.
Higher = more local friction (zoning, water, power-price objections): a headwind to new capacity.
Formula
Readingt = Vt
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VData Center WatchUSD bn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 2 observations
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-29
ScopeUnited States · Projects reported blocked or delayed; tracker coverage partial.
Share of global total: 60% — US is ~45-50% of global data-center capex.
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: permitting friction can delay capacity by quarters.
Signal / noise2 / 5SNR 2: a few multi-billion campuses dominate each quarter.
Reliability2 / 5Reliability 2: advocacy-research tallies from press and local records; full reports partly paywalled.
Scope60%US-only but a large share of the global build.
Grade2 / 50.4 × importance 3 + 0.3 × SNR 2 + 0.3 × reliability 2 = 2.40 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$60.0bn$80.0bn$100bn$120bn$140bnLevel (USD bn)Change vs prior period (%)1-yr avg −8%+33%−48%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $68.0bn
Compared with2026Q1: $130bn
Change−47.7%
1-yr avg change−7.5% per quarter (2 obs)
MomentumTurned down
DriverData Center Watch: −$62.0bn (100% of the change)
EWhy it moved

What changed. 2026Q2: $68.0bn, −47.7% vs 2026Q1 (1-yr average −7.5% per quarter).

  • The halving came from fewer contested projects rather than smaller ones: cases fell to 45 from 75 while the average stayed near $1.5bn versus $1.7bn, and the 45 still exceeded half of all large developments in the quarter.
  • Resistance moved from individual hearings to blanket rules: 14 states proposed statewide moratoriums, New York imposed a one-year statewide pause, and Minneapolis approved a six-month pause in June, keeping projects from reaching the local votes counted here.
  • Q1's $130bn was a record spike, so part of the drop is a base effect, yet Q2 also fell below the $98bn of Q2 2025 as fewer new large proposals entered local approval.
  • With 843 opposition groups across 49 states and 30 statehouses adopting siting or utility rules, watch whether the Q3 count rebounds or projects keep migrating to jurisdictions without pauses.
  • So what: A lower blocked total alongside spreading moratoria means opposition is acting upstream on the pipeline; cross-check against North American data-center construction starts for real slowing.
FRecent news
  • 2026-07-31A report found community opposition helped block $170 billion of US data-center projects. link ↗ Indicator then: 2Q26 −47.7%
  • 2026-07-10About $130 billion of AI data-center projects were reported blocked or delayed so far in 2026, mostly by local opposition. link ↗ Indicator then: 2Q26 −47.7%

US hosting jobs (BLS)

US employment: computing infrastructure, data processing and web hosting (BLS CES, NAICS 518, thousands) · Downstream HW: Data Center · Grade 2
AWhy it is importantData centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionData centres & colo — US hosting and data-processing staffing
Why it mattersOperations headcount follows data-center operation, but the sector is capital-heavy, so jobs move slowly and weakly with AI build.
How representativeUS NAICS 518 employment, about 45% coverage of the labour side; weak read because data centers employ few people.
TimingLagging — Hiring follows facilities going live
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionUS payroll employment in computing infrastructure, data processing and web hosting (NAICS 518), in thousands.
Higher = more people operating cloud and hosting capacity; a slow labour proxy.
Formula
Readingt = Vt
where V = the member's reported value in thousands:
TermMember (reported series)Native unitAI shareWeight
VBLS CES employment, NAICS 518thousands—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 12 observations
Unitthousands; change in %
FrequencyMonthly · latest period 2026-08 · recorded 2026-09-03
ScopeUnited States · NAICS 518 establishments (cloud, hosting, data processing).
Share of global total: 45% — US only.
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance2 / 5Importance 2: data centers are capital- not labour-intensive.
Signal / noise2 / 5SNR 2: dominated by non-AI hosting and IT services staff.
Reliability5 / 5Reliability 5: BLS official statistics.
Scope45%US only.
Grade2 / 50.4 × importance 2 + 0.3 × SNR 2 + 0.3 × reliability 5 = 2.90 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
400450500Level (thousands)Change vs prior period (%)1-yr avg −0%−0%−0%−0%+0%+0%+0%−0%−0%−0%−1%+1%−2%Aug-23Nov-23Feb-24May-24Aug-24Nov-24Feb-25May-25Aug-25Nov-25Feb-26May-26Aug-26
Latest2026-08: 453 thousands
Compared with2026-07: 461 thousands
Change−1.7%
1-yr avg change−0.5% per month (12 obs)
MomentumFlat
DriverBLS CES employment, NAICS 518: -7.70 thousands (100% of the change)
ERecent news
  • 2026-09-04US goods-producing jobs grew at the fastest annual pace in over three years in August, with AI infrastructure build-out cited as a driver. link ↗ Indicator then: Aug-26 −1.7%
  • 2026-08-10The US tech sector added jobs in July even as total payrolls fell. link ↗ Indicator then: Jul-26 +0.2%

US PPI hosting

US PPI: computing infrastructure, data processing and web hosting services (index) · Supply-Demand · Grade 3
AWhy it is importantCloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCloud & neoclouds — US cloud and hosting service prices
Why it mattersPrices for hosting and cloud services show whether compute supply is tight or loose for buyers; rising prices signal scarcity.
How representativeUS producers about 40% of global cloud infrastructure revenue; covers all hosting, not only AI workloads.
TimingCoincident — Prices reflect current supply-demand balance
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionUS producer price index for computing infrastructure, data processing and web hosting services.
Higher = hosting and cloud prices rising: pricing power for compute.
Formula
Readingt = Vt
where V = the member's reported value in index:
TermMember (reported series)Native unitAI shareWeight
VBLS PPI hosting and data processingindex—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Unitindex; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-15
ScopeUnited States · Hosting, cloud infrastructure and data-processing services sold by US producers.
Share of global total: 40% — About 40% of global cloud infrastructure revenue.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: direct read of the price of compute services.
Signal / noise3 / 5SNR 3: list-price surveys lag spot GPU pricing.
Reliability5 / 5Reliability 5: BLS official statistics.
Scope40%Large share of global cloud revenue.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
100110120130Level (index)Change vs prior period (%)1-yr avg +0%+0%+0%+0%+0%+1%+0%+2%+0%+0%−0%+1%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 125
Compared with2026-06: 124
Change+1.1%
1-yr avg change+0.0% per month (11 obs)
MomentumFlat
DriverBLS PPI hosting and data processing: 1.3 (100% of the change)
ERecent news
  • 2026-07-02AWS was reported to have raised prices about 20%, in a move tied to rising AI capacity costs. link ↗ Indicator then: Jun-26 +0.5%

Cooling backlog (TT+JCI)

Cooling and building-systems backlog, AI-weighted (Trane Technologies + Johnson Controls) · Supply-Demand · Grade 3
AWhy it is importantPower, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling — Data-center cooling order backlog
Why it mattersCooling is gating for liquid-cooled AI racks; backlog growth shows orders for thermal gear ahead of facility completion.
How representativeTrane plus Johnson Controls about a quarter of global commercial HVAC; data-center share of their backlog about 15-25%.
TimingLeading — Orders precede deliveries and revenue
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionOrder backlog of Trane Technologies and Johnson Controls, weighted by their estimated data-center share, in USD mn.
Higher = more chillers and thermal systems booked for delivery; a cooling-capacity lead indicator.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Trane Technologies enterprise backlog; ~25% data-center shareUSD mn25%55%
V2Johnson Controls backlog; ~15% data-center shareUSD bn15%45%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-07
ScopeGlobal · Trane enterprise backlog (25% DC share) and Johnson Controls backlog (15% DC share).
Share of global total: 15% — Trane and JCI are about a quarter of global commercial HVAC.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: cooling is a gating item for liquid-cooled AI racks.
Signal / noise3 / 5SNR 3: most of the backlog is non-DC HVAC; acquisitions lift it (Trane 1H26).
Reliability4 / 5Reliability 4: company-reported backlog in 8-K releases.
Scope15%Minority of global thermal-management demand.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$3.0bn$4.0bn$5.0bn$6.0bn$7.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +12%−1%−0%+0%+8%−0%−1%−3%+7%+1%+2%+16%+21%+9%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $6.2bn
Compared with2026Q1: $5.7bn
Change+8.8%
1-yr avg change+12.0% per quarter (4 obs)
MomentumRising (slower)
DriverTrane Technologies enterprise backlog; ~25% data-center share: $350mn (70% of the change)
ERecent news
  • 2026-08-17Trane and Eaton unveiled a joint reference design for power and cooling in AI data centers. link ↗ Indicator then: 2Q26 +8.8%
  • 2026-08-07Trane Technologies reported strong Q2 results and raised full-year revenue and EPS guidance, with data-center demand a driver. link ↗ Indicator then: 2Q26 +8.8%
  • 2026-07-30Johnson Controls raised its outlook as orders reached a record $21 billion in fiscal Q3. link ↗ Indicator then: 2Q26 +8.8%

Si wafer area (MSI)

Worldwide silicon wafer area shipments (SEMI SMG, million square inches) · Semicon Upstream Supply · Grade 3
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — Global silicon wafer area shipments
Why it mattersWafer shipments are the base input of every chip; changes show fab utilisation upstream of AI chip output.
How representativeAbout 95% of global wafer area (SEMI members); AI is a small share, mostly leading-edge logic and HBM DRAM, so a broad gauge.
TimingLeading — Wafers ship before chips and systems
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionWorldwide silicon wafer area shipped by wafer makers in the quarter (SEMI Silicon Manufacturers Group), in million square inches.
Higher = more wafer starts across the industry; AI is a small, leading-edge part of the total.
Formula
Readingt = Vt
where V = the member's reported value in MSI:
TermMember (reported series)Native unitAI shareWeight
VSEMI SMG quarterly releaseMSI—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitMSI; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-05
ScopeGlobal · All polished and epitaxial silicon wafers shipped by SMG members.
Share of global total: 95% — Industry total (about 95%).
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: broad fab-utilisation gauge rather than an AI-specific one.
Signal / noise3 / 5SNR 3: mature-node and memory cycles dominate the area.
Reliability5 / 5Reliability 5: industry association data, consistent definition.
Scope95%Near-global coverage.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
2,5003,0003,5004,000Level (MSI)Change vs prior period (%)1-yr avg +2%−10%−0%−5%+7%+6%−1%−9%+15%−0%+4%−5%+9%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 3,573 MSI
Compared with2026Q1: 3,275 MSI
Change+9.1%
1-yr avg change+1.9% per quarter (4 obs)
MomentumTurned up
DriverSEMI SMG area rose to 3,573 MSI in 2026Q2 from 3,275 MSI in Q1, the highest in the 14-quarter series.
ERecent news
  • 2026-08-07SUMCO posted an operating loss despite record 300mm wafer shipments, saying 5-10% price hikes will not cover rising costs. link ↗ Indicator then: 2Q26 +9.1%
  • 2026-08-06GlobalWafers warned of emerging 12-inch wafer supply constraints as AI demand lifts shipments. link ↗ Indicator then: 2Q26 +9.1%
  • 2026-07-30SEMI reported Q2 2026 global silicon wafer shipments up 9.1% sequentially and 7.4% year on year. link ↗ Indicator then: 2Q26 +9.1%

US fab construction

US construction spending: computer / electronic / electrical manufacturing (Census, SAAR, USD mn) · Semicon Upstream Supply · Grade 3
AWhy it is importantSemi equipment & parts + Foundry & packaging · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionSemi equipment & parts + Foundry & packaging — US fab shell construction
Why it mattersFab shells come before tool installs and output; spending shows future foundry and memory capacity in the US.
How representativeUS about 20% of global fab construction (TSMC Arizona, Intel Ohio, Samsung Taylor, Micron Idaho); also includes other electronics plants.
TimingLeading — Shells precede tool installs by 12-24 months
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionUS private construction spending on computer, electronic and electrical manufacturing plants, seasonally adjusted annual rate, USD mn.
Higher = more US fab and electronics-plant construction in place.
Formula
Readingt = Vt
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VCensus C30 construction spending: computer / electronic / electrical manufacturingUSD mn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
UnitUSD mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-09-01
ScopeUnited States · Census Value Put in Place, manufacturing: computer/electronic/electrical.
Share of global total: 20% — About 20% of global fab construction.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: fab shells precede tool installs by 12-24 months.
Signal / noise3 / 5SNR 3: a handful of mega-projects (TSMC Arizona, Samsung Taylor, Micron) drive it.
Reliability5 / 5Reliability 5: Census official statistics (revised).
Scope20%US only.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$25.0bn$50.0bn$75.0bn$100bn$125bnLevel (USD mn)Change vs prior period (%)1-yr avg −5%+12%+1%+3%−1%−5%−0%−2%−3%−6%−5%−6%−2%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $51.3bn
Compared with2026-06: $52.4bn
Change−2.1%
1-yr avg change−5.5% per month (11 obs)
MomentumFlat
DriverCensus C30 construction spending: computer / electronic / electrical manufacturing: −$1.1bn (100% of the change)
ERecent news
  • 2026-07-22Census data showed manufacturing was the weakest sector in US construction spending, in line with softer fab and electronics plant put-in-place. link ↗ Indicator then: Jun-26 −4.3%
  • 2026-07-20TSMC raised its US investment commitment to $265 billion with another $100 billion for Arizona fabs. link ↗ Indicator then: Jun-26 −4.3%
  • 2026-07-10Micron raised its US manufacturing and supply chain pledge to more than $250 billion. link ↗ Indicator then: Jun-26 −4.3%

AI connectivity revenue

AI connectivity and networking suppliers revenue, AI-weighted (Credo, Astera Labs, Celestica CCS, Ciena, Corning Optical) · Downstream HW: Peripherals (power, optics) · Grade 4
AWhy it is importantNetworking & optics · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionNetworking & optics — AI interconnect and optics suppliers
Why it mattersConnectivity links GPUs inside and across racks; revenue growth shows cluster scale-out and bandwidth needs for AI.
How representativeCredo, Astera Labs, Celestica CCS, Ciena, Corning Optical, about 20% of AI interconnect, retimer, switch and optical-cable revenue; mainly hyperscalers.
TimingCoincident — Revenue tracks current shipments to clusters
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionRevenue of five AI connectivity suppliers — Credo, Astera Labs, Celestica CCS, Ciena and Corning Optical Communications — weighted by AI share, in USD mn.
Higher = more copper cables, retimers, switch systems and fiber shipped into AI clusters.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Credo total revenueUSD mn90%10%
V2Astera Labs revenueUSD mn90%8%
V3Celestica Connectivity & Cloud Solutions segmentUSD mn70%45%
V4Ciena revenueUSD mn35%15%
V5Corning Optical CommunicationsUSD mn45%22%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-05
ScopeGlobal · AECs and SerDes (Credo), PCIe/CXL retimers and switches (Astera), hyperscaler switch and server systems (Celestica CCS), DC interconnect (Ciena), data-center fiber (Corning).
Share of global total: 20% — About 20% of AI interconnect, switch-system and optical-cable revenue.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: scale-up and scale-out connectivity scales with cluster size.
Signal / noise3 / 5SNR 3: Ciena and Corning carry telecom / enterprise business.
Reliability5 / 5Reliability 5: reported revenue and segment revenue (CIQ).
Scope20%Meaningful minority of AI connectivity spend.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$1.0bn$2.0bn$3.0bn$4.0bn$5.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +14%+1%+1%+8%+4%+10%+7%+9%+5%+13%+14%+14%+14%+15%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $4.9bn
Compared with2026Q1: $4.2bn
Change+15.4%
1-yr avg change+14.2% per quarter (4 obs)
MomentumAccelerating
DriverCelestica CCS 2,667 (+17.6%), Credo 393 (+7.4%), Astera 353 (+27.3%), Ciena 550 (+10.1%), Corning 932 (+12.2%); total 4,896 (+15.4%).
ERecent news
  • 2026-09-03Ciena raised its fiscal 2026 revenue outlook after fiscal Q3 results beat estimates. link ↗ Indicator then: 2Q26 +15.4%
  • 2026-09-01Credo reported fiscal Q1 2027 revenue of $479 million, up 115% year on year, on AI data-center demand. link ↗ Indicator then: 2Q26 +15.4%
  • 2026-08-04Astera Labs reported Q2 2026 revenue up 104% year on year on AI connectivity demand. link ↗ Indicator then: 2Q26 +15.4%
  • 2026-07-28Celestica beat Q2 2026 estimates and raised its outlook on hyperscaler demand for connectivity and cloud systems. link ↗ Indicator then: 2Q26 +15.4%

METR time horizon

METR 50% task time horizon of the best model released to date (minutes) · Penetration · Grade 3
AWhy it is importantModels & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps — Frontier model task length
Why it mattersLonger task horizons make models able to do delegated work, raising the value and compute demand of AI use.
How representativeFrontier models from all major labs on one benchmark, about 90% coverage; software tasks only, running maximum of best model.
TimingLeading — Capability gains precede adoption and usage
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionLength of software task (in human-expert minutes) that the best model released to date completes with 50% success, per METR's time-horizon benchmark.
Higher = agents can handle longer tasks unattended: the capability behind agentic adoption.
Formula
Readingt = Vt
where V = the member's reported value in minutes:
TermMember (reported series)Native unitAI shareWeight
VMETR benchmark_results_1_1.yamlminutes—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Unitminutes; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-04-14
ScopeGlobal (frontier labs) · Frontier models measured by METR (Time Horizon v1.1); level held until a new frontier measurement.
Share of global total: 90% — All major frontier labs.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: task length is what turns chat into delegated work.
Signal / noise3 / 5SNR 3: few measurements a year; each model release is a step.
Reliability4 / 5Reliability 4: independent evaluator, published methodology; v1.1 re-estimated history.
Scope90%Frontier capability, not usage.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.70 → 4, capped at the weaker of SNR / reliability + 1 = 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.005001,000Level (minutes)Change vs prior period (%)1-yr avg +73%+0%+0%+1%+0%+182%+78%+91%+56%+98%+70%+74%+104%+45%2Q234Q232Q244Q242Q254Q252Q261234
Latest2026Q2: 1,045 minutes
Compared with2026Q1: 719 minutes
Change+45.3%
1-yr avg change+73.1% per quarter (4 obs)
MomentumRising (slower)
DriverMETR benchmark_results_1_1.yaml: 326 minutes (100% of the change)
EWhy it moved

What changed. 2026Q2: 1,045 minutes, +45.3% vs 2026Q1 (1-yr average +73.1% per quarter).

  • The running record moved from Claude Opus 4.6 (about 12 hours, February 2026) to an early Claude Mythos Preview checkpoint at about 17.4 hours (1,045 minutes), a single-model step of +45%.
  • Anthropic released Mythos Preview on 7 Apr 2026 to a limited set of cybersecurity partners, and METR's evaluation put its 50% horizon at 16+ hours on long autonomous software tasks, above any earlier model.
  • The step was smaller than Q1's +104% because Opus 4.6 had already doubled the record in February, and only 5 of METR's 228 tasks run 16+ hours, capping what the suite can register.
  • Records have still landed in most quarters since 2024, roughly doubling every 4-5 months; next readings depend on METR adding longer tasks and scoring newer releases such as GPT-5.6 and Claude Opus 5.5.
  • So what: Frontier task length (+45% QoQ) grew faster than Google's Gemini API run-rate (+37% QoQ); longer autonomous tasks consume more tokens per job, pushing inference demand ahead of user growth.
FRecent news
  • 2026-07-09OpenAI released GPT-5.6, a new frontier model that could lift the best-to-date METR time horizon. link ↗ Indicator then: 2Q26 +45.3%

Open the full deep-dive ↓

Claude co-authored commits

Public GitHub commits co-authored by Claude (weekly, "Co-Authored-By" trailer) · Penetration · Grade 1
AWhy it is importantEnterprise & consumer use + Models & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionEnterprise & consumer use + Models & AI apps — Coding-agent usage on public GitHub
Why it mattersCoding agents are the first large-scale paid agent use; commit volume shows real delegated work driving token demand.
How representativeOne agent (Claude Code) on public repositories, about 30% proxy; public repos are a minority of code, but the trend is a clean usage read.
TimingCoincident — Commits occur as agents are used
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionPublic GitHub commits per week that carry a 'Co-Authored-By: Claude' trailer, from a third-party dashboard built on GitHub commit search.
Higher = more agent-written code shipped to public repositories.
Formula
Readingt = Vt
where V = the member's reported value in count:
TermMember (reported series)Native unitAI shareWeight
Vclaudescode.dev daily series summed Mon-Suncount—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous week
1-yr average = mean of Change over the past 12 months 11 observations
Unitcount; change in %
FrequencyWeekly · latest period 2026-08-16 · recorded 2026-08-23
ScopeGlobal (public GitHub) · One agent (Claude Code) on public repositories only.
Share of global total: 30% — Public repos are a minority of all code; one of several agents.
CGradingGrade 1 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: coding agents are the first large-scale paid agent use.
Signal / noise2 / 5SNR 2: bulk-automation bots cause single-day spikes.
Reliability2 / 5Reliability 2: third-party dashboard with a ~90-day window; not audited.
Scope30%Partial coverage.
Grade1 / 50.4 × importance 4 + 0.3 × SNR 2 + 0.3 × reliability 2 = 2.80 → 2, capped at the weaker of SNR / reliability + 1 = 1
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.002.0mn4.0mn6.0mnLevel (count)Change vs prior period (%)1-yr avg +5%+1344%−6%+102%03 Sep10 Dec17 Mar23 Jun29 Sep05 Jan13 Apr20 Jul26 Oct01 Feb10 May16 Aug
Latest2026-08-16: 2,781,154
Compared with2026-08-09: 2,619,538
Change+6.2% · 4-wk vs prior 4-wk −17.8%
1-yr avg change+4.8% per week (11 obs)
MomentumTurned up
Driverclaudescode.dev daily series summed Mon-Sun: 161,616 (100% of the change)
ERecent news
  • 2026-07-09Claude rewrote Bun's roughly one million lines of code in 11 days for $165,000, a large-scale example of Claude-authored commits. link ↗ Indicator then: 05 Jul +101.6%

Capex ÷ operating cash

Hyperscaler capex intensity: capex / cash from operations (MSFT, AMZN, GOOGL, META, ORCL) · Funding · Grade 5
AWhy it is importantCapital & funding + Cloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Cloud & neoclouds — Hyperscaler capex vs operating cash
Why it mattersShows whether AI capex is funded by cash flow or needs external debt; a rising ratio flags balance-sheet strain behind orders.
How representativeMicrosoft, Amazon, Alphabet, Meta, Oracle are about 70% of global AI data-center capex; whole-company figures include non-AI spend.
TimingCoincident — Capex and cash flow reported same quarter
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCombined quarterly capex of Microsoft, Amazon, Alphabet, Meta and Oracle divided by their combined cash from operations, in percent.
Higher = AI build-out absorbs more internal cash; above 100% the five must borrow, lease or cut buybacks to keep spending.
Formula
Readingt = 80% × Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VS&P Capital IQ capital_expenditure / cash_from_operations; ORCL fiscal quarter mapped to calendar%80%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Unit%; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-30
ScopeUS · Five US hyperscalers, whole-company capex and cash from operations; Oracle fiscal quarters mapped to calendar quarters.
Share of global total: 70% — About 70%: the five account for roughly 70% of global AI data-center capex.
CGradingGrade 5 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance5 / 5Importance 5: shows whether AI capex is still self-funded or now depends on capital markets.
Signal / noise4 / 5SNR 4: large aggregates, but seasonal cash-flow dips (Microsoft and Oracle tax/collection timing, Amazon Q1) add quarter-to-quarter noise.
Reliability5 / 5Reliability 5: audited filings via S&P Capital IQ.
Scope70%Covers about 70%, so close to the whole hyperscaler market.
Grade5 / 50.4 × importance 5 + 0.3 × SNR 4 + 0.3 × reliability 5 = 4.70 → 5
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
20.0%40.0%60.0%80.0%100.0%Level (%)Change vs prior period (%)1-yr avg +9%−29%−5%+27%−0%+10%+2%+13%+16%+12%−12%+14%+30%+4%2Q234Q232Q244Q242Q254Q252Q261
Latest2026Q2: 97.4%
Compared with2026Q1: 94.0%
Change+3.6%
1-yr avg change+8.9% per quarter (4 obs)
MomentumRising (slower)
DriverRatio 97.4% in 2026Q2 versus 72.2% in 2025Q4 and 34.8% at the 2023Q3 low.
ERecent news
  • 2026-07-30Amazon raised 2026 capex to $220 billion, citing higher memory costs, after strong Q2 cloud results. link ↗ Indicator then: 2Q26 +3.6%
  • 2026-07-29Meta's operating cash flow dropped sharply in Q2 as it doubled down on AI spending, lifting capex relative to cash from operations. link ↗ Indicator then: 2Q26 +3.6%
  • 2026-07-29Microsoft raised its capital spending plans on demand, sending shares up 8%. link ↗ Indicator then: 2Q26 +3.6%
  • 2026-07-22Alphabet raised its 2026 capex forecast again after a cloud-driven Q2 beat. link ↗ Indicator then: 2Q26 +3.6%

NVIDIA strategic stakes

NVIDIA long-term investments (strategic stakes in labs, neoclouds and AI ecosystem) · Funding · Grade 4
AWhy it is importantCapital & funding + AI chips & ASIC · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + AI chips & ASIC — NVIDIA equity stakes in customers
Why it mattersNVIDIA funding its own customers (labs, neoclouds) supports GPU demand but adds circular-financing risk.
How representativeAbout 15% of AI-infra equity funding: one vendor's stakes in OpenAI, xAI, Anthropic, CoreWeave, Nebius and others; includes fair-value marks.
TimingLeading — Investments precede the customers' GPU purchases
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionNVIDIA's balance-sheet long-term investments (equity stakes in labs, neoclouds and ecosystem companies) at fiscal quarter end, in USD billions.
Higher = NVIDIA is financing more of its own customers' demand; rapid growth signals rising circular funding risk.
Formula
Readingt = Vt
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VS&P Capital IQ long_term_investments; NVDA fiscal quarterUSD bn—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-20
ScopeGlobal · NVIDIA only; includes stakes such as OpenAI, xAI, Anthropic, CoreWeave, Nebius; carrying value includes fair-value marks.
Share of global total: 15% — About 15%: one vendor's stakes versus total private and public AI-infra equity funding.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: vendor financing of demand is a key fragility in the AI funding chain.
Signal / noise3 / 5SNR 3: fair-value marks and one-off large deals move the balance beyond new cash commitments.
Reliability5 / 5Reliability 5: audited 10-Q/10-K balance sheet via S&P Capital IQ.
Scope15%Covers about 15%, so a narrow but high-signal slice.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$20.0bn$40.0bn$60.0bnLevel (USD bn)Change vs prior period (%)1-yr avg +100%+13%+33%+4%+23%+51%−4%+17%+116%+172%+95%+18%2Q234Q232Q244Q242Q254Q252Q261234
Latest2026Q2: $51.2bn
Compared with2026Q1: $43.4bn
Change+18.0%
1-yr avg change+100.0% per quarter (4 obs)
MomentumRising (slower)
DriverSingle series: long-term investments $51.16B in 2026Q2, up from $43.36B in Q1 and $3.80B in 2025Q2.
EWhy it moved

What changed. 2026Q2: $51.2bn, +18.0% vs 2026Q1 (1-yr average +100.0% per quarter).

  • Growth slowed to 18% because the quarter netted a large outflow: inside the non-marketable book (up $5.6bn to $47.9bn), $4.9bn came from upward revaluations, so new cheques only slightly exceeded the stake that left the line.
  • SpaceX, which had absorbed xAI, listed on 12 Jun 2026, moving Nvidia's former xAI stake to marketable holdings; that position was worth about $21bn at end-June, and marketable equity rose $12.5bn to $42.8bn.
  • May-Jul money went to smaller ecosystem bets, not lab-sized rounds: leading Firmus's raise with roughly $500m-plus (Jul 2026) and backing switch-silicon startup Upscale's $190m round (Jun 2026), after about $17bn net added in Feb-Apr.
  • Watch the reported plan to buy up to $10bn of Anthropic's IPO and further lab IPOs: they would land in marketable securities and drain this line, while private-round repricing keeps adding mark-ups.
  • So what: Private plus listed stakes reached about $91bn versus $35bn in January, so Nvidia's customer-funding keeps rising even as this private-only line slows on IPO reclassification.
FRecent news
  • 2026-08-15Nvidia disclosed equity stakes of about $50 billion in SpaceX and Intel, both exclusive chip buyers. link ↗ Indicator then: 2Q26 +18.0%
  • 2026-08-12Nvidia's roughly $70 billion of stakes in OpenAI, Anthropic and other AI firms form the core of its growing long-term investments. link ↗ Indicator then: 2Q26 +18.0%

Open the full deep-dive ↓

Neocloud equity raised

Neocloud / AI-infra common-equity issuance (CRWV, NBIS, IREN, APLD, CIFR, WULF) · Funding · Grade 3
AWhy it is importantCapital & funding + Cloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Cloud & neoclouds — Neocloud common-equity raises
Why it mattersEquity is the first-loss capital under neocloud debt; raises fund GPU purchases and signal how open funding markets are.
How representativeSix listed neoclouds (CoreWeave, Nebius, IREN, Applied Digital, Cipher, TeraWulf), about 40% of neocloud equity funding; excludes private raises.
TimingLeading — Raises precede GPU and capacity purchases
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionCash raised from common-stock issuance by CoreWeave, Nebius, IREN, Applied Digital, Cipher and TeraWulf in the quarter, in USD billions.
Higher = neoclouds are tapping an open equity window to fund GPU and data-center build; a drought signals the window has shut.
Formula
Xt = 80% × Vt
Readingt = Σj=0…3 Xt−j trailing 4 quarters, recomputed every quarter
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VS&P Capital IQ issuance_of_common_stock; missing = 0; APLD May-FYE quarter mapped to calendarUSD bn80%100%
Changet = Readingt ÷ Readingt−4 − 1 this 4-quarter window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 1 observations
UnitUSD bn, trailing 4-quarter sum; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-20
ScopeUS-listed · Six listed neoclouds / AI-hosting companies; excludes private neoclouds and CoreWeave pre-IPO preferred rounds; missing quarters counted as zero.
Share of global total: 40% — About 40% of neocloud equity funding.
Comparison windowAuto-widened: compared as single quarters the reading swung by ±266% per quarter and kept reversing direction (noise cap 18%); trailing 4 quarters vs the 4 before cut that to ±24%
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: equity is the first-loss capital neoclouds need to raise debt against.
Signal / noise3 / 5SNR 3: lumpy, with single at-the-market programs or an IPO dominating a quarter.
Reliability4 / 5Reliability 4: filed cash-flow statements via S&P Capital IQ, but coverage of pre-2024 periods and fiscal-year mapping is imperfect.
Scope40%Covers about 40%, so a partial read of neocloud funding.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.70 → 4, capped at the weaker of SNR / reliability + 1 = 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$5.0bn$10.0bn$15.0bnLevel (USD bn, trailing 4-quarter sum)Change vs the prior 4-quarter window (%)1-yr avg +347%+399%+546%+696%+333%+294%+106%+210%+176%+98%+347%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $13.6bn
Compared with2025Q2: $3.0bn
Change+346.6%
1-yr avg change+346.6% per window (1 obs)
MomentumRising (slower)
DriverS&P Capital IQ issuance_of_common_stock; missing = 0; APLD May-FYE quarter mapped to calendar: $7.0bn (100% of the change)
ERecent news
  • 2026-08-19Nebius priced an upsized $5.0 billion convertible notes offering, with a debt-for-equity swap adding dilution. link ↗ Indicator then: 2Q26 +346.6%

BBB credit spread

US BBB corporate bond option-adjusted spread (ICE BofA, FRED BAMLC0A4CBBB) · Funding · Grade 3
AWhy it is importantCapital & funding · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding — BBB credit cost for AI borrowers
Why it mattersSets the price of debt for marginal investment-grade AI borrowers such as Oracle and lease issuers; wide spreads slow financing.
How representativeUS BBB market overall, about 10% effective coverage; AI issuers are a growing minority and spreads move mainly on macro.
TimingCoincident — Spreads reprice as markets move
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly average option-adjusted spread of the ICE BofA BBB US Corporate Index over Treasuries, in basis points.
Higher = costlier investment-grade debt for BBB-rated AI borrowers such as Oracle and data-center lease issuers.
Formula
Readingt = 10% × Vt
where V = the member's reported value in bp:
TermMember (reported series)Native unitAI shareWeight
VFRED BAMLC0A4CBBB, monthly averagebp10%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 12 observations
Unitbp; change in %
FrequencyMonthly · latest period 2026-08 · recorded 2026-09-01
ScopeUS · Whole BBB US corporate market; not AI-specific.
Share of global total: 10% — About 10%: AI-related issuers are a growing minority of BBB supply.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: sets the price of debt for the marginal AI borrower, but moves mainly on macro.
Signal / noise3 / 5SNR 3: dominated by macro and rate moves, not AI news.
Reliability5 / 5Reliability 5: ICE index via FRED, daily and not revised.
Scope10%Covers about 10%, so a backdrop rather than an AI measure.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
75.0100125150175Level (bp)Change vs prior period (%)1-yr avg +0%−6%−4%−3%+7%−6%+0%−12%−2%+7%+2%−7%+1%Aug-23Nov-23Feb-24May-24Aug-24Nov-24Feb-25May-25Aug-25Nov-25Feb-26May-26Aug-26
Latest2026-08: 98.00 bp
Compared with2026-07: 97.00 bp
Change+1.0%
1-yr avg change+0.1% per month (12 obs)
MomentumFlat
DriverFRED BAMLC0A4CBBB, monthly average: 1.00 bp (100% of the change)
ERecent news
  • 2026-08-07Alphabet's $25 billion bond sale drew over $100 billion in orders to fund AI spending. link ↗ Indicator then: Jul-26 +4.3%
  • 2026-07-07AI-linked bond sales reached $220 billion as credit risk concerns grew. link ↗ Indicator then: Jun-26 −3.1%

High-yield spread

US high-yield corporate bond option-adjusted spread (ICE BofA, FRED BAMLH0A0HYM2) · Funding · Grade 3
AWhy it is importantCapital & funding · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding — High-yield credit cost for neoclouds
Why it mattersSets the cost of debt for the most levered AI builders such as CoreWeave; wide spreads can shut off neocloud funding.
How representativeUS high-yield market overall, about 10% effective coverage; neocloud bonds are a small, fast-growing share and spreads move mainly on macro.
TimingCoincident — Spreads reprice as markets move
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly average option-adjusted spread of the ICE BofA US High Yield Index over Treasuries, in basis points.
Higher = costlier or closed high-yield market for neocloud borrowers such as CoreWeave, TeraWulf and Cipher.
Formula
Readingt = 10% × Vt
where V = the member's reported value in bp:
TermMember (reported series)Native unitAI shareWeight
VFRED BAMLH0A0HYM2, monthly averagebp10%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 12 observations
Unitbp; change in %
FrequencyMonthly · latest period 2026-08 · recorded 2026-09-01
ScopeUS · Whole US high-yield market; not AI-specific.
Share of global total: 10% — About 10%: neocloud and AI-hosting bonds are a small but fast-growing share of HY supply.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: sets the cost of debt for the most levered AI builders, but moves mainly on macro.
Signal / noise3 / 5SNR 3: dominated by macro and energy credit, not AI news.
Reliability5 / 5Reliability 5: ICE index via FRED, daily and not revised.
Scope10%Covers about 10%, so a backdrop rather than an AI measure.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
200300400500Level (bp)Change vs prior period (%)1-yr avg −0%−8%−5%−3%+7%−8%−0%−17%+0%+5%+7%−5%−1%Aug-23Nov-23Feb-24May-24Aug-24Nov-24Feb-25May-25Aug-25Nov-25Feb-26May-26Aug-261
Latest2026-08: 270 bp
Compared with2026-07: 274 bp
Change−1.5%
1-yr avg change−0.4% per month (12 obs)
MomentumFlat
DriverFRED BAMLH0A0HYM2, monthly average: -4.00 bp (100% of the change)
ERecent news

No specific event news found for this period.

US firms paying for AI (Ramp)

Ramp AI Index: share of US businesses with paid AI subscriptions (card + bill-pay) · Penetration · Grade 4
AWhy it is importantEnterprise & consumer use · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionEnterprise & consumer use — US paid AI subscriptions, businesses
Why it mattersPaid subscriptions show businesses converting AI trials into spend, the revenue base that justifies upstream capex.
How representativeRamp customers, about 20% of the global enterprise base (US SMB and mid-market, tech-leaning); card and bill-pay only.
TimingCoincident — Payments occur as firms adopt
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionShare of US businesses on Ramp's card and bill-pay platform that paid for at least one AI tool in the month.
Higher = more US firms paying for AI, measured from actual transactions rather than surveys.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VRamp AI Index%—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Unit%; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-15
ScopeUS · Ramp customers (US SMB and mid-market, tech-leaning); card and bill-pay only, so enterprise contracts paid by invoice elsewhere are missed.
Share of global total: 20% — About 20% of the global enterprise base: US ~26% of world GDP, discounted for sample skew.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Not scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise4 / 5SNR 4.0: smooth monthly climb (35% to 56% over 24 months), direction reverses in only 18% of months.
Reliability4 / 5Reliability 4.0: transaction data, not self-reported; Ramp revises vendor classification and the sample is not representative.
Scope20%Scope score 20: one payments platform's US customer base.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 4 + 0.3 × reliability 4 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
20.0%30.0%40.0%50.0%60.0%Level (%)Change vs prior period (%)1-yr avg +2%+6%+3%−1%+1%+2%+3%+4%+3%−0%+2%+3%+1%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 55.7%
Compared with2026-06: 55.0%
Change+1.4%
1-yr avg change+2.0% per month (11 obs)
MomentumFlat
DriverRamp AI Index: 0.76% (100% of the change)
ERecent news
  • 2026-09-06Ramp's AI Index showed paid AI adoption among US businesses at record levels in 2026, with Anthropic and OpenAI competing for share. link ↗ Indicator then: Jul-26 +1.4%
  • 2026-08-19Ramp launched Router.com to help companies cut rising AI bills. link ↗ Indicator then: Jul-26 +1.4%

UK firms using AI (ONS)

UK businesses currently using AI (ONS BICS) · Penetration · Grade 4
AWhy it is importantEnterprise & consumer use · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionEnterprise & consumer use — UK firm AI use, official survey
Why it mattersOfficial survey of how many firms use AI; a slow-moving, unbiased anchor against vendor-reported adoption figures.
How representativeUK is about 3% of the global enterprise base; small, but a weighted official sample of firms with 10+ employees.
TimingLagging — Survey is quarterly and self-reported
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionShare of UK businesses (10+ staff) that currently use any AI technology, from the ONS fortnightly business survey.
Higher = broader enterprise adoption in the UK.
Formula
Readingt = Vt
where V = the member's reported value in %:
TermMember (reported series)Native unitAI shareWeight
VONS BICS AI Current Usage time series%—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
Unit%; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-17
ScopeUK · ONS BICS weighted estimate for trading UK businesses with 10+ employees; AI question every 6th wave (~quarterly).
Share of global total: 3% — About 3% of the global enterprise base (UK share of world GDP).
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Not scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise4 / 5SNR 4.0: 12 quarterly waves rising from 9% to 29% with one small dip (Jun-24).
Reliability5 / 5Reliability 5.0: official statistics with a stable question since Sep-23.
Scope3%Scope score 3: one mid-sized economy, but the only official quarterly firm-level series outside the US.
Grade4 / 50.4 × importance 3 + 0.3 × SNR 4 + 0.3 × reliability 5 − 0.5 (scope < 10%) = 3.40 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.00%10.0%20.0%30.0%Level (%)Change vs prior period (%)1-yr avg +9%+39%−8%+16%+10%+11%+15%+15%+5%+5%+12%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 28.9%
Compared with2026Q1: 25.9%
Change+11.6%
1-yr avg change+9.0% per quarter (4 obs)
MomentumAccelerating
Driver28.9% vs 25.9% in Q1 (+3.0pt) and 20.5% in 2025Q2 (+8.4pt over a year).
ERecent news
  • 2026-07-22ONS data show UK business AI adoption has tripled since 2023 but barely deepened, with most firms using it in limited ways. link ↗ Indicator then: 2Q26 +11.6%
  • 2026-07-21ONS-based data suggest small UK businesses have not expanded AI use in recent years, leaving growth concentrated in larger firms. link ↗ Indicator then: 2Q26 +11.6%
  • 2026-07-20The ONS published its 2023-to-2026 review of AI use in UK businesses, based on the BICS survey. link ↗ Indicator then: 2Q26 +11.6%

Palantir commercial rev

Palantir commercial segment revenue (AIP-driven enterprise AI platform) · Penetration · Grade 3
AWhy it is importantEnterprise & consumer use + Models & AI apps · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionEnterprise & consumer use + Models & AI apps — Enterprise AI platform revenue
Why it mattersPalantir's commercial revenue shows enterprises paying for deployed AI applications, not just experimenting.
How representativeAbout 5% of estimated enterprise generative-AI application and platform spend; one vendor, includes pre-AI Foundry revenue; US about 75%.
TimingCoincident — Revenue recognised as deployments run
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionQuarterly revenue Palantir earns from commercial (non-government) customers, now driven by its AI platform AIP.
Higher = enterprises paying to run AI in production workflows, not just pilots.
Formula
Readingt = 70% × Vt
where V = the member's reported value in USD mn:
TermMember (reported series)Native unitAI shareWeight
VCIQ Commercial segment revenue; ~70% attributed to AIP-led AI deploymentsUSD mn70%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitUSD mn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-03
ScopeGlobal (US ~75%) · One vendor's commercial segment; includes pre-AI Foundry revenue.
Share of global total: 5% — About 5% of est. enterprise genAI application and platform spend.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Not scored for this signal class (Funding / Penetration use SNR and reliability only)
Signal / noise3 / 5SNR 3.0: smooth audited series, but single-vendor deal timing and US-commercial concentration add noise.
Reliability5 / 5Reliability 5.0: audited 10-Q segment revenue via Capital IQ.
Scope5%Scope score 5: one vendor, a sample of enterprise AI software spend.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 − 0.5 (scope < 10%) = 3.10 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$200mn$400mn$600mn$800mn$1.0bnLevel (USD mn)Change vs prior period (%)1-yr avg +20%−2%+8%+13%+5%+3%+3%+17%+7%+14%+22%+23%+14%+22%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $945mn
Compared with2026Q1: $774mn
Change+22.1%
1-yr avg change+20.4% per quarter (4 obs)
MomentumAccelerating
DriverCIQ Commercial segment revenue; ~70% attributed to AIP-led AI deployments: $171mn (100% of the change)
ERecent news
  • 2026-08-04Palantir's Q2 revenue rose 93% to $1.94 billion, with US commercial revenue up 149%. link ↗ Indicator then: 2Q26 +22.1%
  • 2026-08-03Palantir raised its 2026 revenue forecast on steady demand for AI-powered data analytics. link ↗ Indicator then: 2Q26 +22.1%

TW CCL Makers Revenue

Taiwan copper-clad laminate (CCL) makers monthly revenue: Elite Material 2383 + ITEQ 6213 + Taiwan Union 6274 · Semicon Upstream Supply · Grade 4
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — Copper-clad laminate for AI boards
Why it mattersEvery GPU board and switch is built on low-loss laminate; a shortage caps server and switch output.
How representativeTaiwan trio ~45% of high-end CCL; Elite Material supplies most NVIDIA GB-series and 800G-switch laminate.
TimingLeading — Laminate ships 1-2 months before boards
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Taiwan's three copper-clad laminate makers, weighted by their AI-server and switch share.
Higher = more low-loss laminate going into AI server and switch boards.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Elite MaterialTWD k60%75%
V2ITEQ (6213)TWD k30%10%
V3Taiwan Union TechnologyTWD k40%15%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Elite Material, ITEQ, Taiwan Union monthly revenue x AI share; Doosan, Panasonic and mainland makers excluded.
Share of global total: 45% — ~45% of global high-end CCL value; Elite Material alone holds most AI GPU-board and 800G-switch laminate.
Comparison windowMonthly Taiwan revenue is lumpy (shipment timing, Lunar New Year); 3 months vs the prior 3 months (v6)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: laminate is a single-source bottleneck for GB300 / ASIC boards and 1.6T switches.
Signal / noise3 / 5SNR 3.0: monthly shipments are lumpy and copper pass-through mixes price with volume.
Reliability5 / 5Reliability 5.0: statutory monthly filings.
Scope45%Covers ~45% of high-end CCL.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$500mn$1.0bn$1.5bnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +21%+3%+2%+23%+6%+7%+11%+6%+6%+13%+24%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $1.3bn
Compared with2026-04: $917mn
Change+42.4%
1-yr avg change+21.3% per window (4 obs)
MomentumAccelerating
DriverElite Material: $92mn (78% of the change)
ERecent news
  • 2026-08-31CCL shortages tied to the AI boom are pushing up prices and straining PCB supply in Korea. link ↗ Indicator then: Jul-26 +42.4%

TW ABF Substrate Revenue

Taiwan ABF substrate makers monthly revenue: Unimicron 3037 + Kinsus 3189 + Nan Ya PCB 8046 · Semicon Upstream Supply · Grade 4
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — ABF substrates for GPU / ASIC packages
Why it mattersEach accelerator package needs a large ABF substrate; supply limits package output after CoWoS.
How representativeTaiwan trio ~35-40% of ABF capacity; AI only ~1/3 of their sales, so a partial but timely read.
TimingLeading — Substrates ship before package assembly
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Taiwan's three ABF substrate makers, weighted by their AI GPU / ASIC share.
Higher = more ABF substrates shipped for AI accelerator packages.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1UnimicronTWD k35%55%
V2KinsusTWD k30%15%
V3Nan Ya PCBTWD k30%30%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Unimicron, Kinsus, Nan Ya PCB monthly revenue x AI share; Ibiden, SEMCO, Shinko, AT&S excluded.
Share of global total: 35% — ~35-40% of global ABF substrate capacity; AI GPU / ASIC substrates are the fastest-growing slice.
Comparison windowMonthly Taiwan revenue is lumpy (shipment timing, Lunar New Year); 3 months vs the prior 3 months (v6)
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: substrate supply limits accelerator package output after CoWoS.
Signal / noise3 / 5SNR 3.0: PC and networking substrates still ~2/3 of revenue.
Reliability5 / 5Reliability 5.0: statutory monthly filings.
Scope35%Covers ~35% of ABF capacity.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$200mn$400mn$600mn$800mnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +8%−6%−5%−2%+9%+10%−10%+13%+5%+6%+5%+6%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $756mn
Compared with2026-04: $647mn
Change+16.8%
1-yr avg change+8.3% per window (4 obs)
MomentumAccelerating
DriverUnimicron: $22mn (65% of the change)
ERecent news
  • 2026-08-11TSMC warned ABF substrates will become the next bottleneck in advanced packaging as the CoWoS capacity gap narrows. link ↗ Indicator then: Jul-26 +16.8%
  • 2026-08-10Taiwan's printed circuit board makers posted record monthly sales on AI server demand. link ↗ Indicator then: Jul-26 +16.8%
  • 2026-07-25The ABF substrate supply-demand gap could reach 29% by 2028, and brokers raised target prices for Unimicron, Nan Ya PCB and Kinsus. link ↗ Indicator then: Jun-26 +15.4%

TW MLCC Makers Revenue

Taiwan passive-component makers monthly revenue: Yageo 2327 + Walsin Technology 2492 (MLCC, resistors) · Semicon Upstream Supply · Grade 3
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — MLCC and resistors (Taiwan)
Why it mattersAI servers carry several times the capacitor count of a normal server; tight passives delay boards.
How representativeYageo + Walsin ~18% of MLCC value; AI ~10-15% of sales, so small but it shows the passive-component cycle turning.
TimingCoincident — Passives ship with board builds
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Yageo and Walsin Technology, Taiwan's two MLCC and passive-component makers.
Higher = firmer passive-component demand and pricing.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Yageo (2327)TWD k15%80%
V2Walsin Technology (2492)TWD k10%20%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Yageo (incl. Kemet, Pulse) and Walsin Technology monthly revenue x AI share.
Share of global total: 15% — ~18% of global MLCC value; AI servers are ~10-15% of their sales, so this is a cycle read with an AI tilt.
Comparison windowMonthly Taiwan revenue is lumpy (shipment timing, Lunar New Year); 3 months vs the prior 3 months (v6)
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: AI servers use several times more MLCCs per board, but AI is a minority of demand.
Signal / noise3 / 5SNR 3.0: consumer and auto cycles dominate month to month.
Reliability5 / 5Reliability 5.0: statutory monthly filings.
Scope15%Covers ~18% of MLCC value.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$100mn$150mn$200mn$250mnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +9%+2%+2%+9%−1%−5%+8%−0%+4%+10%+4%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-261
Latest2026-07: $257mn
Compared with2026-04: $217mn
Change+18.6%
1-yr avg change+9.3% per window (4 obs)
MomentumAccelerating
DriverYageo (2327): $8mn (80% of the change)
ERecent news
  • 2026-08-04MLCC suppliers moved to an across-the-board 30% price hike in August. link ↗ Indicator then: Jul-26 +18.6%
  • 2026-07-08Yageo posted record June revenue above NT$15.36 billion on AI-server MLCC demand and price increases. link ↗ Indicator then: Jun-26 +16.8%
  • 2026-07-01Yageo began its broadest capacitor price increase in years on July 1. link ↗ Indicator then: Jun-26 +16.8%

AI PCB & Inputs Revenue

AI-server PCB and its inputs, monthly revenue: Gold Circuit 2368 (server PCB) + Co-Tech 8358 (HVLP copper foil) + Fulltech 1815 (glass-fibre cloth) · Semicon Upstream Supply · Grade 3
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — Server PCB, copper foil, glass cloth
Why it mattersHVLP foil and low-Dk glass cloth are the scarcest CCL inputs; their makers show the bottleneck first.
How representative~20% of the high-end input chain; small firms, but they sit directly on the AI board bottleneck.
TimingLeading — Inputs lead laminate by 1-2 months
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Gold Circuit (AI server PCB), Co-Tech (HVLP copper foil) and Fulltech (glass cloth), weighted by AI share.
Higher = more AI server boards and their copper-foil / glass-cloth inputs.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Gold Circuit ElectronicsTWD k60%65%
V2Co-TechTWD k50%20%
V3Fulltech (1815)TWD k40%15%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Non-USD members are converted at the month-average FX rate before summing.
Flow series: a period counts only when every member has reported (no carry-forward).
UnitUSD mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Gold Circuit, Co-Tech, Fulltech monthly revenue x AI share.
Share of global total: 20% — ~20% of the high-end AI board input chain; Japan's Nittobo T-glass is tracked separately.
Comparison windowMonthly Taiwan revenue is lumpy (shipment timing, Lunar New Year); 3 months vs the prior 3 months (v6)
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: foil and glass cloth are the tightest CCL inputs in 2026.
Signal / noise3 / 5SNR 3.0: small firms, lumpy months.
Reliability5 / 5Reliability 5.0: statutory monthly filings.
Scope20%Covers ~20% of the chain.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.00$200mn$400mn$600mnLevel (USD mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +16%+4%−4%+19%−2%+4%+21%+14%+15%−3%+23%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $583mn
Compared with2026-04: $459mn
Change+27.2%
1-yr avg change+15.5% per window (4 obs)
MomentumAccelerating
DriverGold Circuit Electronics: $47mn (95% of the change)
ERecent news
  • 2026-08-10Taiwan PCB makers posted record monthly sales for July on AI-server demand, lifting Gold Circuit and its material suppliers. link ↗ Indicator then: Jul-26 +27.2%

MLCC Inventory Days

MLCC makers days of inventory (inventory / quarterly COGS x 91): Murata, Samsung Electro-Mechanics, TDK, Taiyo Yuden, Yageo · Semicon Upstream Supply · Grade 4
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — MLCC maker inventory
Why it mattersInventory is the buffer between MLCC demand and price; falling days signal a coming shortage.
How representativeFive makers ~75% of MLCC value; whole-company inventory, so AI is a minority of what it measures.
TimingLeading — Inventory runs down before prices rise
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionDays of inventory at the five largest MLCC makers: inventory divided by quarterly cost of goods sold, times 91.
Lower = tighter MLCC supply; higher = inventory building.
Formula
Readingt = Σi ( weighti × Vi,t ) weights re-scaled to the members present
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Muratadays—40%
V2Samsung Electro-Mechanicsdays—20%
V3TDKdays—15%
V4Taiyo Yudendays—15%
V5Yageodays—10%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
Unitdays; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-13
ScopeGlobal · Murata, Samsung Electro-Mechanics, TDK, Taiyo Yuden, Yageo; whole-company inventory, so batteries (TDK) and other lines are mixed in.
Share of global total: 75% — ~75% of global MLCC value.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: MLCC stock is the buffer before a component shortage shows up in price.
Signal / noise3 / 5SNR 3.0: quarter-end stocking and FX move the ratio.
Reliability4 / 5Reliability 4.0: CIQ reported balance sheets; whole-company, not MLCC-only.
Scope75%Covers ~75% of MLCC value.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.70 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
100120140160180Level (days)Change vs prior period (%)1-yr avg +1%−15%−5%+4%+1%−8%+2%+1%+2%−8%+8%+3%−1%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 143 days
Compared with2026Q1: 145 days
Change−1.4%
1-yr avg change+0.5% per quarter (4 obs)
MomentumFlat
DriverYageo: -0.92 days (46% of the change)
ERecent news
  • 2026-08-18High-end MLCC lead times stretched to 5-10 months, with tightness possibly lasting into 2027, keeping supplier inventories lean. link ↗ Indicator then: 2Q26 −1.4%
  • 2026-07-29Taiyo Yuden raised MLCC prices as AI demand tightened supply. link ↗ Indicator then: 2Q26 −1.4%
  • 2026-07-28Samsung Electro-Mechanics planned a 30% MLCC price hike from August amid the AI supply crunch. link ↗ Indicator then: 2Q26 −1.4%

CCL & Substrate Inv. Days

CCL and substrate makers days of inventory (inventory / quarterly COGS x 91): Elite Material, ITEQ, Taiwan Union, Ibiden, Unimicron · Semicon Upstream Supply · Grade 4
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — Laminate and substrate inventory
Why it mattersShows whether makers are stocking scarce foil and glass cloth ahead of AI board demand.
How representativeCovers ~45% of high-end CCL and ABF value; whole-company inventory including raw materials.
TimingLeading — Input stocking precedes shipments
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionDays of inventory at the Taiwan CCL trio plus Ibiden and Unimicron: inventory divided by quarterly COGS, times 91.
Lower = laminate and substrate selling out of stock; rising with revenue = stocking inputs ahead of demand.
Formula
Readingt = Σi ( weighti × Vi,t ) weights re-scaled to the members present
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Elite Materialdays—35%
V2ITEQdays—10%
V3Taiwan Union Technologydays—15%
V4Ibiden (ABF for NVIDIA)days—20%
V5Unimicrondays—20%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
Unitdays; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-11
ScopeTaiwan and Japan · Elite Material, ITEQ, Taiwan Union, Ibiden, Unimicron; whole-company inventory incl. copper foil and glass cloth.
Share of global total: 40% — ~45% of high-end CCL and ~45% of ABF value.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: shows whether makers are hoarding scarce inputs, which precedes price hikes.
Signal / noise3 / 5SNR 3.0: input-price swings move inventory value.
Reliability4 / 5Reliability 4.0: CIQ reported balance sheets.
Scope40%Covers ~45% of the link.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.70 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
50.060.070.080.0Level (days)Change vs prior period (%)1-yr avg +3%−8%+13%−1%+5%+2%−2%+3%−1%−2%+9%+10%+2%−7%2Q234Q232Q244Q242Q254Q252Q261
Latest2026Q2: 74.67 days
Compared with2026Q1: 80.16 days
Change−6.8%
1-yr avg change+3.5% per quarter (4 obs)
MomentumFalling faster
DriverElite Material 30.0 to 24.1 days since Q4-25; TUC 17.8 to 13.7 in Q2; Ibiden 15.8 to 17.9 and ITEQ 6.7 to 7.4 rose.
EWhy it moved

What changed. 2026Q2: 74.67 days, −6.8% vs 2026Q1 (1-yr average +3.5% per quarter).

  • The weighted inventory days fell about 5.5 days to 74.7, and Elite Material (-4.5) and Taiwan Union (-4.1) supplied roughly three-quarters of the gross member move, partly offset by a +2.1-day build at Ibiden.
  • Elite Material raised CCL prices by up to 25% in March 2026 and Q2 revenue rose about 43% q/q to a record, so cost of sales grew far faster than stock on hand.
  • Taiwan Union's Q2 revenue also rose about 42% q/q on the same price hikes and AI-server material demand, with record quarterly profit, draining inventory days as plants ran near full.
  • Ibiden's days rose even as its April-June quarter beat and it raised full-year guidance on AI substrate demand; a renewed rise across the CCL names would signal capacity catching up with demand.
  • So what: Falling inventory days while CCL monthly revenue kept setting records in July-August point to tight supply, not a demand pause; watch whether new Thai capacity rebuilds stock.
FRecent news
  • 2026-08-31South Korea's CCL exports jumped 42% as the AI infrastructure boom spread across the supply chain. link ↗ Indicator then: 2Q26 −6.8%
  • 2026-08-03Elite Material became the world's largest CCL maker as AI servers reshaped supply, tightening inventory. link ↗ Indicator then: 2Q26 −6.8%

Copper Price

Global copper price (IMF via FRED PCOPPUSDM), monthly average · Semicon Upstream Supply · Grade 3
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — Copper (CCL and cable input)
Why it mattersCopper foil is 30-40% of laminate cost and copper drives cabling and busbar cost in data centres.
How representativeGlobal benchmark price; AI is a small share of copper demand, so it is a cost read, not demand.
TimingCoincident — Spot price passes through within 1-2 months
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly average global copper price (IMF benchmark, USD per metric ton).
Higher = higher cost for copper foil, laminates and power cabling.
Formula
Readingt = Vt
where V = the member's reported value in USD/t:
TermMember (reported series)Native unitAI shareWeight
VFRED PCOPPUSDMUSD/t—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
UnitUSD/t; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-09-05
ScopeGlobal · IMF primary commodity price series via FRED.
Share of global total: 95% — Global benchmark; AI data centres are a small but rising share of copper demand.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance2 / 5Importance 2: a cost input, not an AI demand read.
Signal / noise3 / 5SNR 3.0: macro and China demand drive most moves.
Reliability5 / 5Reliability 5.0: official benchmark.
Scope95%Global price.
Grade3 / 50.4 × importance 2 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.20 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$6,000.00$8,000.00$10,000.00$12,000.00$14,000.00Level (USD/t)Change vs prior period (%)1-yr avg +3%−4%−1%+9%−3%+3%+1%−6%−1%+7%+10%+3%−0%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $13,542.82
Compared with2026-06: $13,552.04
Change−0.1%
1-yr avg change+3.2% per month (11 obs)
MomentumFlat
DriverFRED PCOPPUSDM: −$9.22 (100% of the change)
ERecent news
  • 2026-08-14US copper imports hit a 12-year high, cutting LME stocks 14% and raising delivery premiums. link ↗ Indicator then: Jul-26 −0.1%
  • 2026-08-05Copper set a fresh US record as tariff-driven hoarding met shrinking supply. link ↗ Indicator then: Jul-26 −0.1%

US PPI Bare PCBs

US PPI bare printed circuit board manufacturing (BLS PCU334412334412) · Semicon Upstream Supply · Grade 3
AWhy it is importantMaterials & passives · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMaterials & passives — Bare PCB prices (US)
Why it mattersBoard price is where laminate, foil and glass-cloth cost increases finally reach server makers.
How representativeUS boards are a small share of world output; useful as the only monthly official board price, i.e. a direction read.
TimingLagging — Board prices follow input costs
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionUS producer price index for bare printed circuit boards.
Higher = board makers passing through laminate, copper-foil and glass-cloth cost increases.
Formula
Readingt = Vt
where V = the member's reported value in index:
TermMember (reported series)Native unitAI shareWeight
VBLS PPI series via FREDindex—100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Unitindex; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-15
ScopeUS · US-made bare PCBs (BLS survey).
Share of global total: 10% — ~5-10% of global PCB output; used as a price read, since Asian board prices are not published monthly.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: the only free monthly board price series.
Signal / noise3 / 5SNR 3.0: index moves in steps, often flat for months.
Reliability5 / 5Reliability 5.0: official BLS statistic.
Scope10%US only, ~10% weight.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
100125150175200Level (index)Change vs prior period (%)1-yr avg +4%−0%+1%−0%+0%+0%−0%+0%+0%−0%+14%+0%+22%+1%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-2612
Latest2026-07: 194
Compared with2026-06: 192
Change+1.4%
1-yr avg change+3.7% per month (11 obs)
MomentumFlat
DriverBLS PPI series via FRED: 2.6 (100% of the change)
ERecent news
  • 2026-08-10Taiwan PCB makers posted record monthly sales on AI-server demand. link ↗ Indicator then: Jul-26 +1.4%
  • 2026-07-06Kingboard Laminates issued another price hike of up to 15%, with the AI-driven PCB material rally possibly extending into 2027. link ↗ Indicator then: Jun-26 +22.2%

TW optical parts rev

Taiwan optical-component makers monthly revenue: Browave 3163 + Luxnet 4979 + FOCI 3363 + Alltop 4977 + LandMark 3081 · Downstream HW: Peripherals (power, optics) · Grade 3
AWhy it is importantNetworking & optics · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionNetworking & optics — Optical laser and fiber parts
Why it mattersLaser chips and WDM parts sit one step upstream of the module makers, so their revenue shows component pull before module revenue.
How representativeAbout 5% proxy: five Taiwan suppliers, upstream of Innolight / Eoptolink, which together hold about 40% of the module market.
TimingLeading — Parts ship ahead of finished modules
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of five Taiwan optical-component suppliers (Browave, Luxnet, FOCI, Alltop, LandMark), summed, in NT$ mn.
Higher = more lasers, laser epi wafers and fiber / WDM components shipped for AI optical modules; lower = module makers drawing down inventory.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Browave monthly revenue (FinMind)NT$ mn100%20%
V2Luxnet monthly revenue (FinMind)NT$ mn100%20%
V3FOCI monthly revenue (FinMind)NT$ mn100%20%
V4Alltop monthly revenue (FinMind)NT$ mn100%20%
V5LandMark Optoelectronics monthly revenueNT$ mn100%20%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitNT$ mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Laser epi (LandMark), VCSEL / laser chips (Luxnet), WDM and passive parts (Browave, FOCI), fiber assemblies (Alltop).
Share of global total: 5% — About 5% (proxy): a Taiwan niche, upstream of the module makers in the optics revenue indicator.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: optical parts gate 800G / 1.6T module output.
Signal / noise3 / 5SNR 3: revenue also carries telecom and sensing demand.
Reliability4 / 5Reliability 4: monthly filings via FinMind, timely but unaudited.
Scope5%Covers about 5%, a partial read of component supply.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 − 0.5 (scope < 10%) = 3.20 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.005001,0001,500Level (NT$ mn)Change vs prior period (%)1-yr avg +4%−6%−18%−0%+3%−2%−0%+2%−5%−2%+2%−4%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-2612
Latest2026-07: 1,572 NT$ mn
Compared with2026-06: 1,296 NT$ mn
Change+21.3%
1-yr avg change+4.3% per month (11 obs)
MomentumAccelerating
DriverAlltop monthly revenue (FinMind): 98.90 NT$ mn (36% of the change)
ERecent news
  • 2026-09-01Luxnet is eyeing orders through 2028 and expects data-center-interconnect revenue to double in 2027. link ↗ Indicator then: Jul-26 +21.3%
  • 2026-08-26Luxnet posted July EPS of NT$0.92, with the month's profit reaching 70% of the prior quarter's total. link ↗ Indicator then: Jul-26 +21.3%
  • 2026-08-14NVIDIA's optical partners said CPO mass-production timing is unchanged, with revenue recognition starting next year. link ↗ Indicator then: Jul-26 +21.3%

TW cable & connector rev

Taiwan cable and connector makers monthly revenue: BizLink 3665 + Singatron 3023 + Lotes 3533 + Liang Wei 6290 · Downstream HW: Peripherals (power, optics) · Grade 3
AWhy it is importantNetworking & optics + Servers & ODM · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionNetworking & optics + Servers & ODM — Cables and connectors
Why it mattersEvery GPU rack needs more cabling and connectors; the revenue tracks rack builds one step ahead of server ODM shipments.
How representativeAbout 10% proxy: four Taiwan names; BizLink alone is a top-three supplier of active electrical cables to Nvidia racks.
TimingCoincident — Ships alongside rack assembly
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of four Taiwan interconnect suppliers (BizLink, Singatron, Lotes, Liang Wei), summed, in NT$ mn.
Higher = more server cables, connectors and active electrical cables shipped into AI racks.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1BizLink monthly revenue (FinMind)NT$ mn100%40%
V2Singatron monthly revenueNT$ mn100%20%
V3Lotes monthly revenue (FinMind)NT$ mn100%25%
V4Liang Wei monthly revenueNT$ mn100%15%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitNT$ mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Active electrical cables and cooling couplings (BizLink), server and automotive harnesses (Singatron), CPU sockets and high-speed connectors (Lotes), server cables (Liang Wei).
Share of global total: 10% — About 10% (proxy): four Taiwan names beside US and Japanese interconnect leaders.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: cabling scales with racks shipped but is a small cost line.
Signal / noise3 / 5SNR 3: mixes AI with automotive and industrial demand.
Reliability4 / 5Reliability 4: monthly filings via FinMind.
Scope10%Covers about 10%, a partial read.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
5,00010k15k20kLevel (NT$ mn)Change vs prior period (%)1-yr avg +4%−3%+20%+4%+10%+1%+9%+4%+7%−2%+7%+2%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 17,068 NT$ mn
Compared with2026-06: 15,553 NT$ mn
Change+9.7%
1-yr avg change+3.8% per month (11 obs)
MomentumAccelerating
DriverBizLink monthly revenue (FinMind): 1,112 NT$ mn (73% of the change)
ERecent news

No specific event news found for this period.

TW chassis & rack rev

Taiwan server chassis and rack-system makers monthly revenue: Chenbro 8210 + AIC 3693 · Downstream HW: Peripherals (power, optics) · Grade 2
AWhy it is importantServers & ODM · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionServers & ODM — Server chassis and racks
Why it mattersChassis and rack shipments are an early physical read on GPU-server builds before ODM revenue is booked.
How representativeAbout 5% proxy: two Taiwan names, small beside the ODMs, but chassis orders lead assembly by weeks.
TimingLeading — Enclosures are ordered before servers are assembled
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Chenbro and AIC, two Taiwan server-chassis specialists, summed, in NT$ mn.
Higher = more AI server chassis and storage enclosures shipped to ODMs and cloud customers.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Chenbro monthly revenue (FinMind)NT$ mn100%60%
V2AIC monthly revenue (FinMind)NT$ mn100%40%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitNT$ mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Chenbro: server and GPU-server chassis, liquid-cooling-ready enclosures; AIC: storage and GPU servers, chassis.
Share of global total: 5% — About 5% (proxy): two small names.
Comparison windowAuto-widened: compared as single months the reading swung by ±21% per month and kept reversing direction (noise cap 12%); trailing 3 months vs the 3 before cut that to ±7%
CGradingGrade 2 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: enclosures are a small cost line but ship in step with server builds.
Signal / noise3 / 5SNR 3: customer concentration and project timing add noise.
Reliability4 / 5Reliability 4: monthly filings via FinMind.
Scope5%Covers about 5%, a partial read.
Grade2 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 4 − 0.5 (scope < 10%) = 2.80 → 2
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
2,5005,0007,50010k12kLevel (NT$ mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +14%+17%−36%+52%−2%−5%+20%−6%+11%+17%−7%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-261
Latest2026-07: 11,266 NT$ mn
Compared with2026-04: 8,316 NT$ mn
Change+35.5%
1-yr avg change+14.1% per window (4 obs)
MomentumTurned up
DriverAIC monthly revenue (FinMind): 507 NT$ mn (56% of the change)
ERecent news
  • 2026-08-08Chenbro's Q2 revenue rose and July shipments hit a record on AI-server chassis demand. link ↗ Indicator then: Jul-26 +35.5%
  • 2026-07-06AIC's June revenue surged 75% to a record NT$1.16 billion. link ↗ Indicator then: Jun-26 +19.6%

TW server-interface chip rev

Taiwan server-interface chip makers monthly revenue: ASPEED 5274 + Parade 4966 + ASMedia 5269 · Downstream HW: Peripherals (power, optics) · Grade 3
AWhy it is importantServers & ODM + Networking & optics · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionServers & ODM + Networking & optics — BMC and interface chips
Why it mattersBMC chips go into every server and retimers into every GPU board, so revenue gives a unit-level read ahead of ODM sales.
How representativeAbout 15% proxy: ASPEED has a dominant BMC share; Parade and ASMedia add interface chips; mix of AI and non-AI demand.
TimingLeading — Chips ship a quarter ahead of finished servers
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of ASPEED, Parade and ASMedia, summed, in NT$ mn.
Higher = more server BMC chips and high-speed interface silicon shipped, an early read on server builds.
Formula
Xt = Σi ( AI sharei × Vi,t )
Readingt = Σj=0…2 Xt−j trailing 3 months, recomputed every month
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1ASPEED monthly revenue (FinMind)NT$ mn100%30%
V2Parade monthly revenue (FinMind)NT$ mn100%40%
V3ASMedia monthly revenue (FinMind)NT$ mn100%30%
Changet = Readingt ÷ Readingt−3 − 1 this 3-month window vs the previous, non-overlapping one
1-yr average = mean of Change over the past 12 months (non-overlapping windows only) 4 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitNT$ mn, trailing 3-month sum; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · BMC controllers (ASPEED), PCIe / DisplayPort retimers (Parade), USB and PCIe bridges (ASMedia).
Share of global total: 15% — About 15% (proxy) of server-interface silicon value.
Comparison windowAuto-widened: compared as single months the reading swung by ±13% per month and kept reversing direction (noise cap 12%); trailing 3 months vs the 3 before cut that to ±2%
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: every server needs a BMC, so ASPEED is a unit-shipment gauge.
Signal / noise3 / 5SNR 3: Parade and ASMedia also depend on PCs and displays.
Reliability4 / 5Reliability 4: monthly filings via FinMind.
Scope15%Covers about 15%, a partial read.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 4 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
4,0006,0008,00010k12kLevel (NT$ mn, trailing 3-month sum)Change vs the prior 3-month window (%)1-yr avg +2%+16%+7%−4%+20%+4%+3%+5%+12%+3%+1%+2%+4%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 10,997 NT$ mn
Compared with2026-04: 10,598 NT$ mn
Change+3.8%
1-yr avg change+2.4% per window (4 obs)
MomentumAccelerating
DriverASPEED monthly revenue (FinMind): 245 NT$ mn (159% of the change)
ERecent news
  • 2026-09-04Aspeed will raise prices by double digits in Q4, and next year's order backlog already exceeds this year's revenue. link ↗ Indicator then: Jul-26 +3.8%
  • 2026-08-05Parade's retimer line reached 15% of Q2 revenue, though OSAT price hikes cut gross margin to 40.2%. link ↗ Indicator then: Jul-26 +3.8%
  • 2026-07-30Aspeed expects AI-server demand to drive growth through 2027. link ↗ Indicator then: Jun-26 +1.9%

TW memory maker rev

Taiwan DRAM and flash makers monthly revenue: Nanya 2408 + Winbond 2344 + Macronix 2337 · Downstream HW: Semi & ODM · Grade 3
AWhy it is importantMemory & storage · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionMemory & storage — Commodity DRAM and flash makers
Why it mattersTaiwan memory makers sell at spot-linked prices, so monthly revenue is a fast read on how tight DRAM and NOR are.
How representativeAbout 5% proxy of global memory revenue; small but their pricing is spot-linked and reported monthly, unlike the big three.
TimingLeading — Spot-linked pricing moves before quarterly contract resets
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly revenue of Nanya, Winbond and Macronix, summed, in NT$ mn, as a read on commodity memory pricing.
Higher = memory contract prices and volumes rising; lower = the shortage easing or buyers drawing down inventory.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1Nanya monthly revenue (FinMind)NT$ mn100%50%
V2Winbond monthly revenue (FinMind)NT$ mn100%30%
V3Macronix monthly revenue (FinMind)NT$ mn100%20%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Flow series: a period counts only when every member has reported (no carry-forward).
UnitNT$ mn; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-10
ScopeTaiwan-listed · Nanya (DDR4 / DDR5 DRAM), Winbond (specialty DRAM and NOR), Macronix (NOR and NAND).
Share of global total: 5% — About 5% (proxy) of global memory revenue.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: memory is the tightest AI input after leading-edge logic.
Signal / noise3 / 5SNR 3: part of the move is price, part inventory timing and non-AI demand.
Reliability4 / 5Reliability 4: monthly filings via FinMind.
Scope5%Covers about 5%, a partial read.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 4 − 0.5 (scope < 10%) = 3.20 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.0020k40k60k80kLevel (NT$ mn)Change vs prior period (%)1-yr avg +16%−6%−7%−1%−5%−5%−16%−2%−2%+12%+7%+23%+37%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-261234
Latest2026-07: 78,366 NT$ mn
Compared with2026-06: 56,941 NT$ mn
Change+37.6%
1-yr avg change+15.9% per month (11 obs)
MomentumAccelerating
DriverNanya monthly revenue (FinMind): 14,479 NT$ mn (68% of the change)
ERecent news
  • 2026-08-06Nanya unveiled a US$10.7 billion Fab 5A plan through 2029 targeting EUV 10nm-class DRAM. link ↗ Indicator then: Jul-26 +37.6%
  • 2026-07-10Nanya's Q2 gross margin hit 79.5% on surging DRAM prices, and it plans to quadruple 2027 capex to $6.2 billion. link ↗ Indicator then: Jun-26 +5.6%
  • 2026-07-09Macronix and Winbond posted record June revenue as memory prices stayed firm. link ↗ Indicator then: Jun-26 +5.6%

US semi output (IP)

US industrial production: semiconductors and other electronic components (Federal Reserve G.17, IPG3344S) · Downstream HW: Semi & ODM · Grade 3
AWhy it is importantFoundry & packaging · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionFoundry & packaging — US chip and component output
Why it mattersVolume of US semiconductor production shows whether supply is expanding as AI demand pulls.
How representativeAbout 15% proxy: US fabs and component plants; Taiwan and Korea are not covered.
TimingCoincident — Output is current production
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionFederal Reserve industrial production index for semiconductors and other electronic components (2017=100).
Higher = more US chips and electronic components produced; a supply-side read.
Formula
Readingt = 15% × Vt
where V = the member's reported value in index:
TermMember (reported series)Native unitAI shareWeight
VFRED IPG3344S, monthlyindex15%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Unitindex; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-17
ScopeUS · NAICS 3344 domestic output, volume-based.
Share of global total: 15% — About 15% (proxy) of global semiconductor production.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: supply-side volume check on the chip industry.
Signal / noise3 / 5SNR 3: includes non-AI components and is revised.
Reliability5 / 5Reliability 5: official Federal Reserve statistic.
Scope15%Covers about 15%, a US-only read.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
100125150175200Level (index)Change vs prior period (%)1-yr avg +1%+0%+4%−0%+2%+5%+2%+5%+2%+4%+2%+1%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 190
Compared with2026-06: 188
Change+1.5%
1-yr avg change+1.1% per month (11 obs)
MomentumFlat
DriverFRED IPG3344S, monthly: 2.7 (100% of the change)
ERecent news

No specific event news found for this period.

US PPI semiconductors

US PPI: semiconductors and related device manufacturing (BLS PCU334413334413) · Supply-Demand · Grade 3
AWhy it is importantFoundry & packaging + AI chips & ASIC · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionFoundry & packaging + AI chips & ASIC — Chip producer prices
Why it mattersRising producer prices show chip supply is tight relative to AI-led demand.
How representativeAbout 15% proxy: US producers only; leading-edge Asian foundry pricing is not captured.
TimingCoincident — Prices reflect current supply tightness
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionBLS producer price index for semiconductors and related device manufacturing.
Higher = chip producers raising prices; lower = price erosion.
Formula
Readingt = 15% × Vt
where V = the member's reported value in index:
TermMember (reported series)Native unitAI shareWeight
VBLS PPI series, monthlyindex15%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 11 observations
Unitindex; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-14
ScopeUS · Prices received by US semiconductor producers.
Share of global total: 15% — About 15% (proxy) of global semiconductor value.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: price power of chip producers.
Signal / noise3 / 5SNR 3: mix and quality adjustments blur AI pricing.
Reliability5 / 5Reliability 5: official BLS statistic.
Scope15%Covers about 15%.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
26.028.030.032.034.0Level (index)Change vs prior period (%)1-yr avg −0%−0%−0%+0%+1%−3%+1%−1%−0%−0%+1%−0%+2%−3%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: 29.1
Compared with2026-06: 29.9
Change−2.7%
1-yr avg change−0.1% per month (11 obs)
MomentumFlat
DriverBLS PPI series, monthly: -0.8 (100% of the change)
ERecent news
  • 2026-08-11Rising memory and chip costs are expected to persist, keeping semiconductor price pressure elevated despite softer monthly producer-price readings. link ↗ Indicator then: Jul-26 −2.7%

US electricity price

US average electricity price per kWh (BLS, APU000072610) · Supply-Demand · Grade 3
AWhy it is importantPower, grid & cooling · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionPower, grid & cooling — Retail electricity price
Why it mattersPower price is the market signal for grid scarcity that limits how fast data centers can be energized.
How representativeAbout 10%: a consumer price backdrop, not data-center tariffs.
TimingLagging — Retail prices adjust after wholesale and capacity prices
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionBLS average retail price of electricity per kWh, US city average.
Higher = costlier power, a sign of grid tightness as data centers add load.
Formula
Readingt = 10% × Vt
where V = the member's reported value in USD/kWh:
TermMember (reported series)Native unitAI shareWeight
VBLS average price data, monthlyUSD/kWh10%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 10 observations
UnitUSD/kWh; change in %
FrequencyMonthly · latest period 2026-07 · recorded 2026-08-25
ScopeUS · Residential retail price, all utilities.
Share of global total: 10% — About 10%: a backdrop for the power-constrained link of the chain.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: power cost and availability bind DC build-out.
Signal / noise2 / 5SNR 2: dominated by fuel prices, weather and regulation.
Reliability5 / 5Reliability 5: official BLS statistic.
Scope10%Covers about 10%.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 2 + 0.3 × reliability 5 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$0.14$0.16$0.18$0.20Level (USD/kWh)Change vs prior period (%)1-yr avg +0%−1%−1%+2%−1%+0%−1%+2%+0%−1%+2%+2%−1%Jul-23Oct-23Jan-24Apr-24Jul-24Oct-24Jan-25Apr-25Jul-25Oct-25Jan-26Apr-26Jul-26
Latest2026-07: $0.20
Compared with2026-06: $0.20
Change−0.5%
1-yr avg change+0.4% per month (10 obs)
MomentumFlat
DriverBLS average price data, monthly: −$0.00 (100% of the change)
ERecent news
  • 2026-08-19Colorado regulators approved an Xcel Energy rate increase adding about $5 a month to residential electric bills from Aug. 29. link ↗ Indicator then: Jul-26 −0.5%
  • 2026-07-20PJM's market monitor found data centers drove $6.3B of capacity auction costs, feeding higher US power bills. link ↗ Indicator then: Jun-26 +1.0%
  • 2026-07-14PJM's capacity auction cleared 138,318 MW at the price cap again, with data-center load pushing up grid power costs. link ↗ Indicator then: Jun-26 +1.0%

US IT equipment investment

US private fixed investment in information-processing equipment, SAAR (BEA, FRED Y033RC1Q027SBEA) · Funding · Grade 4
AWhy it is importantCapital & funding + Cloud & neoclouds · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Cloud & neoclouds — National-accounts IT capex
Why it mattersShows how much of AI spending is real equipment investment in US GDP, not announced plans.
How representativeAbout 30% proxy of global IT hardware investment; US only.
TimingCoincident — Booked when equipment is delivered
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionBEA private fixed investment in information-processing equipment, seasonally adjusted at annual rates, in USD bn.
Higher = more US capital spending on computers, servers and networking hardware.
Formula
Readingt = 30% × Vt
where V = the member's reported value in USD bn:
TermMember (reported series)Native unitAI shareWeight
VFRED Y033RC1Q027SBEA, SAARUSD bn30%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous quarter
1-yr average = mean of Change over the past 12 months 4 observations
UnitUSD bn; change in %
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-07-30
ScopeUS · Computers, peripherals, communications equipment, medical and other information-processing equipment.
Share of global total: 30% — About 30% (proxy) of global IT hardware investment.
CGradingGrade 4 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: the macro-accounts confirmation of hyperscaler capex.
Signal / noise3 / 5SNR 3: includes non-AI IT spend.
Reliability5 / 5Reliability 5: BEA national accounts, revised.
Scope30%Covers about 30%.
Grade4 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 5 = 4.00 → 4
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
$1.20tn$1.40tn$1.60tn$1.80tn$2.00tnLevel (USD bn)Change vs prior period (%)1-yr avg +4%+0%+1%+1%+2%+3%−1%+5%+3%+4%+3%+5%+5%2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: $1.92tn
Compared with2026Q1: $1.84tn
Change+4.7%
1-yr avg change+3.9% per quarter (4 obs)
MomentumRising (slower)
DriverFRED Y033RC1Q027SBEA, SAAR: $85.7bn (100% of the change)
ERecent news
  • 2026-08-02Amazon raised its 2026 AI capex to $220B and said capacity will not meet demand through 2027. link ↗ Indicator then: 2Q26 +4.7%
  • 2026-07-30US second-quarter GDP growth slowed to 1.5% in the first estimate, with AI-related equipment investment offsetting weakness elsewhere. link ↗ Indicator then: 2Q26 +4.7%

LLM SDK npm downloads

npm weekly downloads of the OpenAI and Anthropic JavaScript SDKs · Penetration · Grade 3
AWhy it is importantModels & AI apps + Enterprise & consumer use · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps + Enterprise & consumer use — Developer SDK adoption
Why it mattersDevelopers install the SDK before tokens flow, so downloads lead production usage of the model APIs.
How representativeAbout 20% proxy: JavaScript SDKs of two leading labs.
TimingLeading — Integration precedes token volume
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionWeekly npm downloads of the openai and @anthropic-ai/sdk packages, summed.
Higher = more developers and pipelines integrating frontier model APIs.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1openai npm packagedownloads/wk100%50%
V2@anthropic-ai/sdk npm packagedownloads/wk100%50%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous week
1-yr average = mean of Change over the past 12 months 52 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
Unitdownloads/wk; change in %
FrequencyWeekly · latest period 2026-08-30 · recorded 2026-09-01
ScopeGlobal · JavaScript SDK installs of OpenAI and Anthropic.
Share of global total: 20% — About 20% (proxy) of developer API usage.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance4 / 5Importance 4: developer integration precedes production token volume.
Signal / noise3 / 5SNR 3: CI traffic and new-release spikes add noise.
Reliability3 / 5Reliability 3: public registry counts, no bot filtering.
Scope20%Covers about 20%.
Grade3 / 50.4 × importance 4 + 0.3 × SNR 3 + 0.3 × reliability 3 = 3.40 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.0025.0mn50.0mn75.0mnLevel (downloads/wk)Change vs prior period (%)1-yr avg +5%−2%−10%−43%+6%+2%+0%+1%+17%−45%+64%+9%−0%−7%+7%+7%−37%+65%+18%+9%+5%17 Sep24 Dec31 Mar07 Jul13 Oct19 Jan27 Apr03 Aug09 Nov15 Feb24 May30 Aug
Latest2026-08-30: 78,428,275 downloads/wk
Compared with2026-08-23: 68,420,507 downloads/wk
Change+14.6% · 4-wk vs prior 4-wk +17.9%
1-yr avg change+5.0% per week (52 obs)
MomentumAccelerating
Driveropenai npm package: 5,229,299 downloads/wk (52% of the change)
ERecent news

No specific event news found for this period.

AI framework npm downloads

npm weekly downloads of AI application frameworks: LangChain and the Vercel AI SDK · Penetration · Grade 3
AWhy it is importantModels & AI apps + Enterprise & consumer use · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionModels & AI apps + Enterprise & consumer use — AI app-building frameworks
Why it mattersFramework installs show how many teams are building products on top of model APIs.
How representativeAbout 15% proxy: two JavaScript frameworks.
TimingLeading — Building precedes deployment and usage
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionWeekly npm downloads of langchain and the Vercel AI SDK (ai), summed.
Higher = more teams building LLM applications and agents in JavaScript.
Formula
Readingt = Σi ( AI sharei × Vi,t )
where V = the member's reported value in its native unit, and i runs over the members below:
TermMember (reported series)Native unitAI shareWeight
V1langchain npm packagedownloads/wk100%15%
V2aidownloads/wk100%85%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous week
1-yr average = mean of Change over the past 12 months 52 observations
A member that has not reported yet re-uses its last value for up to one period (flagged in the hover); a period counts only with ≥80% of the weight present.
Unitdownloads/wk; change in %
FrequencyWeekly · latest period 2026-08-30 · recorded 2026-09-01
ScopeGlobal · Two application frameworks, JavaScript.
Share of global total: 15% — About 15% (proxy) of AI-app framework usage.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: application-layer build activity.
Signal / noise3 / 5SNR 3: CI traffic and release cadence add noise.
Reliability3 / 5Reliability 3: public registry counts, no bot filtering.
Scope15%Covers about 15%.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 3 = 3.00 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.0010.0mn20.0mn30.0mnLevel (downloads/wk)Change vs prior period (%)1-yr avg +5%−3%+5%−0%+0%+20%+26%−58%+82%−2%+1%−8%+8%+5%+91%+8%+4%+4%17 Sep24 Dec31 Mar07 Jul13 Oct19 Jan27 Apr03 Aug09 Nov15 Feb24 May30 Aug1
Latest2026-08-30: 26,686,463 downloads/wk
Compared with2026-08-23: 25,287,117 downloads/wk
Change+5.5% · 4-wk vs prior 4-wk +16.6%
1-yr avg change+4.8% per week (52 obs)
MomentumAccelerating
Driverai: 1,247,953 downloads/wk (89% of the change)
ERecent news
  • 2026-07-13Oracle added LangChain ecosystem support for memory, persistence and Deep Agents on Oracle AI Database, extending enterprise reach for LangChain. link ↗ Indicator then: 12 Jul +17.4%
  • 2026-07-08Globant and Vercel formed a strategic alliance to move enterprises from agentic AI pilots to production, expanding Vercel AI SDK adoption. link ↗ Indicator then: 05 Jul −3.9%

Bank C&I lending standards

Fed SLOOS: net % of banks tightening standards on C&I loans to large and middle-market firms (FRED DRTSCILM) · Funding · Grade 3
AWhy it is importantCapital & funding · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding — Bank lending standards for large firms
Why it mattersBank credit lines and term loans fund data-centre developers, neoclouds and suppliers alongside bonds.
How representativeAll US bank C&I lending to large and mid-sized firms; AI builders are roughly 10% in effect, so it reads lender mood rather than AI volume.
TimingLeading — Standards tighten 2-3 quarters before loan growth slows
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionShare of US banks tightening minus easing their standards for commercial and industrial loans to large and middle-market firms (Fed SLOOS).
Higher = banks more selective about corporate lending, including to AI builders and their suppliers.
Formula
Readingt = 10% × Vt
where V = the member's reported value in net % tightening:
TermMember (reported series)Native unitAI shareWeight
VFRED DRTSCILMnet % tightening10%100%
Changet = Readingt − Readingt−1 percentage points: the level is itself a growth rate
1-yr average = mean of Change over the past 12 months 4 observations
Unitnet % tightening; change in percentage points
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-10
ScopeUS · All US bank C&I lending to large and mid-sized firms; not AI-specific.
Share of global total: 10% — About 10%: AI data-centre developers, neoclouds and suppliers are a small but growing share of large-firm bank credit.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: bank credit sets how far the most levered AI builders can expand.
Signal / noise2 / 5SNR 2: driven mainly by the macro and credit cycle, not AI news.
Reliability5 / 5Reliability 5: Federal Reserve survey, quarterly, not revised.
Scope10%Covers about 10%, so a backdrop for AI financing rather than an AI measure.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 2 + 0.3 × reliability 5 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
0.0020.040.060.0Level (net % tightening)Change vs prior period (pp)1-yr avg −2pp−17pp−19pp+1pp−8pp−8pp+6pp+12pp−9pp−3pp−1pp+3pp−8pp2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: 0.00 net % tightening
Compared with2026Q1: 8.10 net % tightening
Change−8.1pp
1-yr avg change−2.4pp per quarter (4 obs)
MomentumFalling faster
DriverFRED DRTSCILM: -8.10 net % tightening (100% of the change)
ERecent news

No specific event news found for this period.

Bank construction-loan standards

Fed SLOOS: net % of banks tightening standards on construction and land development loans (FRED SUBLPDRCSC) · Funding · Grade 3
AWhy it is importantCapital & funding + Data centres & colo · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding + Data centres & colo — Bank construction-loan standards
Why it mattersConstruction loans carry data-centre shells until leases are signed and the project is refinanced.
How representativeAll US bank construction and land loans; data centres are a minority, about 10% in effect.
TimingLeading — Tighter construction credit delays starts 2-4 quarters later
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionShare of US banks tightening minus easing their standards for construction and land development loans (Fed SLOOS).
Higher = banks pulling back from construction loans, the book that funds data-centre shells before long-term financing.
Formula
Readingt = 10% × Vt
where V = the member's reported value in net % tightening:
TermMember (reported series)Native unitAI shareWeight
VFRED SUBLPDRCSCnet % tightening10%100%
Changet = Readingt − Readingt−1 percentage points: the level is itself a growth rate
1-yr average = mean of Change over the past 12 months 4 observations
Unitnet % tightening; change in percentage points
FrequencyQuarterly · latest period 2026Q2 · recorded 2026-08-10
ScopeUS · US bank construction and land development lending; data centres are a minority of it.
Share of global total: 10% — About 10%: data-centre construction is a fast-growing but minor slice of US construction lending.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: construction loans bridge data-centre builds until leases are signed and refinanced.
Signal / noise2 / 5SNR 2: dominated by housing and office construction.
Reliability5 / 5Reliability 5: Federal Reserve survey, quarterly, not revised.
Scope10%Covers about 10%, so a backdrop for data-centre build finance.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 2 + 0.3 × reliability 5 = 3.30 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
-20.00.0020.040.060.080.0Level (net % tightening)Change vs prior period (pp)1-yr avg −3pp−2pp−7pp−25pp−15pp−1pp−9pp−5pp+2pp−1pp−3pp−5pp+3pp−9pp2Q234Q232Q244Q242Q254Q252Q26
Latest2026Q2: -3.70 net % tightening
Compared with2026Q1: 4.90 net % tightening
Change−8.6pp
1-yr avg change−3.4pp per quarter (4 obs)
MomentumTurned down
DriverFRED SUBLPDRCSC: -8.60 net % tightening (100% of the change)
ERecent news

No specific event news found for this period.

CCC spread

US CCC-and-lower corporate bond option-adjusted spread (ICE BofA, FRED BAMLH0A3HYC) · Funding · Grade 3
AWhy it is importantCapital & funding · where it sits on the AI supply chain and how much of that link it covers
Upstream supplySiliconSystemsSystemsInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials &passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry &packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking &opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid &coolingconstruction, leases, utility loadData centres &colohyperscaler capex, GPU clouds, backlogCloud &neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
Upstream supplySiliconSiliconSystemsSystemsInfrastructureInfrastructureDemandSi wafers, CCL, copper foil, glass fibre, MLCC, ABF substratesMaterials & passiveslitho, etch, deposition, test, packaging tools, sub-systemsSemi equipment &partsTSMC N3/N2, CoWoS, OSATFoundry & packagingHBM, DRAM, NAND, HDDMemory & storageGPUs, custom ASICs, design servicesAI chips & ASICswitches, optical modules, cables, retimersNetworking & opticsAI servers, racks, BMC, railsServers & ODMtransformers, gensets, PSUs, liquid coolingPower, grid & coolingconstruction, leases, utility loadData centres & colohyperscaler capex, GPU clouds, backlogCloud & neocloudslabs, tokens, API revenueModels & AI appsfirm adoption surveys, paid seatsEnterprise &consumer useCapital & funding — funds every link (bonds, VC, equity raises, credit spreads)
PositionCapital & funding — Cost of credit for the weakest borrowers
Why it mattersThe most levered AI builders refinance in this tier; widening shuts them out first.
How representativeUS CCC-and-lower market overall, about 10% effective AI coverage; neocloud and project debt is a small, rising share.
TimingLeading — CCC spreads widen before BBB / HY when lenders turn selective
BDefinition & Formuladefinition, formula, unit, frequency, scope
DefinitionMonthly average option-adjusted spread of the ICE BofA US CCC & Lower index over Treasuries, in basis points.
Higher = lenders demanding more from the weakest borrowers, where stretched AI builders price first.
Formula
Readingt = 10% × Vt
where V = the member's reported value in bp:
TermMember (reported series)Native unitAI shareWeight
VFRED BAMLH0A3HYC, monthly averagebp10%100%
Changet = Readingt ÷ Readingt−1 − 1 vs the previous month
1-yr average = mean of Change over the past 12 months 12 observations
Unitbp; change in %
FrequencyMonthly · latest period 2026-08 · recorded 2026-09-01
ScopeUS · Riskiest tier of the US high-yield market; not AI-specific.
Share of global total: 10% — About 10%: neocloud, AI-hosting miner and project-SPV debt is a small but rising share of low-rated issuance.
CGradingGrade 3 / 5 — importance, signal / noise, reliability, scope
ComponentScoreWhy
Importance3 / 5Importance 3: sets whether the most levered AI builders can refinance.
Signal / noise3 / 5SNR 3: moves on macro, but reacts first when lenders turn selective.
Reliability5 / 5Reliability 5: ICE index via FRED, daily and not revised.
Scope10%Covers about 10%, so a backdrop rather than an AI measure.
Grade3 / 50.4 × importance 3 + 0.3 × SNR 3 + 0.3 × reliability 5 = 3.60 → 3
DLine charts and numbers
Past 3 years — level (top) and change (bottom)
6008001,000Level (bp)Change vs prior period (%)1-yr avg +2%−1%+2%+3%−7%+1%−12%−4%+8%+5%−1%+4%Aug-23Nov-23Feb-24May-24Aug-24Nov-24Feb-25May-25Aug-25Nov-25Feb-26May-26Aug-26
Latest2026-08: 1,026 bp
Compared with2026-07: 983 bp
Change+4.4%
1-yr avg change+2.0% per month (12 obs)
MomentumAccelerating
DriverFRED BAMLH0A3HYC, monthly average: 43.00 bp (100% of the change)
ERecent news

No specific event news found for this period.

≤ −10% · Penetration (weekly view)

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≤ −10% · Supply-Demand (weekly view)

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≤ −10% · Semi & ODM (weekly view)

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≤ −10% · Peripherals (weekly view)

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≤ −10% · Data Center (weekly view)

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≤ −10% · Semicon Upstream (weekly view)

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≤ −10% · Funding (weekly view)

IndicatorClassChangeGrade
AI-Infra Debt IssuanceFunding−18.9%G3

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≤ −10% · All classes (weekly view)

IndicatorClassChangeGrade
AI-Infra Debt IssuanceFunding−18.9%G3

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−10% to −3% · Penetration (weekly view)

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−10% to −3% · Supply-Demand (weekly view)

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−10% to −3% · Semi & ODM (weekly view)

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−10% to −3% · Peripherals (weekly view)

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−10% to −3% · Data Center (weekly view)

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−10% to −3% · Semicon Upstream (weekly view)

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−10% to −3% · Funding (weekly view)

IndicatorClassChangeGrade
AI Hyperscaler Bond IssuanceFunding−6.5%G3

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−10% to −3% · All classes (weekly view)

IndicatorClassChangeGrade
AI Hyperscaler Bond IssuanceFunding−6.5%G3

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Flat (±3%) · Penetration (weekly view)

IndicatorClassChangeGrade

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Flat (±3%) · Supply-Demand (weekly view)

IndicatorClassChangeGrade
DRAM Contract GuidanceSupply-Demand+0.0ppG4
N. America DC VacancySupply-Demand+0.0%G4

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Flat (±3%) · Semi & ODM (weekly view)

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Flat (±3%) · Peripherals (weekly view)

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Flat (±3%) · Data Center (weekly view)

IndicatorClassChangeGrade
US hosting jobs (BLS)Data Center−1.7%G2

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Flat (±3%) · Semicon Upstream (weekly view)

IndicatorClassChangeGrade
Copper PriceSemicon Upstream−0.1%G3
US fab constructionSemicon Upstream−2.1%G3

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Flat (±3%) · Funding (weekly view)

IndicatorClassChangeGrade
BBB credit spreadFunding+1.0%G3
High-yield spreadFunding−1.5%G3

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Flat (±3%) · All classes (weekly view)

IndicatorClassChangeGrade
BBB credit spreadFunding+1.0%G3
DRAM Contract GuidanceSupply-Demand+0.0ppG4
N. America DC VacancySupply-Demand+0.0%G4
Copper PriceSemicon Upstream−0.1%G3
High-yield spreadFunding−1.5%G3
US hosting jobs (BLS)Data Center−1.7%G2
US fab constructionSemicon Upstream−2.1%G3

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+3% to +20% · Penetration (weekly view)

IndicatorClassChangeGrade
LLM SDK npm downloadsPenetration+14.6%G3
AI framework npm downloadsPenetration+5.5%G3

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+3% to +20% · Supply-Demand (weekly view)

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+3% to +20% · Semi & ODM (weekly view)

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US Server ImportsSemi & ODM+18.4%G4

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+3% to +20% · Peripherals (weekly view)

IndicatorClassChangeGrade
US Transformer ImportsPeripherals+11.5%G4

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+3% to +20% · Data Center (weekly view)

IndicatorClassChangeGrade
US DC ConstructionData Center+6.2%G4

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+3% to +20% · Semicon Upstream (weekly view)

IndicatorClassChangeGrade
Global Equipment BillingsSemicon Upstream+10.9%G4

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+3% to +20% · Funding (weekly view)

IndicatorClassChangeGrade
Neocloud Equity BasketFunding+11.4%G4
CCC spreadFunding+4.4%G3

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+3% to +20% · All classes (weekly view)

IndicatorClassChangeGrade
US Server ImportsSemi & ODM+18.4%G4
LLM SDK npm downloadsPenetration+14.6%G3
US Transformer ImportsPeripherals+11.5%G4
Neocloud Equity BasketFunding+11.4%G4
Global Equipment BillingsSemicon Upstream+10.9%G4
US DC ConstructionData Center+6.2%G4
AI framework npm downloadsPenetration+5.5%G3
CCC spreadFunding+4.4%G3

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≥ +20% · Penetration (weekly view)

IndicatorClassChangeGrade
OpenRouter TokensPenetration+21.0%G2

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≥ +20% · Supply-Demand (weekly view)

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≥ +20% · Semi & ODM (weekly view)

IndicatorClassChangeGrade
AI-Server Rails + BMCSemi & ODM+36.7%G5

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≥ +20% · Peripherals (weekly view)

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≥ +20% · Data Center (weekly view)

IndicatorClassChangeGrade
N. America DC Under Constr.Data Center+24.8%G4

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≥ +20% · Semicon Upstream (weekly view)

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≥ +20% · Funding (weekly view)

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≥ +20% · All classes (weekly view)

IndicatorClassChangeGrade
AI-Server Rails + BMCSemi & ODM+36.7%G5
N. America DC Under Constr.Data Center+24.8%G4
OpenRouter TokensPenetration+21.0%G2

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Accelerating · Penetration (weekly view)

IndicatorClassChangeGrade
LLM SDK npm downloadsPenetration+14.6%G3
AI framework npm downloadsPenetration+5.5%G3

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Accelerating · Supply-Demand (weekly view)

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Accelerating · Semi & ODM (weekly view)

IndicatorClassChangeGrade
AI-Server Rails + BMCSemi & ODM+36.7%G5
US Server ImportsSemi & ODM+18.4%G4

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Accelerating · Peripherals (weekly view)

IndicatorClassChangeGrade
US Transformer ImportsPeripherals+11.5%G4

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Accelerating · Data Center (weekly view)

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Accelerating · Semicon Upstream (weekly view)

IndicatorClassChangeGrade
Global Equipment BillingsSemicon Upstream+10.9%G4

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Accelerating · Funding (weekly view)

IndicatorClassChangeGrade
CCC spreadFunding+4.4%G3

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Accelerating · All classes (weekly view)

IndicatorClassChangeGrade
AI-Server Rails + BMCSemi & ODM+36.7%G5
US Server ImportsSemi & ODM+18.4%G4
LLM SDK npm downloadsPenetration+14.6%G3
US Transformer ImportsPeripherals+11.5%G4
Global Equipment BillingsSemicon Upstream+10.9%G4
AI framework npm downloadsPenetration+5.5%G3
CCC spreadFunding+4.4%G3

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Rising (slower) · Penetration (weekly view)

IndicatorClassChangeGrade
OpenRouter TokensPenetration+21.0%G2

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Rising (slower) · Supply-Demand (weekly view)

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Rising (slower) · Semi & ODM (weekly view)

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Rising (slower) · Peripherals (weekly view)

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Rising (slower) · Data Center (weekly view)

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US DC ConstructionData Center+6.2%G4

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Rising (slower) · Semicon Upstream (weekly view)

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Rising (slower) · Funding (weekly view)

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Rising (slower) · All classes (weekly view)

IndicatorClassChangeGrade
OpenRouter TokensPenetration+21.0%G2
US DC ConstructionData Center+6.2%G4

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Turned up · Penetration (weekly view)

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Turned up · Supply-Demand (weekly view)

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Turned up · Semi & ODM (weekly view)

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Turned up · Peripherals (weekly view)

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Turned up · Data Center (weekly view)

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N. America DC Under Constr.Data Center+24.8%G4

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Turned up · Semicon Upstream (weekly view)

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Turned up · Funding (weekly view)

IndicatorClassChangeGrade
Neocloud Equity BasketFunding+11.4%G4

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Turned up · All classes (weekly view)

IndicatorClassChangeGrade
N. America DC Under Constr.Data Center+24.8%G4
Neocloud Equity BasketFunding+11.4%G4

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Flat · Penetration (weekly view)

IndicatorClassChangeGrade

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Flat · Supply-Demand (weekly view)

IndicatorClassChangeGrade
DRAM Contract GuidanceSupply-Demand+0.0ppG4
N. America DC VacancySupply-Demand+0.0%G4

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Flat · Semi & ODM (weekly view)

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Flat · Peripherals (weekly view)

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Flat · Data Center (weekly view)

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US hosting jobs (BLS)Data Center−1.7%G2

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Flat · Semicon Upstream (weekly view)

IndicatorClassChangeGrade
Copper PriceSemicon Upstream−0.1%G3
US fab constructionSemicon Upstream−2.1%G3

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Flat · Funding (weekly view)

IndicatorClassChangeGrade
BBB credit spreadFunding+1.0%G3
High-yield spreadFunding−1.5%G3

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Flat · All classes (weekly view)

IndicatorClassChangeGrade
BBB credit spreadFunding+1.0%G3
DRAM Contract GuidanceSupply-Demand+0.0ppG4
N. America DC VacancySupply-Demand+0.0%G4
Copper PriceSemicon Upstream−0.1%G3
High-yield spreadFunding−1.5%G3
US hosting jobs (BLS)Data Center−1.7%G2
US fab constructionSemicon Upstream−2.1%G3

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Turned down · Penetration (weekly view)

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Turned down · Semi & ODM (weekly view)

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Turned down · Semicon Upstream (weekly view)

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Turned down · Funding (weekly view)

IndicatorClassChangeGrade
AI Hyperscaler Bond IssuanceFunding−6.5%G3

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Turned down · All classes (weekly view)

IndicatorClassChangeGrade
AI Hyperscaler Bond IssuanceFunding−6.5%G3

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Falling (narrowing) · Penetration (weekly view)

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Falling (narrowing) · Supply-Demand (weekly view)

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Falling (narrowing) · Semi & ODM (weekly view)

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Falling (narrowing) · Peripherals (weekly view)

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Falling (narrowing) · Data Center (weekly view)

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Falling (narrowing) · Semicon Upstream (weekly view)

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Falling (narrowing) · Funding (weekly view)

IndicatorClassChangeGrade
AI-Infra Debt IssuanceFunding−18.9%G3

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Falling (narrowing) · All classes (weekly view)

IndicatorClassChangeGrade
AI-Infra Debt IssuanceFunding−18.9%G3

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Falling faster · Penetration (weekly view)

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Falling faster · Supply-Demand (weekly view)

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Falling faster · Semi & ODM (weekly view)

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Falling faster · Peripherals (weekly view)

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Falling faster · Data Center (weekly view)

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Falling faster · Semicon Upstream (weekly view)

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Falling faster · Funding (weekly view)

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Falling faster · All classes (weekly view)

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≤ −10% · Penetration (monthly view)

IndicatorClassChangeGrade
Claude co-authored commitsPenetration−17.8%G1

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≤ −10% · Supply-Demand (monthly view)

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≤ −10% · Semi & ODM (monthly view)

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≤ −10% · Peripherals (monthly view)

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≤ −10% · Data Center (monthly view)

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US DC projects blockedData Center−47.7%G2

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≤ −10% · Semicon Upstream (monthly view)

IndicatorClassChangeGrade

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≤ −10% · Funding (monthly view)

IndicatorClassChangeGrade
AI-Infra Debt IssuanceFunding−18.9%G3
Hyperscaler Free Cash FlowFundingsign flipG4

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≤ −10% · All classes (monthly view)

IndicatorClassChangeGrade
Claude co-authored commitsPenetration−17.8%G1
AI-Infra Debt IssuanceFunding−18.9%G3
US DC projects blockedData Center−47.7%G2
Hyperscaler Free Cash FlowFundingsign flipG4

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−10% to −3% · Penetration (monthly view)

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−10% to −3% · Supply-Demand (monthly view)

IndicatorClassChangeGrade
SK hynix Inventory DaysSupply-Demand−7.9%G4

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−10% to −3% · Semi & ODM (monthly view)

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−10% to −3% · Peripherals (monthly view)

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−10% to −3% · Data Center (monthly view)

IndicatorClassChangeGrade
Colo Bookings (DLR+EQIX)Data Center−3.9%G4

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−10% to −3% · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
TW Tool Parts RevenueSemicon Upstream−5.2%G4
Tool Exports (NL+JP+US)Semicon Upstream−6.5%G4
CCL & Substrate Inv. DaysSemicon Upstream−6.8%G4

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−10% to −3% · Funding (monthly view)

IndicatorClassChangeGrade
AI Hyperscaler Bond IssuanceFunding−6.5%G3
Bank C&I lending standardsFunding−8.1ppG3
Bank construction-loan standardsFunding−8.6ppG3

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−10% to −3% · All classes (monthly view)

IndicatorClassChangeGrade
Colo Bookings (DLR+EQIX)Data Center−3.9%G4
TW Tool Parts RevenueSemicon Upstream−5.2%G4
AI Hyperscaler Bond IssuanceFunding−6.5%G3
Tool Exports (NL+JP+US)Semicon Upstream−6.5%G4
CCL & Substrate Inv. DaysSemicon Upstream−6.8%G4
SK hynix Inventory DaysSupply-Demand−7.9%G4
Bank C&I lending standardsFunding−8.1ppG3
Bank construction-loan standardsFunding−8.6ppG3

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Flat (±3%) · Penetration (monthly view)

IndicatorClassChangeGrade
US firms paying for AI (Ramp)Penetration+1.4%G4

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Flat (±3%) · Supply-Demand (monthly view)

IndicatorClassChangeGrade
Grid Equipment PPISupply-Demand+2.8%G5
US PPI hostingSupply-Demand+1.1%G3
DRAM Contract GuidanceSupply-Demand+0.0ppG4
N. America DC VacancySupply-Demand+0.0%G4
US electricity priceSupply-Demand−0.5%G3
Micron Inventory DaysSupply-Demand−1.1%G4
US PPI semiconductorsSupply-Demand−2.7%G3

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Flat (±3%) · Semi & ODM (monthly view)

IndicatorClassChangeGrade
AI Chip ShipmentsSemi & ODM+1.6%G4
US semi output (IP)Semi & ODM+1.5%G3

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Flat (±3%) · Peripherals (monthly view)

IndicatorClassChangeGrade
TW Power & Cooling Rev.Peripherals+1.8%G4

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Flat (±3%) · Data Center (monthly view)

IndicatorClassChangeGrade
ERCOT Large-Load ApprovalsData Center+0.6%G3
US hosting jobs (BLS)Data Center−1.7%G2

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Flat (±3%) · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
US PPI Bare PCBsSemicon Upstream+1.4%G3
Copper PriceSemicon Upstream−0.1%G3
MLCC Inventory DaysSemicon Upstream−1.4%G4
US fab constructionSemicon Upstream−2.1%G3

Click a row for the indicator card.

Flat (±3%) · Funding (monthly view)

IndicatorClassChangeGrade
BBB credit spreadFunding+1.0%G3
High-yield spreadFunding−1.5%G3

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Flat (±3%) · All classes (monthly view)

IndicatorClassChangeGrade
Grid Equipment PPISupply-Demand+2.8%G5
TW Power & Cooling Rev.Peripherals+1.8%G4
AI Chip ShipmentsSemi & ODM+1.6%G4
US semi output (IP)Semi & ODM+1.5%G3
US firms paying for AI (Ramp)Penetration+1.4%G4
US PPI Bare PCBsSemicon Upstream+1.4%G3
US PPI hostingSupply-Demand+1.1%G3
BBB credit spreadFunding+1.0%G3
ERCOT Large-Load ApprovalsData Center+0.6%G3
DRAM Contract GuidanceSupply-Demand+0.0ppG4
N. America DC VacancySupply-Demand+0.0%G4
Copper PriceSemicon Upstream−0.1%G3
US electricity priceSupply-Demand−0.5%G3
Micron Inventory DaysSupply-Demand−1.1%G4
MLCC Inventory DaysSemicon Upstream−1.4%G4
High-yield spreadFunding−1.5%G3
US hosting jobs (BLS)Data Center−1.7%G2
US fab constructionSemicon Upstream−2.1%G3
US PPI semiconductorsSupply-Demand−2.7%G3

Click a row for the indicator card.

+3% to +20% · Penetration (monthly view)

IndicatorClassChangeGrade
US Disclosed TokensPenetration+19.4%G3
LLM SDK npm downloadsPenetration+17.9%G3
Cloud AI RevenuePenetration+17.4%G5
AI framework npm downloadsPenetration+16.6%G3
China GenAI FilingsPenetration+13.8%G5
UK firms using AI (ONS)Penetration+11.6%G4
US Firm AI Use (BTOS)Penetration+7.5%G4
US Worker GenAI UsePenetration+4.1%G3

Click a row for the indicator card.

+3% to +20% · Supply-Demand (monthly view)

IndicatorClassChangeGrade
AI Compute BacklogSupply-Demand+13.9%G4
Storage Device PPISupply-Demand+13.8%G3
Cooling backlog (TT+JCI)Supply-Demand+8.8%G3
ERCOT Reserve MarginSupply-Demand+6.4%G3

Click a row for the indicator card.

+3% to +20% · Semi & ODM (monthly view)

IndicatorClassChangeGrade
GPU/XPU Vendor RevenueSemi & ODM+19.7%G5
US Server ImportsSemi & ODM+18.4%G4
TW ICT Export OrdersSemi & ODM+12.8%G4
TW AI-Server ODM RevenueSemi & ODM+12.3%G3
T-Glass Cloth RevenueSemi & ODM+11.6%G4

Click a row for the indicator card.

+3% to +20% · Peripherals (monthly view)

IndicatorClassChangeGrade
AI connectivity revenuePeripherals+15.4%G4
Power-Gen Equipment Rev.Peripherals+14.2%G4
US Transformer ImportsPeripherals+11.5%G4
TW cable & connector revPeripherals+9.7%G3
TW server-interface chip revPeripherals+3.8%G3

Click a row for the indicator card.

+3% to +20% · Data Center (monthly view)

IndicatorClassChangeGrade
Microsoft New DC LeasesData Center+20.0%G4
VNET committed MWData Center+11.6%G2
US DC ConstructionData Center+6.2%G4
Utility Contracted DC LoadData Center+6.2%G4
Virginia Commercial Power (YoY)Data Center+4.8%G3

Click a row for the indicator card.

+3% to +20% · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
Packaging & Test Tool Rev.Semicon Upstream+19.3%G5
TW MLCC Makers RevenueSemicon Upstream+18.6%G3
TW Packaging Tool RevenueSemicon Upstream+18.5%G4
TW ABF Substrate RevenueSemicon Upstream+16.8%G4
Global Equipment BillingsSemicon Upstream+10.9%G4
Front-End WFE RevenueSemicon Upstream+9.8%G5
Si wafer area (MSI)Semicon Upstream+9.1%G3
Japan Equipment BillingsSemicon Upstream+7.3%G4

Click a row for the indicator card.

+3% to +20% · Funding (monthly view)

IndicatorClassChangeGrade
NVIDIA strategic stakesFunding+18.0%G4
Hyperscaler Total DebtFunding+12.9%G5
Neocloud Equity BasketFunding+11.4%G4
US IT equipment investmentFunding+4.7%G4
CCC spreadFunding+4.4%G3
Capex ÷ operating cashFunding+3.6%G5

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+3% to +20% · All classes (monthly view)

IndicatorClassChangeGrade
Microsoft New DC LeasesData Center+20.0%G4
GPU/XPU Vendor RevenueSemi & ODM+19.7%G5
US Disclosed TokensPenetration+19.4%G3
Packaging & Test Tool Rev.Semicon Upstream+19.3%G5
TW MLCC Makers RevenueSemicon Upstream+18.6%G3
TW Packaging Tool RevenueSemicon Upstream+18.5%G4
US Server ImportsSemi & ODM+18.4%G4
NVIDIA strategic stakesFunding+18.0%G4
LLM SDK npm downloadsPenetration+17.9%G3
Cloud AI RevenuePenetration+17.4%G5
TW ABF Substrate RevenueSemicon Upstream+16.8%G4
AI framework npm downloadsPenetration+16.6%G3
AI connectivity revenuePeripherals+15.4%G4
Power-Gen Equipment Rev.Peripherals+14.2%G4
AI Compute BacklogSupply-Demand+13.9%G4
Storage Device PPISupply-Demand+13.8%G3
China GenAI FilingsPenetration+13.8%G5
Hyperscaler Total DebtFunding+12.9%G5
TW ICT Export OrdersSemi & ODM+12.8%G4
TW AI-Server ODM RevenueSemi & ODM+12.3%G3
VNET committed MWData Center+11.6%G2
UK firms using AI (ONS)Penetration+11.6%G4
T-Glass Cloth RevenueSemi & ODM+11.6%G4
US Transformer ImportsPeripherals+11.5%G4
Neocloud Equity BasketFunding+11.4%G4
Global Equipment BillingsSemicon Upstream+10.9%G4
Front-End WFE RevenueSemicon Upstream+9.8%G5
TW cable & connector revPeripherals+9.7%G3
Si wafer area (MSI)Semicon Upstream+9.1%G3
Cooling backlog (TT+JCI)Supply-Demand+8.8%G3
US Firm AI Use (BTOS)Penetration+7.5%G4
Japan Equipment BillingsSemicon Upstream+7.3%G4
ERCOT Reserve MarginSupply-Demand+6.4%G3
US DC ConstructionData Center+6.2%G4
Utility Contracted DC LoadData Center+6.2%G4
Virginia Commercial Power (YoY)Data Center+4.8%G3
US IT equipment investmentFunding+4.7%G4
CCC spreadFunding+4.4%G3
US Worker GenAI UsePenetration+4.1%G3
TW server-interface chip revPeripherals+3.8%G3
Capex ÷ operating cashFunding+3.6%G5

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≥ +20% · Penetration (monthly view)

IndicatorClassChangeGrade
China AI Lab RevenuePenetration+117.6%G4
OpenRouter TokensPenetration+52.4%G2
EU Firm AI UsePenetration+48.0%G5
METR time horizonPenetration+45.3%G3
China Daily TokensPenetration+40.0%G4
Palantir commercial revPenetration+22.1%G3

Click a row for the indicator card.

≥ +20% · Supply-Demand (monthly view)

IndicatorClassChangeGrade
US Capacity Auction PriceSupply-Demand+118.9%G4
TW Memory Module RevenueSupply-Demand+39.1%G3
NVIDIA Supply CommitmentsSupply-Demand+25.0%G5
Samsung Inventory DaysSupply-Demand+21.9%G2

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≥ +20% · Semi & ODM (monthly view)

IndicatorClassChangeGrade
TW ASIC Design RevenueSemi & ODM+82.6%G3
Memory Maker RevenueSemi & ODM+55.4%G4
Korea Chip Exports (10-day)Semi & ODM+52.3%G3
TW memory maker revSemi & ODM+37.6%G3
AI-Server Rails + BMCSemi & ODM+36.7%G5
TSMC HPC RevenueSemi & ODM+25.0%G5
TW Electronics OrdersSemi & ODM+20.4%G4

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≥ +20% · Peripherals (monthly view)

IndicatorClassChangeGrade
Accton Switch RevenuePeripherals+40.6%G4
TW chassis & rack revPeripherals+35.5%G2
DC Networking RevenuePeripherals+32.3%G4
Optical Module RevenuePeripherals+22.0%G4
TW optical parts revPeripherals+21.3%G3

Click a row for the indicator card.

≥ +20% · Data Center (monthly view)

IndicatorClassChangeGrade
NEXTDC Contracted MWData Center+77.7%G2
Colo MW Leased (IRM+APLD)Data Center+56.1%G2
N. America DC Under Constr.Data Center+24.8%G4

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≥ +20% · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
TW CCL Makers RevenueSemicon Upstream+42.4%G4
Foundry & Memory CapexSemicon Upstream+38.4%G4
Tool Shipments → TaiwanSemicon Upstream+37.8%G2
AI PCB & Inputs RevenueSemicon Upstream+27.2%G3
Tool Sub-Supplier RevenueSemicon Upstream+21.0%G4

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≥ +20% · Funding (monthly view)

IndicatorClassChangeGrade
Neocloud equity raisedFunding+346.6%G3
AI Venture FundingFunding+247.7%G3
Signed Leases Not StartedFunding+34.2%G4
Hyperscaler CapexFunding+22.1%G5

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≥ +20% · All classes (monthly view)

IndicatorClassChangeGrade
Neocloud equity raisedFunding+346.6%G3
AI Venture FundingFunding+247.7%G3
US Capacity Auction PriceSupply-Demand+118.9%G4
China AI Lab RevenuePenetration+117.6%G4
TW ASIC Design RevenueSemi & ODM+82.6%G3
NEXTDC Contracted MWData Center+77.7%G2
Colo MW Leased (IRM+APLD)Data Center+56.1%G2
Memory Maker RevenueSemi & ODM+55.4%G4
OpenRouter TokensPenetration+52.4%G2
Korea Chip Exports (10-day)Semi & ODM+52.3%G3
EU Firm AI UsePenetration+48.0%G5
METR time horizonPenetration+45.3%G3
TW CCL Makers RevenueSemicon Upstream+42.4%G4
Accton Switch RevenuePeripherals+40.6%G4
China Daily TokensPenetration+40.0%G4
TW Memory Module RevenueSupply-Demand+39.1%G3
Foundry & Memory CapexSemicon Upstream+38.4%G4
Tool Shipments → TaiwanSemicon Upstream+37.8%G2
TW memory maker revSemi & ODM+37.6%G3
AI-Server Rails + BMCSemi & ODM+36.7%G5
TW chassis & rack revPeripherals+35.5%G2
Signed Leases Not StartedFunding+34.2%G4
DC Networking RevenuePeripherals+32.3%G4
AI PCB & Inputs RevenueSemicon Upstream+27.2%G3
TSMC HPC RevenueSemi & ODM+25.0%G5
NVIDIA Supply CommitmentsSupply-Demand+25.0%G5
N. America DC Under Constr.Data Center+24.8%G4
Hyperscaler CapexFunding+22.1%G5
Palantir commercial revPenetration+22.1%G3
Optical Module RevenuePeripherals+22.0%G4
Samsung Inventory DaysSupply-Demand+21.9%G2
TW optical parts revPeripherals+21.3%G3
Tool Sub-Supplier RevenueSemicon Upstream+21.0%G4
TW Electronics OrdersSemi & ODM+20.4%G4

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Accelerating · Penetration (monthly view)

IndicatorClassChangeGrade
OpenRouter TokensPenetration+52.4%G2
Palantir commercial revPenetration+22.1%G3
LLM SDK npm downloadsPenetration+17.9%G3
Cloud AI RevenuePenetration+17.4%G5
China GenAI FilingsPenetration+13.8%G5
UK firms using AI (ONS)Penetration+11.6%G4
US Firm AI Use (BTOS)Penetration+7.5%G4

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Accelerating · Supply-Demand (monthly view)

IndicatorClassChangeGrade
Samsung Inventory DaysSupply-Demand+21.9%G2

Click a row for the indicator card.

Accelerating · Semi & ODM (monthly view)

IndicatorClassChangeGrade
TW memory maker revSemi & ODM+37.6%G3
AI-Server Rails + BMCSemi & ODM+36.7%G5
TSMC HPC RevenueSemi & ODM+25.0%G5
TW Electronics OrdersSemi & ODM+20.4%G4
US Server ImportsSemi & ODM+18.4%G4
TW ICT Export OrdersSemi & ODM+12.8%G4
T-Glass Cloth RevenueSemi & ODM+11.6%G4

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Accelerating · Peripherals (monthly view)

IndicatorClassChangeGrade
Accton Switch RevenuePeripherals+40.6%G4
DC Networking RevenuePeripherals+32.3%G4
TW optical parts revPeripherals+21.3%G3
AI connectivity revenuePeripherals+15.4%G4
US Transformer ImportsPeripherals+11.5%G4
TW cable & connector revPeripherals+9.7%G3
TW server-interface chip revPeripherals+3.8%G3

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Accelerating · Data Center (monthly view)

IndicatorClassChangeGrade
NEXTDC Contracted MWData Center+77.7%G2
VNET committed MWData Center+11.6%G2

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Accelerating · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
TW CCL Makers RevenueSemicon Upstream+42.4%G4
AI PCB & Inputs RevenueSemicon Upstream+27.2%G3
Tool Sub-Supplier RevenueSemicon Upstream+21.0%G4
Packaging & Test Tool Rev.Semicon Upstream+19.3%G5
TW MLCC Makers RevenueSemicon Upstream+18.6%G3
TW Packaging Tool RevenueSemicon Upstream+18.5%G4
TW ABF Substrate RevenueSemicon Upstream+16.8%G4
Global Equipment BillingsSemicon Upstream+10.9%G4
Front-End WFE RevenueSemicon Upstream+9.8%G5
Japan Equipment BillingsSemicon Upstream+7.3%G4

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Accelerating · Funding (monthly view)

IndicatorClassChangeGrade
AI Venture FundingFunding+247.7%G3
Hyperscaler CapexFunding+22.1%G5
CCC spreadFunding+4.4%G3

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Accelerating · All classes (monthly view)

IndicatorClassChangeGrade
AI Venture FundingFunding+247.7%G3
NEXTDC Contracted MWData Center+77.7%G2
OpenRouter TokensPenetration+52.4%G2
TW CCL Makers RevenueSemicon Upstream+42.4%G4
Accton Switch RevenuePeripherals+40.6%G4
TW memory maker revSemi & ODM+37.6%G3
AI-Server Rails + BMCSemi & ODM+36.7%G5
DC Networking RevenuePeripherals+32.3%G4
AI PCB & Inputs RevenueSemicon Upstream+27.2%G3
TSMC HPC RevenueSemi & ODM+25.0%G5
Hyperscaler CapexFunding+22.1%G5
Palantir commercial revPenetration+22.1%G3
Samsung Inventory DaysSupply-Demand+21.9%G2
TW optical parts revPeripherals+21.3%G3
Tool Sub-Supplier RevenueSemicon Upstream+21.0%G4
TW Electronics OrdersSemi & ODM+20.4%G4
Packaging & Test Tool Rev.Semicon Upstream+19.3%G5
TW MLCC Makers RevenueSemicon Upstream+18.6%G3
TW Packaging Tool RevenueSemicon Upstream+18.5%G4
US Server ImportsSemi & ODM+18.4%G4
LLM SDK npm downloadsPenetration+17.9%G3
Cloud AI RevenuePenetration+17.4%G5
TW ABF Substrate RevenueSemicon Upstream+16.8%G4
AI connectivity revenuePeripherals+15.4%G4
China GenAI FilingsPenetration+13.8%G5
TW ICT Export OrdersSemi & ODM+12.8%G4
VNET committed MWData Center+11.6%G2
UK firms using AI (ONS)Penetration+11.6%G4
T-Glass Cloth RevenueSemi & ODM+11.6%G4
US Transformer ImportsPeripherals+11.5%G4
Global Equipment BillingsSemicon Upstream+10.9%G4
Front-End WFE RevenueSemicon Upstream+9.8%G5
TW cable & connector revPeripherals+9.7%G3
US Firm AI Use (BTOS)Penetration+7.5%G4
Japan Equipment BillingsSemicon Upstream+7.3%G4
CCC spreadFunding+4.4%G3
TW server-interface chip revPeripherals+3.8%G3

Click a row for the indicator card.

Rising (slower) · Penetration (monthly view)

IndicatorClassChangeGrade
China AI Lab RevenuePenetration+117.6%G4
EU Firm AI UsePenetration+48.0%G5
METR time horizonPenetration+45.3%G3
China Daily TokensPenetration+40.0%G4
US Disclosed TokensPenetration+19.4%G3
AI framework npm downloadsPenetration+16.6%G3
US Worker GenAI UsePenetration+4.1%G3

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Rising (slower) · Supply-Demand (monthly view)

IndicatorClassChangeGrade
US Capacity Auction PriceSupply-Demand+118.9%G4
TW Memory Module RevenueSupply-Demand+39.1%G3
NVIDIA Supply CommitmentsSupply-Demand+25.0%G5
AI Compute BacklogSupply-Demand+13.9%G4
Storage Device PPISupply-Demand+13.8%G3
Cooling backlog (TT+JCI)Supply-Demand+8.8%G3

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Rising (slower) · Semi & ODM (monthly view)

IndicatorClassChangeGrade
Memory Maker RevenueSemi & ODM+55.4%G4
Korea Chip Exports (10-day)Semi & ODM+52.3%G3
GPU/XPU Vendor RevenueSemi & ODM+19.7%G5
TW AI-Server ODM RevenueSemi & ODM+12.3%G3

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Rising (slower) · Peripherals (monthly view)

IndicatorClassChangeGrade
Optical Module RevenuePeripherals+22.0%G4

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Rising (slower) · Data Center (monthly view)

IndicatorClassChangeGrade
Colo MW Leased (IRM+APLD)Data Center+56.1%G2
Microsoft New DC LeasesData Center+20.0%G4
US DC ConstructionData Center+6.2%G4
Utility Contracted DC LoadData Center+6.2%G4
Virginia Commercial Power (YoY)Data Center+4.8%G3

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Rising (slower) · Semicon Upstream (monthly view)

IndicatorClassChangeGrade

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Rising (slower) · Funding (monthly view)

IndicatorClassChangeGrade
Neocloud equity raisedFunding+346.6%G3
Signed Leases Not StartedFunding+34.2%G4
NVIDIA strategic stakesFunding+18.0%G4
Hyperscaler Total DebtFunding+12.9%G5
US IT equipment investmentFunding+4.7%G4
Capex ÷ operating cashFunding+3.6%G5

Click a row for the indicator card.

Rising (slower) · All classes (monthly view)

IndicatorClassChangeGrade
Neocloud equity raisedFunding+346.6%G3
US Capacity Auction PriceSupply-Demand+118.9%G4
China AI Lab RevenuePenetration+117.6%G4
Colo MW Leased (IRM+APLD)Data Center+56.1%G2
Memory Maker RevenueSemi & ODM+55.4%G4
Korea Chip Exports (10-day)Semi & ODM+52.3%G3
EU Firm AI UsePenetration+48.0%G5
METR time horizonPenetration+45.3%G3
China Daily TokensPenetration+40.0%G4
TW Memory Module RevenueSupply-Demand+39.1%G3
Signed Leases Not StartedFunding+34.2%G4
NVIDIA Supply CommitmentsSupply-Demand+25.0%G5
Optical Module RevenuePeripherals+22.0%G4
Microsoft New DC LeasesData Center+20.0%G4
GPU/XPU Vendor RevenueSemi & ODM+19.7%G5
US Disclosed TokensPenetration+19.4%G3
NVIDIA strategic stakesFunding+18.0%G4
AI framework npm downloadsPenetration+16.6%G3
AI Compute BacklogSupply-Demand+13.9%G4
Storage Device PPISupply-Demand+13.8%G3
Hyperscaler Total DebtFunding+12.9%G5
TW AI-Server ODM RevenueSemi & ODM+12.3%G3
Cooling backlog (TT+JCI)Supply-Demand+8.8%G3
US DC ConstructionData Center+6.2%G4
Utility Contracted DC LoadData Center+6.2%G4
Virginia Commercial Power (YoY)Data Center+4.8%G3
US IT equipment investmentFunding+4.7%G4
US Worker GenAI UsePenetration+4.1%G3
Capex ÷ operating cashFunding+3.6%G5

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Turned up · Penetration (monthly view)

IndicatorClassChangeGrade

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Turned up · Supply-Demand (monthly view)

IndicatorClassChangeGrade
ERCOT Reserve MarginSupply-Demand+6.4%G3

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Turned up · Semi & ODM (monthly view)

IndicatorClassChangeGrade
TW ASIC Design RevenueSemi & ODM+82.6%G3

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Turned up · Peripherals (monthly view)

IndicatorClassChangeGrade
TW chassis & rack revPeripherals+35.5%G2
Power-Gen Equipment Rev.Peripherals+14.2%G4

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Turned up · Data Center (monthly view)

IndicatorClassChangeGrade
N. America DC Under Constr.Data Center+24.8%G4

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Turned up · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
Foundry & Memory CapexSemicon Upstream+38.4%G4
Tool Shipments → TaiwanSemicon Upstream+37.8%G2
Si wafer area (MSI)Semicon Upstream+9.1%G3

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Turned up · Funding (monthly view)

IndicatorClassChangeGrade
Neocloud Equity BasketFunding+11.4%G4

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Turned up · All classes (monthly view)

IndicatorClassChangeGrade
TW ASIC Design RevenueSemi & ODM+82.6%G3
Foundry & Memory CapexSemicon Upstream+38.4%G4
Tool Shipments → TaiwanSemicon Upstream+37.8%G2
TW chassis & rack revPeripherals+35.5%G2
N. America DC Under Constr.Data Center+24.8%G4
Power-Gen Equipment Rev.Peripherals+14.2%G4
Neocloud Equity BasketFunding+11.4%G4
Si wafer area (MSI)Semicon Upstream+9.1%G3
ERCOT Reserve MarginSupply-Demand+6.4%G3

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Flat · Penetration (monthly view)

IndicatorClassChangeGrade
US firms paying for AI (Ramp)Penetration+1.4%G4

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Flat · Supply-Demand (monthly view)

IndicatorClassChangeGrade
Grid Equipment PPISupply-Demand+2.8%G5
US PPI hostingSupply-Demand+1.1%G3
DRAM Contract GuidanceSupply-Demand+0.0ppG4
N. America DC VacancySupply-Demand+0.0%G4
US electricity priceSupply-Demand−0.5%G3
Micron Inventory DaysSupply-Demand−1.1%G4
US PPI semiconductorsSupply-Demand−2.7%G3

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Flat · Semi & ODM (monthly view)

IndicatorClassChangeGrade
AI Chip ShipmentsSemi & ODM+1.6%G4
US semi output (IP)Semi & ODM+1.5%G3

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Flat · Peripherals (monthly view)

IndicatorClassChangeGrade
TW Power & Cooling Rev.Peripherals+1.8%G4

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Flat · Data Center (monthly view)

IndicatorClassChangeGrade
ERCOT Large-Load ApprovalsData Center+0.6%G3
US hosting jobs (BLS)Data Center−1.7%G2

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Flat · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
US PPI Bare PCBsSemicon Upstream+1.4%G3
Copper PriceSemicon Upstream−0.1%G3
MLCC Inventory DaysSemicon Upstream−1.4%G4
US fab constructionSemicon Upstream−2.1%G3

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Flat · Funding (monthly view)

IndicatorClassChangeGrade
BBB credit spreadFunding+1.0%G3
High-yield spreadFunding−1.5%G3

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Flat · All classes (monthly view)

IndicatorClassChangeGrade
Grid Equipment PPISupply-Demand+2.8%G5
TW Power & Cooling Rev.Peripherals+1.8%G4
AI Chip ShipmentsSemi & ODM+1.6%G4
US semi output (IP)Semi & ODM+1.5%G3
US firms paying for AI (Ramp)Penetration+1.4%G4
US PPI Bare PCBsSemicon Upstream+1.4%G3
US PPI hostingSupply-Demand+1.1%G3
BBB credit spreadFunding+1.0%G3
ERCOT Large-Load ApprovalsData Center+0.6%G3
DRAM Contract GuidanceSupply-Demand+0.0ppG4
N. America DC VacancySupply-Demand+0.0%G4
Copper PriceSemicon Upstream−0.1%G3
US electricity priceSupply-Demand−0.5%G3
Micron Inventory DaysSupply-Demand−1.1%G4
MLCC Inventory DaysSemicon Upstream−1.4%G4
High-yield spreadFunding−1.5%G3
US hosting jobs (BLS)Data Center−1.7%G2
US fab constructionSemicon Upstream−2.1%G3
US PPI semiconductorsSupply-Demand−2.7%G3

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Turned down · Penetration (monthly view)

IndicatorClassChangeGrade
Claude co-authored commitsPenetration−17.8%G1

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Turned down · Supply-Demand (monthly view)

IndicatorClassChangeGrade
SK hynix Inventory DaysSupply-Demand−7.9%G4

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Turned down · Semi & ODM (monthly view)

IndicatorClassChangeGrade

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Turned down · Peripherals (monthly view)

IndicatorClassChangeGrade

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Turned down · Data Center (monthly view)

IndicatorClassChangeGrade
Colo Bookings (DLR+EQIX)Data Center−3.9%G4
US DC projects blockedData Center−47.7%G2

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Turned down · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
TW Tool Parts RevenueSemicon Upstream−5.2%G4

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Turned down · Funding (monthly view)

IndicatorClassChangeGrade
AI Hyperscaler Bond IssuanceFunding−6.5%G3
Bank construction-loan standardsFunding−8.6ppG3

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Turned down · All classes (monthly view)

IndicatorClassChangeGrade
Colo Bookings (DLR+EQIX)Data Center−3.9%G4
TW Tool Parts RevenueSemicon Upstream−5.2%G4
AI Hyperscaler Bond IssuanceFunding−6.5%G3
SK hynix Inventory DaysSupply-Demand−7.9%G4
Bank construction-loan standardsFunding−8.6ppG3
Claude co-authored commitsPenetration−17.8%G1
US DC projects blockedData Center−47.7%G2

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Falling (narrowing) · Penetration (monthly view)

IndicatorClassChangeGrade

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Falling (narrowing) · Supply-Demand (monthly view)

IndicatorClassChangeGrade

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Falling (narrowing) · Semi & ODM (monthly view)

IndicatorClassChangeGrade

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Falling (narrowing) · Peripherals (monthly view)

IndicatorClassChangeGrade

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Falling (narrowing) · Data Center (monthly view)

IndicatorClassChangeGrade

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Falling (narrowing) · Semicon Upstream (monthly view)

IndicatorClassChangeGrade

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Falling (narrowing) · Funding (monthly view)

IndicatorClassChangeGrade
AI-Infra Debt IssuanceFunding−18.9%G3

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Falling (narrowing) · All classes (monthly view)

IndicatorClassChangeGrade
AI-Infra Debt IssuanceFunding−18.9%G3

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Falling faster · Penetration (monthly view)

IndicatorClassChangeGrade

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Falling faster · Supply-Demand (monthly view)

IndicatorClassChangeGrade

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Falling faster · Semi & ODM (monthly view)

IndicatorClassChangeGrade

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Falling faster · Peripherals (monthly view)

IndicatorClassChangeGrade

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Falling faster · Data Center (monthly view)

IndicatorClassChangeGrade

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Falling faster · Semicon Upstream (monthly view)

IndicatorClassChangeGrade
Tool Exports (NL+JP+US)Semicon Upstream−6.5%G4
CCL & Substrate Inv. DaysSemicon Upstream−6.8%G4

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Falling faster · Funding (monthly view)

IndicatorClassChangeGrade
Bank C&I lending standardsFunding−8.1ppG3
Hyperscaler Free Cash FlowFundingsign flipG4

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Falling faster · All classes (monthly view)

IndicatorClassChangeGrade
Tool Exports (NL+JP+US)Semicon Upstream−6.5%G4
CCL & Substrate Inv. DaysSemicon Upstream−6.8%G4
Bank C&I lending standardsFunding−8.1ppG3
Hyperscaler Free Cash FlowFundingsign flipG4

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Semi equipment · vs last week

Equal-weighted average −0.7%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
KLAKLAC+5.7%2026-09-04
Lam ResearchLRCX+1.9%2026-09-04
ASMLASML+1.1%2026-09-04
BE SemiconductorBESI.AS−0.4%2026-09-04
Applied MaterialsAMAT−1.5%2026-09-04
Tokyo Electron8035.T−5.2%2026-09-04
Advantest6857.T−6.2%2026-09-04

Foundry & packaging · vs last week

Equal-weighted average −0.2%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
TSMCTSM+2.7%2026-09-04
AmkorAMKR−0.0%2026-09-04
ASE TechnologyASX−0.7%2026-09-04
KYEC2449.TW−3.0%2026-09-04

Memory · vs last week

Equal-weighted average +6.3%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
SandiskSNDK+17.2%2026-09-04
MicronMU+9.0%2026-09-04
SK hynix000660.KS−0.4%2026-09-04
Samsung Electronics005930.KS−0.6%2026-09-04

AI chips · vs last week

Equal-weighted average +3.9%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
MediaTek2454.TW+10.8%2026-09-04
NVIDIANVDA+5.9%2026-09-04
MarvellMRVL+3.2%2026-09-04
AMDAMD+2.6%2026-09-04
BroadcomAVGO−3.0%2026-09-04

Networking & optics · vs last week

Equal-weighted average −3.6%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Astera LabsALAB+7.2%2026-09-04
AmphenolAPH+5.0%2026-09-04
CorningGLW+3.8%2026-09-04
CoherentCOHR+1.0%2026-09-04
AristaANET−0.8%2026-09-04
LumentumLITE−1.5%2026-09-04
Innolight300308.SZ−5.2%2026-09-04
CienaCIEN−15.2%2026-09-04
CredoCRDO−26.7%2026-09-04

Servers & ODM · vs last week

Equal-weighted average +7.0%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
DellDELL+14.9%2026-09-04
Wistron3231.TW+11.2%2026-09-04
Super MicroSMCI+6.8%2026-09-04
Wiwynn6669.TW+6.3%2026-09-04
CelesticaCLS+4.6%2026-09-04
Quanta2382.TW+3.8%2026-09-04
Hon Hai2317.TW+1.2%2026-09-04

Power & cooling · vs last week

Equal-weighted average +1.0%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
ModineMOD+9.6%2026-09-04
VertivVRT+9.1%2026-09-04
GE VernovaGEV+3.3%2026-09-04
EatonETN+2.0%2026-09-04
Delta Electronics2308.TW−0.3%2026-09-04
Schneider ElectricSU.PA−4.6%2026-09-04
HD Hyundai Electric267260.KS−12.3%2026-09-04

Data centers & neoclouds · vs last week

Equal-weighted average +6.4%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
IRENIREN+26.0%2026-09-04
NebiusNBIS+8.2%2026-09-04
CoreWeaveCRWV+6.1%2026-09-04
Applied DigitalAPLD+4.1%2026-09-04
Digital RealtyDLR+1.6%2026-09-04
Iron MountainIRM−0.5%2026-09-04
EquinixEQIX−0.8%2026-09-04

Hyperscalers · vs last week

Equal-weighted average +0.8%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
MetaMETA+6.7%2026-09-04
OracleORCL+5.3%2026-09-04
AlphabetGOOGL−2.3%2026-09-04
MicrosoftMSFT−2.7%2026-09-04
AmazonAMZN−3.0%2026-09-04

AI software & apps · vs last week

Equal-weighted average −3.2%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
SnowflakeSNOW+2.8%2026-09-04
SalesforceCRM+1.3%2026-09-04
AppLovinAPP+0.9%2026-09-04
ServiceNowNOW−2.4%2026-09-04
PalantirPLTR−6.4%2026-09-04
AdobeADBE−8.6%2026-09-04
DatadogDDOG−10.1%2026-09-04

Semi equipment · vs last month

Equal-weighted average −5.1%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
ASMLASML+2.2%2026-09-04
Lam ResearchLRCX+0.1%2026-09-04
Advantest6857.T−1.9%2026-09-04
KLAKLAC−3.6%2026-09-04
BE SemiconductorBESI.AS−8.7%2026-09-04
Tokyo Electron8035.T−8.9%2026-09-04
Applied MaterialsAMAT−14.8%2026-09-04

Foundry & packaging · vs last month

Equal-weighted average +0.1%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
KYEC2449.TW+6.1%2026-09-04
TSMCTSM+3.6%2026-09-04
ASE TechnologyASX+2.0%2026-09-04
AmkorAMKR−11.1%2026-09-04

Memory · vs last month

Equal-weighted average +11.3%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
SandiskSNDK+28.8%2026-09-04
MicronMU+13.8%2026-09-04
Samsung Electronics005930.KS+3.9%2026-09-04
SK hynix000660.KS−1.2%2026-09-04

AI chips · vs last month

Equal-weighted average +1.2%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
MediaTek2454.TW+10.4%2026-09-04
MarvellMRVL+5.9%2026-09-04
NVIDIANVDA+5.1%2026-09-04
AMDAMD−0.9%2026-09-04
BroadcomAVGO−14.4%2026-09-04

Networking & optics · vs last month

Equal-weighted average −8.5%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
LumentumLITE+6.7%2026-09-04
CorningGLW−1.3%2026-09-04
AristaANET−1.8%2026-09-04
Astera LabsALAB−2.5%2026-09-04
AmphenolAPH−3.9%2026-09-04
Innolight300308.SZ−14.1%2026-09-04
CoherentCOHR−14.1%2026-09-04
CienaCIEN−21.5%2026-09-04
CredoCRDO−24.1%2026-09-04

Servers & ODM · vs last month

Equal-weighted average +9.9%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Super MicroSMCI+30.6%2026-09-04
Wiwynn6669.TW+23.9%2026-09-04
Quanta2382.TW+13.5%2026-09-04
DellDELL+13.3%2026-09-04
Wistron3231.TW+2.6%2026-09-04
Hon Hai2317.TW−1.0%2026-09-04
CelesticaCLS−13.9%2026-09-04

Power & cooling · vs last month

Equal-weighted average −2.2%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Delta Electronics2308.TW+10.6%2026-09-04
VertivVRT+0.9%2026-09-04
ModineMOD+0.0%2026-09-04
Schneider ElectricSU.PA−4.1%2026-09-04
HD Hyundai Electric267260.KS−7.4%2026-09-04
GE VernovaGEV−7.5%2026-09-04
EatonETN−7.9%2026-09-04

Data centers & neoclouds · vs last month

Equal-weighted average −1.0%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
IRENIREN+14.9%2026-09-04
NebiusNBIS+3.4%2026-09-04
CoreWeaveCRWV−0.6%2026-09-04
EquinixEQIX−1.4%2026-09-04
Digital RealtyDLR−3.4%2026-09-04
Iron MountainIRM−8.1%2026-09-04
Applied DigitalAPLD−11.7%2026-09-04

Hyperscalers · vs last month

Equal-weighted average +1.1%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
OracleORCL+10.0%2026-09-04
MetaMETA+4.8%2026-09-04
MicrosoftMSFT+2.7%2026-09-04
AmazonAMZN−5.2%2026-09-04
AlphabetGOOGL−6.6%2026-09-04

AI software & apps · vs last month

Equal-weighted average +3.7%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
SalesforceCRM+34.3%2026-09-04
ServiceNowNOW+20.5%2026-09-04
PalantirPLTR+10.0%2026-09-04
SnowflakeSNOW+6.4%2026-09-04
AdobeADBE+2.8%2026-09-04
AppLovinAPP−23.3%2026-09-04
DatadogDDOG−24.8%2026-09-04

Semi equipment · vs last quarter

Equal-weighted average −1.6%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Advantest6857.T+23.6%2026-09-04
ASMLASML+4.6%2026-09-04
Lam ResearchLRCX+1.5%2026-09-04
Applied MaterialsAMAT+0.5%2026-09-04
KLAKLAC−3.7%2026-09-04
Tokyo Electron8035.T−10.3%2026-09-04
BE SemiconductorBESI.AS−27.5%2026-09-04

Foundry & packaging · vs last quarter

Equal-weighted average −5.6%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
ASE TechnologyASX+11.3%2026-09-04
TSMCTSM+3.6%2026-09-04
KYEC2449.TW−10.8%2026-09-04
AmkorAMKR−26.3%2026-09-04

Memory · vs last quarter

Equal-weighted average −3.4%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
MicronMU+17.7%2026-09-04
SandiskSNDK+11.6%2026-09-04
SK hynix000660.KS−20.4%2026-09-04
Samsung Electronics005930.KS−22.3%2026-09-04

AI chips · vs last quarter

Equal-weighted average −0.8%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
NVIDIANVDA+12.3%2026-09-04
MediaTek2454.TW+3.3%2026-09-04
AMDAMD+2.4%2026-09-04
BroadcomAVGO−7.1%2026-09-04
MarvellMRVL−15.1%2026-09-04

Networking & optics · vs last quarter

Equal-weighted average −8.4%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
AristaANET+25.6%2026-09-04
AmphenolAPH+19.5%2026-09-04
LumentumLITE+2.0%2026-09-04
Astera LabsALAB−2.1%2026-09-04
CorningGLW−12.9%2026-09-04
CredoCRDO−17.6%2026-09-04
CoherentCOHR−25.2%2026-09-04
Innolight300308.SZ−31.0%2026-09-04
CienaCIEN−34.2%2026-09-04

Servers & ODM · vs last quarter

Equal-weighted average +8.0%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Wiwynn6669.TW+39.1%2026-09-04
DellDELL+33.1%2026-09-04
Wistron3231.TW+20.0%2026-09-04
Super MicroSMCI−4.9%2026-09-04
Hon Hai2317.TW−7.3%2026-09-04
Quanta2382.TW−7.9%2026-09-04
CelesticaCLS−16.0%2026-09-04

Power & cooling · vs last quarter

Equal-weighted average −9.9%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Schneider ElectricSU.PA+7.0%2026-09-04
EatonETN+4.0%2026-09-04
GE VernovaGEV+0.9%2026-09-04
VertivVRT−6.6%2026-09-04
Delta Electronics2308.TW−20.2%2026-09-04
HD Hyundai Electric267260.KS−25.2%2026-09-04
ModineMOD−29.6%2026-09-04

Data centers & neoclouds · vs last quarter

Equal-weighted average −10.1%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Digital RealtyDLR+1.5%2026-09-04
NebiusNBIS−0.6%2026-09-04
EquinixEQIX−3.7%2026-09-04
Iron MountainIRM−5.6%2026-09-04
CoreWeaveCRWV−11.0%2026-09-04
IRENIREN−17.8%2026-09-04
Applied DigitalAPLD−33.4%2026-09-04

Hyperscalers · vs last quarter

Equal-weighted average −0.8%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
MicrosoftMSFT+20.2%2026-09-04
AmazonAMZN+5.1%2026-09-04
MetaMETA+4.1%2026-09-04
AlphabetGOOGL−8.0%2026-09-04
OracleORCL−25.4%2026-09-04

AI software & apps · vs last quarter

Equal-weighted average +12.9%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
SnowflakeSNOW+41.5%2026-09-04
SalesforceCRM+40.0%2026-09-04
PalantirPLTR+28.6%2026-09-04
ServiceNowNOW+25.6%2026-09-04
AdobeADBE+6.0%2026-09-04
DatadogDDOG−9.0%2026-09-04
AppLovinAPP−42.5%2026-09-04

Semi equipment · YTD (vs 31-Dec)

Equal-weighted average +63.6%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Lam ResearchLRCX+80.1%2026-09-04
Applied MaterialsAMAT+77.6%2026-09-04
Advantest6857.T+68.8%2026-09-04
ASMLASML+61.1%2026-09-04
Tokyo Electron8035.T+56.8%2026-09-04
KLAKLAC+53.3%2026-09-04
BE SemiconductorBESI.AS+48.0%2026-09-04

Foundry & packaging · YTD (vs 31-Dec)

Equal-weighted average +52.6%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
ASE TechnologyASX+135.3%2026-09-04
TSMCTSM+41.9%2026-09-04
AmkorAMKR+21.6%2026-09-04
KYEC2449.TW+11.6%2026-09-04

Memory · YTD (vs 31-Dec)

Equal-weighted average +289.2%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
SandiskSNDK+633.0%2026-09-04
MicronMU+256.4%2026-09-04
SK hynix000660.KS+153.6%2026-09-04
Samsung Electronics005930.KS+113.8%2026-09-04

AI chips · YTD (vs 31-Dec)

Equal-weighted average +106.1%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
MediaTek2454.TW+216.6%2026-09-04
MarvellMRVL+163.4%2026-09-04
AMDAMD+123.0%2026-09-04
NVIDIANVDA+23.7%2026-09-04
BroadcomAVGO+3.8%2026-09-04

Networking & optics · YTD (vs 31-Dec)

Equal-weighted average +57.3%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
LumentumLITE+139.1%2026-09-04
Astera LabsALAB+86.6%2026-09-04
CorningGLW+77.2%2026-09-04
CoherentCOHR+52.7%2026-09-04
AristaANET+47.9%2026-09-04
CienaCIEN+37.3%2026-09-04
Innolight300308.SZ+33.6%2026-09-04
AmphenolAPH+22.9%2026-09-04
CredoCRDO+18.5%2026-09-04

Servers & ODM · YTD (vs 31-Dec)

Equal-weighted average +74.2%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
DellDELL+320.2%2026-09-04
Wiwynn6669.TW+75.5%2026-09-04
Wistron3231.TW+36.4%2026-09-04
Super MicroSMCI+35.3%2026-09-04
Quanta2382.TW+32.3%2026-09-04
Hon Hai2317.TW+14.4%2026-09-04
CelesticaCLS+5.7%2026-09-04

Power & cooling · YTD (vs 31-Dec)

Equal-weighted average +43.1%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
Delta Electronics2308.TW+90.5%2026-09-04
VertivVRT+73.2%2026-09-04
ModineMOD+45.8%2026-09-04
GE VernovaGEV+44.4%2026-09-04
EatonETN+30.1%2026-09-04
Schneider ElectricSU.PA+24.5%2026-09-04
HD Hyundai Electric267260.KS−7.1%2026-09-04

Data centers & neoclouds · YTD (vs 31-Dec)

Equal-weighted average +46.4%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
NebiusNBIS+170.5%2026-09-04
Iron MountainIRM+43.0%2026-09-04
EquinixEQIX+37.3%2026-09-04
CoreWeaveCRWV+24.8%2026-09-04
Digital RealtyDLR+23.4%2026-09-04
IRENIREN+18.3%2026-09-04
Applied DigitalAPLD+7.5%2026-09-04

Hyperscalers · YTD (vs 31-Dec)

Equal-weighted average +0.0%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
AmazonAMZN+12.0%2026-09-04
AlphabetGOOGL+8.3%2026-09-04
MicrosoftMSFT+4.0%2026-09-04
MetaMETA−6.4%2026-09-04
OracleORCL−17.8%2026-09-04

AI software & apps · YTD (vs 31-Dec)

Equal-weighted average +3.2%; each stock's own last close on or before 2026-09-06.

CompanyTickerChangeLast close
DatadogDDOG+56.6%2026-09-04
SnowflakeSNOW+53.7%2026-09-04
SalesforceCRM−1.6%2026-09-04
PalantirPLTR−1.9%2026-09-04
ServiceNowNOW−7.8%2026-09-04
AdobeADBE−23.9%2026-09-04
AppLovinAPP−52.4%2026-09-04